Farquhar; Donald S.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Farquhar; Donald S..The latest application filed is for "tri-stable flexure mechanism".

Company Profile

0.46.39

Farquhar; Donald S. - Schenectady NY
Farquhar; Donald S. - Endicott NY

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Tri-stable flexure mechanism Grant 9,406,470 - Rakuff , et al. August 2, 2	2016-08-02
Tri-stable Flexure Mechanism App 20150235794 - Rakuff; Stefan ; et al.	2015-08-20
Multi-layered interconnect structure using liquid crystalline polymer dielectric Grant 7,981,245 - Egitto , et al. July 19, 2	2011-07-19
Multi-layered Interconnect Structure Using Liquid Crystalline Polymer Dielectric App 20100218891 - Egitto; Frank D. ; et al.	2010-09-02
Multi-layered interconnect structure using liquid crystalline polymer dielectric Grant 7,777,136 - Egitto , et al. August 17, 2	2010-08-17
Security cloth design and assembly Grant 7,679,921 - Cesana , et al. March 16, 2	2010-03-16
Multi-layered Interconnect Structure Using Liquid Crystalline Polymer Dielectric App 20080217050 - Egitto; Frank D. ; et al.	2008-09-11
Multi-layered Interconnect Structure Using Liquid Crystalline Polymer Dielectric App 20080178999 - Egitto; Frank D. ; et al.	2008-07-31
Method and structure for producing Z-axis interconnection assembly of printed wiring board elements Grant 7,402,254 - Curcio , et al. July 22, 2	2008-07-22
Electronic package with optimized lamination process Grant 7,329,816 - Farquhar , et al. February 12, 2	2008-02-12
Electronic Package With Optimized Lamination Process App 20080022519 - Farquhar; Donald S. ; et al.	2008-01-31
Method for producing Z-axis interconnection assembly of printed wiring board elements Grant 7,303,639 - Curcio , et al. December 4, 2	2007-12-04
Multi-layered interconnect structure using liquid crystalline polymer dielectric Grant 7,301,108 - Egitto , et al. November 27, 2	2007-11-27
Z-interconnections with liquid crystal polymer dielectric films Grant 7,128,256 - Farquhar , et al. October 31, 2	2006-10-31
Solid via layer to layer interconnect Grant 7,076,869 - Curcio , et al. July 18, 2	2006-07-18
Electronic package with optimized lamination process Grant 7,059,049 - Farquhar , et al. June 13, 2	2006-06-13
Security cloth design and assembly App 20060080348 - Cesana; Mario L. ; et al.	2006-04-13
Semiconductor device having a thermoset-containing dielectric material and methods for fabricating the same Grant 7,014,731 - Farquhar , et al. March 21, 2	2006-03-21
Method and apparatus for improved fold retention on a security enclosure Grant 7,007,171 - Butturini , et al. February 28, 2	2006-02-28
Formation of multisegmented plated through holes Grant 6,996,903 - Farquhar , et al. February 14, 2	2006-02-14
Security cloth design and assembly Grant 6,982,642 - Cesana , et al. January 3, 2	2006-01-03
Method for producing Z-axis interconnection assembly of printed wiring board elements App 20050280136 - Curcio, Brian E. ; et al.	2005-12-22
Method and structure for producing Z-axis interconnection assembly of printed wiring board elements Grant 6,969,436 - Curcio , et al. November 29, 2	2005-11-29
Lamination of liquid crystal polymer dielectric films Grant 6,967,705 - Farquhar , et al. November 22, 2	2005-11-22
Electronic package with optimized lamination process App 20050224961 - Farquhar, Donald S. ; et al.	2005-10-13
Method of making and interconnect structure Grant 6,931,726 - Boyko , et al. August 23, 2	2005-08-23
Tamper-responding encapsulated enclosure having flexible protective mesh structure Grant 6,929,900 - Farquhar , et al. August 16, 2	2005-08-16
Formation of multisegmented plated through holes App 20050079289 - Farquhar, Donald S. ; et al.	2005-04-14
