Farassat; Farhad

Patent Applications and Registrations

Patent applications and USPTO patent grants for Farassat; Farhad.The latest application filed is for "transducer of an ultrasonic bonder".

Company Profile

0.16.12

Farassat; Farhad - Taufkirchen DE
Farassat; Farhad - Muenchen DE
Farassat; Farhad - Munich DE
Farassat; Farhad - Les Brenets CH

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Transducer Of An Ultrasonic Bonder App 20110259939 - Farassat; Farhad	2011-10-27
Method of testing bonded connections, and a wire bonder Grant 7,735,711 - Farassat June 15, 2	2010-06-15
Wire bonder and method of operating the same Grant 7,458,496 - Farassat December 2, 2	2008-12-02
Method Of Testing Bonded Connections, And A Wire Bonder App 20080073410 - Farassat; Farhad	2008-03-27
Mechanism for exchanging chip-carrier plates for use in a hybrid chip-bonding machine Grant 7,156,602 - Farassat January 2, 2	2007-01-02
Wire bonder and method of operating the same App 20060071049 - Farassat; Farhad	2006-04-06
Method and apparatus for the production and quality testing of a bonded wire connection Grant 6,912,906 - Farassat July 5, 2	2005-07-05
Bonding tool and wire bonder Grant 6,905,058 - Farassat June 14, 2	2005-06-14
Circuit housing Grant 6,891,730 - Farassat May 10, 2	2005-05-10
Cutting device for bonded wires Grant 6,827,248 - Farassat December 7, 2	2004-12-07
Method and apparatus for the production and quality testing of a bonded wire connection App 20040221653 - Farassat, Farhad	2004-11-11
Chip-transferring station for a bonding machine Grant 6,786,320 - Farassat September 7, 2	2004-09-07
Apparatus for performing a pull test Grant 6,758,385 - Farassat July 6, 2	2004-07-06
Method and apparatus for the production and quality testing of a bonded wire connection Grant 6,745,629 - Farassat June 8, 2	2004-06-08
Chip-transferring station for a bonding machine App 20040099509 - Farassat, Farhad	2004-05-27
Bonding tool and wire bonder App 20040011848 - Farassat, Farhad	2004-01-22
Cutting device for bonded wires App 20030192414 - Farassat, Farhad	2003-10-16
Method and apparatus for the production and quality testing of a bonded wire connection App 20030167846 - Farassat, Farhad	2003-09-11
Apparatus for performing a pull test App 20030146263 - Farassat, Farhad	2003-08-07
Method of testing bonded connections, and a wire bonder App 20030085255 - Farassat, Farhad	2003-05-08
Mechanism for exchanging chip-carrier plates for use in a hybrid chip-bonding machine App 20030086775 - Farassat, Farhad	2003-05-08
Circuit housing App 20030007334 - Farassat, Farhad	2003-01-09
Wire guide for a bonding machine Grant 5,906,706 - Farassat May 25, 1	1999-05-25
Wire bonding ultrasonic control system responsive to wire deformation Grant 5,314,105 - Farassat May 24, 1	1994-05-24
Bonding wedge Grant 5,018,658 - Farassat May 28, 1	1991-05-28
Apparatus and method of controlled feed of a bonding wire to the "wedge" of a bonding head Grant 4,928,871 - Farassat May 29, 1	1990-05-29
Ball bonding method and apparatus for performing the method Grant 4,925,083 - Farassat , et al. May 15, 1	1990-05-15
Bonding head Grant 4,781,319 - Deubzer , et al. November 1, 1	1988-11-01

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