loadpatents
name:-0.00052595138549805
name:-0.016361951828003
name:-0.0017671585083008
Faraday Technology Marketing Group, LLC Patent Filings

Faraday Technology Marketing Group, LLC

Patent Applications and Registrations

Patent applications and USPTO patent grants for Faraday Technology Marketing Group, LLC.The latest application filed is for "electrolytic etching of metal layers".

Company Profile
0.15.0
  • Faraday Technology Marketing Group, LLC - Troy OH
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Electrolytic etching of metal layers
Grant 7,022,216 - Taylor , et al. April 4, 2
2006-04-04
Pulse reverse electrodeposition for metallization and planarization of semiconductor substrates
Grant 6,878,259 - Taylor , et al. April 12, 2
2005-04-12
Sequential electrodeposition of metals using modulated electric fields for manufacture of circuit boards having features of different sizes
Grant 6,863,793 - Taylor , et al. March 8, 2
2005-03-08
Electrodeposition of metals in high-aspect ratio cavities using modulated reverse electric fields
Grant 6,827,833 - Taylor , et al. December 7, 2
2004-12-07
Method for electrochemical metallization and planarization of semiconductor substrates having features of different sizes
Grant 6,750,144 - Taylor June 15, 2
2004-06-15
Removal of sacrificial cores by electrochemical machining
Grant 6,676,825 - Gebhart January 13, 2
2004-01-13
Sequential electrodeposition of metals using modulated electric fields for manufacture of circuit boards having features of different sizes
Grant 6,652,727 - Taylor , et al. November 25, 2
2003-11-25
Electrodeposition of metals for forming three-dimensional microstructures
Grant 6,551,485 - Taylor April 22, 2
2003-04-22
Electrodeposition of metals in small recesses using modulated electric fields
Grant 6,524,461 - Taylor , et al. February 25, 2
2003-02-25
Pulse reverse electrodeposition for metallization and planarization of semiconductor substrates
Grant 6,319,384 - Taylor , et al. November 20, 2
2001-11-20
Sequential electrodeposition of metals using modulated electric fields for manufacture of circuit boards having features of different sizes
Grant 6,309,528 - Taylor , et al. October 30, 2
2001-10-30
Electrodeposition of metals in small recesses using modulated electric fields
Grant 6,303,014 - Taylor , et al. October 16, 2
2001-10-16
Removal of sacrificial cores by electrochemical machining
Grant 6,221,235 - Gebhart April 24, 2
2001-04-24
Electrodeposition of metals in small recesses for manufacture of high density interconnects using reverse pulse plating
Grant 6,210,555 - Taylor , et al. April 3, 2
2001-04-03
Pulse reverse electrodeposition for metallization and planarization of a semiconductor substrates
Grant 6,203,684 - Taylor , et al. March 20, 2
2001-03-20

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