Multi-layered interconnect structure using liquid crystalline polymer dielectric App 20050057908 - Egitto, Frank D. ; et al.	2005-03-17
Lamination of liquid crystal polymer dielectric films App 20050019527 - Farquhar, Donald S. ; et al.	2005-01-27
Accelerated etching of chromium Grant 6,843,929 - Farquhar , et al. January 18, 2	2005-01-18
Method of making a multi-layered interconnect structure Grant 6,829,823 - Downes, Jr. , et al. December 14, 2	2004-12-14
Multi-layered interconnect structure using liquid crystalline polymer dielectric Grant 6,826,830 - Egitto , et al. December 7, 2	2004-12-07
Lamination of liquid crystal polymer dielectric films Grant 6,819,373 - Farquhar , et al. November 16, 2	2004-11-16
Tamper-responding encapsulated enclosure having flexible protective mesh structure App 20040195001 - Farquhar, Donald S. ; et al.	2004-10-07
Z-interconnections with liquid crystal polymer dielectric films App 20040182509 - Farquhar, Donald S. ; et al.	2004-09-23
Process of removing holefill residue from a metallic surface of an electronic substrate Grant 6,776,852 - Boyko , et al. August 17, 2	2004-08-17
Z-interconnections with liquid crystal polymer dielectric films Grant 6,764,748 - Farquhar , et al. July 20, 2	2004-07-20
Method and structure for producing Z-axis interconnection assembly of printed wiring board elements App 20040084137 - Curcio, Brian E. ; et al.	2004-05-06
Lamination of liquid crystal polymer dielectric films App 20040066478 - Farquhar, Donald S. ; et al.	2004-04-08
Method and structure for producing Z-axis interconnection assembly of printed wiring board elements App 20040052945 - Curcio, Brian E. ; et al.	2004-03-18
Formation of multisegmented plated through holes Grant 6,700,078 - Farquhar , et al. March 2, 2	2004-03-02
Tamper-responding encapsulated enclosure having flexible protective mesh structure Grant 6,686,539 - Farquhar , et al. February 3, 2	2004-02-03
Platen for use in laminating press Grant 6,675,852 - Calmidi , et al. January 13, 2	2004-01-13
Interconnect structure and method of making same Grant 6,660,945 - Boyko , et al. December 9, 2	2003-12-09
Hole fill composition and method for filling holes in a substrate App 20030216490 - Farquhar, Donald S. ; et al.	2003-11-20
Method and structure for producing Z-axis interconnection assembly of printed wiring board elements Grant 6,645,607 - Curcio , et al. November 11, 2	2003-11-11
Method and structure for producing Z-axis interconnection assembly of printed wiring board elements Grant 6,638,607 - Curcio , et al. October 28, 2	2003-10-28
High performance packaging platform and method of making same Grant 6,639,155 - Bupp , et al. October 28, 2	2003-10-28
Method of forming metallic z-interconnects for laminate chip packages and boards Grant 6,634,543 - Curcio , et al. October 21, 2	2003-10-21
Interconnect structure and method of making same App 20030172525 - Boyko, Christina M. ; et al.	2003-09-18
Method of making a printed circuit board having filled holes and a fill member for use therewith including reinforcement means Grant 6,609,296 - Farquhar , et al. August 26, 2	2003-08-26
Multi-layered interconnect structure using liquid crystalline polymer dielectric App 20030147227 - Egitto, Frank D. ; et al.	2003-08-07
Method and article for filling apertures in a high performance electronic substrate Grant 6,599,833 - Farquhar , et al. July 29, 2	2003-07-29
Thin film attachment to laminate using a dendritic interconnection Grant 6,600,224 - Farquhar , et al. July 29, 2	2003-07-29
Process of removing holefill residue from a metallic surface of an electronic substrate App 20030131870 - Boyko, Christina M. ; et al.	2003-07-17
