loadpatents
name:-0.0076239109039307
name:-0.0086178779602051
name:-0.0016989707946777
FARR; Jon C. Patent Filings

FARR; Jon C.

Patent Applications and Registrations

Patent applications and USPTO patent grants for FARR; Jon C..The latest application filed is for "method of depositing a pre-etch protective layer".

Company Profile
1.5.7
  • FARR; Jon C. - Tempe AZ
  • FARR; Jon C. - Vallejo CA
  • Farr; Jon C. - Sunnyvale CA
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Method Of Depositing A Pre-etch Protective Layer
App 20220059359 - WANG; Zhi Gang ;   et al.
2022-02-24
Source RF power split inner coil to improve BCD and etch depth performance
Grant 10,211,030 - Wang , et al. Feb
2019-02-19
Source Rf Power Split Inner Coil To Improve Bcd And Etch Depth Performance
App 20170200585 - WANG; Rongping ;   et al.
2017-07-13
Method and apparatus for high efficiency gas dissociation in inductive coupled plasma reactor
Grant 9,070,633 - Nangoy , et al. June 30, 2
2015-06-30
Method And Apparatus For High Efficiency Gas Dissociation In Inductive Coupled Plasma Reactor
App 20140256148 - NANGOY; Roy C. ;   et al.
2014-09-11
Method and apparatus for high efficiency gas dissociation in inductive couple plasma reactor
Grant 8,753,474 - Nangoy , et al. June 17, 2
2014-06-17
Method of forming a deep trench in a substrate
Grant 8,158,522 - Sirajuddin , et al. April 17, 2
2012-04-17
Method Of Filling A Deep Trench In A Substrate
App 20110217832 - Raorane; Digvijay ;   et al.
2011-09-08
Method Of Forming A Deep Trench In A Substrate
App 20110201205 - Sirajuddin; Khalid M. ;   et al.
2011-08-18
Method And Apparatus For High Efficiency Gas Dissociation In Inductive Couple Plasma Reactor
App 20110073564 - Nangoy; Roy C. ;   et al.
2011-03-31
Method And Apparatus Of A Substrate Etching System And Process
App 20090272717 - Pamarthy; Sharma V. ;   et al.
2009-11-05

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