Farcy; Alexis

Patent Applications and Registrations

Patent applications and USPTO patent grants for Farcy; Alexis.The latest application filed is for "chip protected against back-face attacks".

Company Profile

0.14.13

Farcy; Alexis - La Ravoire FR
Farcy; Alexis - La Rovoire N/A FR
Farcy; Alexis - Le Ravoire FR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Chip Protected Against Back-face Attacks App 20220045020 - Petitdidier; Sebastien ; et al.	2022-02-10
Chip protected against back-face attacks Grant 11,183,468 - Petitdidier , et al. November 23, 2	2021-11-23
Chip Protected Against Back-face Attacks App 20180061781 - Petitdidier; Sebastien ; et al.	2018-03-01
Semiconductor device comprising a capacitor and an electrical connection via and fabrication method Grant 8,841,748 - Joblot , et al. September 23, 2	2014-09-23
Integrated circuit comprising a device with a vertical mobile element integrated in a support substrate and method for producing the device with a mobile element Grant 8,766,381 - Casset , et al. July 1, 2	2014-07-01
Interface plate between integrated circuits Grant 8,704,363 - Felk , et al. April 22, 2	2014-04-22
Mim Capacitor App 20130286540 - Farcy; Alexis ; et al.	2013-10-31
MIM capacitor with enhanced capacitance Grant 8,424,177 - Farcy , et al. April 23, 2	2013-04-23
Integrated microelectronic device with through-vias Grant 8,410,574 - Farcy , et al. April 2, 2	2013-04-02
Semiconductor Device Comprising A Capacitor And An Electrical Connection Via And Fabrication Method App 20120133020 - Joblot; Sylvain ; et al.	2012-05-31
Integrated Circuit Comprising A Device With A Vertical Mobile Element Integrated In A Support Substrate And Method For Producing The Device With A Mobile Element App 20120074527 - Casset; Fabrice ; et al.	2012-03-29
Integrated Microelectronic Device With Through-vias App 20110140231 - Farcy; Alexis ; et al.	2011-06-16
Interface Plate Between Integrated Circuits App 20110095437 - Felk; Yacine ; et al.	2011-04-28
Assembly Of Semiconductor Chips/wafers App 20110086468 - Felk; Yacine ; et al.	2011-04-14
Mim Capacitor App 20110080686 - Farcy; Alexis ; et al.	2011-04-07
Integrated capacitor with a high breakdown voltage App 20070096253 - Torres; Joaquin ; et al.	2007-05-03
Integrated electronic circuit incorporating a capacitor App 20070063240 - Torres; Joaquin ; et al.	2007-03-22
High-frequency line Grant 6,949,444 - Torres , et al. September 27, 2	2005-09-27
Integrated circuit comprising an auxiliary component, for example a passive component or a microelectromechanical system, placed above an electronic chip, and the corresponding fabrication process Grant 6,846,690 - Farcy , et al. January 25, 2	2005-01-25
High-frequency integrated inductive winding Grant 6,617,665 - Farcy , et al. September 9, 2	2003-09-09
Integrated circuit comprising an auxiliary component, for example a passive component or a microelectromechanical system, placed above an electronic chip, and the corresponding fabrication process App 20030119219 - Farcy, Alexis ; et al.	2003-06-26
High-frequency integrated inductive winding App 20030092202 - Farcy, Alexis ; et al.	2003-05-15

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