| Patent | Date |
|---|
Substrate Thinning For A Backside Power Distribution Network
App 20220301878 - Xie; Ruilong ; et al. | 2022-09-22 |
Sintering A Nanoparticle Paste For Semiconductor Chip Join
App 20220262754 - Sakuma; Katsuyuki ; et al. | 2022-08-18 |
Structure and method for bridge chip assembly with capillary underfill
Grant 11,404,379 - Farooq , et al. August 2, 2 | 2022-08-02 |
Mitigating Cooldown Peeling Stress During Chip Package Assembly
App 20220208693 - Farooq; Mukta Ghate ; et al. | 2022-06-30 |
Assembly Of A Chip To A Substrate
App 20220208719 - Sakuma; Katsuyuki ; et al. | 2022-06-30 |
Oxide-bonded wafer pair separation using laser debonding
Grant 11,355,379 - Farooq , et al. June 7, 2 | 2022-06-07 |
Oxide-bonded Wafer Pair Separation Using Laser Debonding
App 20220165601 - Farooq; Mukta Ghate ; et al. | 2022-05-26 |
Protective Surface Layer On Under Bump Metallurgy For Solder Joining
App 20220165691 - Farooq; Mukta Ghate ; et al. | 2022-05-26 |
Structure and Method for Bridge Chip Assembly with Capillary Underfill
App 20220157727 - Farooq; Mukta Ghate ; et al. | 2022-05-19 |
Integration structure and planar joining
Grant 11,282,716 - Farooq , et al. March 22, 2 | 2022-03-22 |
Cu--Cu bonding for interconnects on bridge chip attached to chips and packaging substrate
Grant 11,239,167 - Farooq , et al. February 1, 2 | 2022-02-01 |
Simultaneous plating of varying size features on semiconductor substrate
Grant 11,171,006 - Farooq , et al. November 9, 2 | 2021-11-09 |
Semiconductor wafer having trenches with varied dimensions for multi-chip modules
Grant 11,049,844 - Bonam , et al. June 29, 2 | 2021-06-29 |
Simultaneous Plating of Varying Size Features on Semiconductor Substrate
App 20210175084 - Farooq; Mukta Ghate ; et al. | 2021-06-10 |
Cu-Cu Bonding for Interconnects on Bridge Chip Attached to Chips and Packaging Substrate
App 20210175174 - Farooq; Mukta Ghate ; et al. | 2021-06-10 |
Integration Structure And Planar Joining
App 20210143022 - Farooq; Mukta Ghate ; et al. | 2021-05-13 |
Planar Wafer Level Fan-out Of Multi-chip Modules Having Different Size Chips
App 20210091032 - Bonam; Ravi K. ; et al. | 2021-03-25 |
Planar wafer level fan-out of multi-chip modules having different size chips
Grant 10,943,883 - Bonam , et al. March 9, 2 | 2021-03-09 |
Semiconductor Wafer Having Trenches With Varied Dimensions For Multi-chip Modules
App 20210005573 - Bonam; Ravi K. ; et al. | 2021-01-07 |
Post zero via layer keep out zone over through silicon via reducing BEOL pumping effects
Grant 10,199,315 - Farooq , et al. Fe | 2019-02-05 |
Post Zero Via Layer Keep Out Zone Over Through Silicon Via Reducing Beol Pumping Effects
App 20180061749 - Farooq; Mukta Ghate ; et al. | 2018-03-01 |
Structure and method to improve current-carrying capabilities of C4 joints
Grant 8,367,543 - Farooq , et al. February 5, 2 | 2013-02-05 |
Enhanced interconnect structure
Grant 8,129,842 - Yang , et al. March 6, 2 | 2012-03-06 |
Structure and method for producing multiple size interconnections
Grant 7,714,452 - Clevenger , et al. May 11, 2 | 2010-05-11 |
Enhanced Interconnect Structure
App 20090200669 - YANG; CHIH-CHAO ; et al. | 2009-08-13 |
Enhanced interconnect structure
Grant 7,531,384 - Yang , et al. May 12, 2 | 2009-05-12 |
Temporary chip attach using injection molded solder
Grant 7,473,580 - Farooq , et al. January 6, 2 | 2009-01-06 |
Temporary Chip Attach Using Injection Molded Solder
App 20080224328 - Farooq; Mukta Ghate ; et al. | 2008-09-18 |
Method For Chip To Package Interconnect
App 20080160752 - Clevenger; Lawrence ; et al. | 2008-07-03 |
Enhanced Interconnect Structure
App 20080088026 - Yang; Chih-Chao ; et al. | 2008-04-17 |
Structure And Method For Producing Multiple Size Interconnections
App 20070290345 - Clevenger; Lawrence A. ; et al. | 2007-12-20 |
Temporary Chip Attach Using Injection Molded Solder
App 20070269928 - Farooq; Mukta Ghate ; et al. | 2007-11-22 |
Structure And Method To Improve Current-carrying Capabilities Of C4 Joints
App 20070222073 - Farooq; Mukta Ghate ; et al. | 2007-09-27 |
Fluidic Cooling Systems And Methods For Electronic Components
App 20060104031 - Colgan; Evan George ; et al. | 2006-05-18 |
Interposer capacitor built on silicon wafer and joined to a ceramic substrate
Grant 6,943,108 - Farooq , et al. September 13, 2 | 2005-09-13 |
Interposer capacitor built on silicon wafer and joined to a ceramic substrate
App 20040245556 - Farooq, Mukta Ghate ; et al. | 2004-12-09 |
Interposer capacitor built on silicon wafer and joined to a ceramic substrate
Grant 6,791,133 - Farooq , et al. September 14, 2 | 2004-09-14 |
Interposer capacitor built on silicon wafer and joined to a ceramic substrate
App 20040014313 - Farooq, Mukta Ghate ; et al. | 2004-01-22 |
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