Farrar, Sr.; Paul A.
Patent Applications and Registrations
Patent applications and USPTO patent grants for Farrar, Sr.; Paul A..The latest application filed is for "polyimide-insulated cube package of stacked semiconductor device chips".
- Farrar, Sr.; Paul A. - South Burlington VT
- Farrar, Sr.; Paul A. - So. Burlington VT
- Farrar, Sr.; Paul A. - Burlington VT
| Patent | Date |
|---|---|
| Polyimide-insulated cube package of stacked semiconductor device chips Grant 5,478,781 - Bertin , et al. December 26, 1 | 1995-12-26 |
| Metallization composite having nickle intermediate/interface Grant 5,457,345 - Cook , et al. October 10, 1 | 1995-10-10 |
| Gray level mask Grant 5,334,467 - Cronin , et al. August 2, 1 | 1994-08-02 |
| Three dimensional multichip package methods of fabrication Grant 5,270,261 - Bertin , et al. December 14, 1 | 1993-12-14 |
| Method of making a gray level mask Grant 5,213,916 - Cronin , et al. May 25, 1 | 1993-05-25 |
| Three-dimensional multichip packages and methods of fabrication Grant 5,202,754 - Bertin , et al. April 13, 1 | 1993-04-13 |
| Passivation of metal in metal/polyimide structure Grant 5,194,928 - Cronin , et al. March 16, 1 | 1993-03-16 |
| Plural level chip masking Grant 5,126,006 - Cronin , et al. June 30, 1 | 1992-06-30 |
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