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Patent applications and USPTO patent grants for Farnaam; Mohammad.The latest application filed is for "contact plug and interconnect employing a barrier lining and a backfilled conductor material".
Patent | Date |
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Contact plug and interconnect employing a barrier lining and a backfilled conductor material Grant 4,960,732 - Dixit , et al. October 2, 1 | 1990-10-02 |
Contact plug and interconnect employing a barrier lining and a backfilled conductor material Grant 4,884,123 - Dixit , et al. November 28, 1 | 1989-11-28 |
High speed interconnect system with refractory non-dogbone contacts and an active electromigration suppression mechanism Grant 4,847,674 - Sliwa , et al. July 11, 1 | 1989-07-11 |
Titanium nitride as an antireflection coating on highly reflective layers for photolithography Grant 4,820,611 - Arnold, III , et al. April 11, 1 | 1989-04-11 |
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