Method of forming metallic z-interconnects for laminate chip packages and boards App 20030127495 - Curcio, Brian E. ; et al.	2003-07-10
Hole fill composition and method for filling holes in a substrate Grant 6,589,639 - Farquhar , et al. July 8, 2	2003-07-08
Interconnect structure and method of making same App 20030070839 - Boyko, Christina M. ; et al.	2003-04-17
Solid via layer to layer interconnect App 20030035272 - Curcio, Brian E. ; et al.	2003-02-20
Electronic package with optimized lamination process App 20030020156 - Farquhar, Donald S. ; et al.	2003-01-30
Flip chip package with improved cap design and process for making thereof Grant 6,501,171 - Farquhar , et al. December 31, 2	2002-12-31
Method and structure for producing Z-axis interconnection assembly of printed wiring board elements App 20020192444 - Curcio, Brian E. ; et al.	2002-12-19
Platen for use in laminating press and method of lamination App 20020189755 - Calmidi, Varaprasad Venkata ; et al.	2002-12-19
Hole fill composition and method for filling holes in a substrate App 20020187316 - Farquhar, Donald S. ; et al.	2002-12-12
Method and article for filling apertures in a high performance electronic substrate App 20020182832 - Farquhar, Donald S. ; et al.	2002-12-05
Solid Via Layer To Layer Interconnect App 20020179334 - Curcio, Brian E. ; et al.	2002-12-05
Formation of multisegmented plated through holes App 20020164468 - Farquhar, Donald S. ; et al.	2002-11-07
Method And Structure For Producing Z-axis Interconnection Assembly Of Printed Wiring Board Elements App 20020150741 - Curcio, Brian E. ; et al.	2002-10-17
Method and structure for producing Z-axis interconnection assembly of printed wiring board elements Grant 6,465,084 - Curcio , et al. October 15, 2	2002-10-15
Flip chip package with improved cap design and process for making thereof App 20020100969 - Farquhar, Donald S. ; et al.	2002-08-01
Formation of multisegmented plated through holes Grant 6,426,470 - Farquhar , et al. July 30, 2	2002-07-30
Method and article for filling apertures in a high performance electronic substrate App 20020093072 - Farquhar, Donald S. ; et al.	2002-07-18
Formation Of Multisegmented Plated Through Holes App 20020092677 - Farquhar, Donald S. ; et al.	2002-07-18
Electronic package with high density interconnect layer App 20020085364 - Downes, Francis J. JR. ; et al.	2002-07-04
Tamper-responding encapsulated enclosure having flexible protective mesh structure App 20020084090 - Farquhar, Donald S. ; et al.	2002-07-04
Circuit package having low modulus, conformal mounting pads Grant 6,399,896 - Downes, Jr. , et al. June 4, 2	2002-06-04
Electronic package having an adhesive retaining cavity Grant 6,395,998 - Farquhar , et al. May 28, 2	2002-05-28
Electronic package with high density interconnect layer Grant 6,373,717 - Downes, Jr. , et al. April 16, 2	2002-04-16
Integrated circuit chip carrier assembly App 20020038913 - Farquhar, Donald S. ; et al.	2002-04-04
Smiconductor device having a thermoset- containing dielectric material and methods for fabricating the same App 20010041389 - Farquhar, Donald S. ; et al.	2001-11-15
Semiconductor device having a thermoset-containing dielectric material and methods for fabricating the same Grant 6,254,972 - Farquhar , et al. July 3, 2	2001-07-03
Semiconductor device having a thermoset-containing dielectric material and methods for fabricating the same App 20010005548 - Farquhar, Donald S. ; et al.	2001-06-28
Method of making a printed circuit board having filled holes and fill member for use therewith Grant 6,079,100 - Farquhar , et al. June 27, 2	2000-06-27
Practical method to make blind vias in circuit boards and other substrates Grant 5,925,206 - Boyko , et al. July 20, 1	1999-07-20

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