Fann; Yuan-Chang

Patent Applications and Registrations

Patent applications and USPTO patent grants for Fann; Yuan-Chang.The latest application filed is for "molybdenum-silicon carbide composite powder and a fabricating method thereof".

Company Profile

2.6.6

Fann; Yuan-Chang - Hsinchu County TW
Fann; Yuan-Chang - Jhudong Township TW
- Jhudong Township TW
Fann; Yuan-Chang - Zhudong Township TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Molybdenum-silicon carbide composite powder and a fabricating method thereof Grant 11,248,124 - Fann , et al. February 15, 2	2022-02-15
Molybdenum-silicon Carbide Composite Powder And A Fabricating Method Thereof App 20200199370 - Fann; Yuan-Chang ; et al.	2020-06-25
Thermoelectric module and method of fabricating the same Grant 8,921,679 - Fann , et al. December 30, 2	2014-12-30
Thermoelectric module and method of fabricating the same Grant 08921679 -	2014-12-30
Thermoelectric Module And Method Of Fabricating The Same App 20130167896 - FANN; Yuan-Chang ; et al.	2013-07-04
Metal thermal interface material and thermal module and packaged microelectronic component containing the material Grant 8,373,991 - Fann , et al. February 12, 2	2013-02-12
Thermoelectric Module And Method Of Manufacturing The Same App 20120167937 - Fann; Yuan-Chang ; et al.	2012-07-05
Melting temperature adjustable metal thermal interface materials and packaged semiconductors including thereof Grant 7,952,192 - Fann , et al. May 31, 2	2011-05-31
Melting Temperature Adjustable Metal Thermal Interface Materials And Packaged Semiconductors Including Thereof App 20090236729 - Fann; Yuan-Chang ; et al.	2009-09-24
Melting temperature adjustable metal thermal interface materials and application thereof Grant 7,576,428 - Fann , et al. August 18, 2	2009-08-18
Metal Thermal Interface Material And Thermal Module And Packaged Microelectronic Component Containing The Material App 20090135567 - Fann; Yuan-Chang ; et al.	2009-05-28
Melting Temperature Adjustable Metal Thermal Interface Materials And Application Thereof App 20080110609 - Fann; Yuan-Chang ; et al.	2008-05-15

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