Faruqui; Danish

Patent Applications and Registrations

Patent applications and USPTO patent grants for Faruqui; Danish.The latest application filed is for "organic thin film passivation of metal interconnections".

Company Profile

0.7.13

Faruqui; Danish - Chandler AZ

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Laser die backside film removal for integrated circuit (IC) packaging Grant 9,859,248 - Faruqui , et al. January 2, 2	2018-01-02
Organic thin film passivation of metal interconnections Grant 9,824,991 - Aleksov , et al. November 21, 2	2017-11-21
Ablation method and recipe for wafer level underfill material patterning and removal Grant 9,786,517 - Dias , et al. October 10, 2	2017-10-10
Organic Thin Film Passivation Of Metal Interconnections App 20170141061 - ALEKSOV; Aleksandar ; et al.	2017-05-18
Organic thin film passivation of metal interconnections Grant 9,583,390 - Aleksov , et al. February 28, 2	2017-02-28
Laser Die Backside Film Removal For Integrated Circuit (ic) Packaging App 20160307869 - Faruqui; Danish ; et al.	2016-10-20
Organic Thin Film Passivation Of Metal Interconnections App 20160155667 - ALEKSOV; Aleksandar ; et al.	2016-06-02
Organic thin film passivation of metal interconnections Grant 9,257,276 - Aleksov , et al. February 9, 2	2016-02-09
Ultrathin Microelectronic Die Packages And Methods Of Fabricating The Same App 20150318255 - KARHADE; OMKAR G. ; et al.	2015-11-05
Laser Ablation Method And Recipe For Sacrificial Material Patterning And Removal App 20150072515 - Dias; Rajendra C. ; et al.	2015-03-12
Ablation Method And Recipe For Wafer Level Underfill Material Patterning And Removal App 20150072479 - Dias; Rajendra C. ; et al.	2015-03-12
Laser Die Backside Film Removal For Integrated Circuit (ic) Packaging App 20140264951 - Faruqui; Danish ; et al.	2014-09-18
Organic Thin Film Passivation Of Metal Interconnections App 20140138818 - Aleksov; Alexsandar ; et al.	2014-05-22

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