Fang; Treliant

Patent Applications and Registrations

Patent applications and USPTO patent grants for Fang; Treliant.The latest application filed is for "halite salts as silicon carbide etchants for enhancing cmp material removal rate for sic wafer".

Company Profile

0.25.16

Fang; Treliant - Dublin CA US
Fang; Treliant - Chandler AZ
Fang; Treliant - Lawrenceville NJ

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Halite salts as silicon carbide etchants for enhancing CMP material removal rate for SiC wafer Grant 9,944,829 - Fang April 17, 2	2018-04-17
Halite Salts As Silicon Carbide Etchants For Enhancing Cmp Material Removal Rate For Sic Wafer App 20170158911 - Fang; Treliant	2017-06-08
Elastic encapsulated carbon nanotube based electrical contacts Grant 8,872,176 - Fang , et al. October 28, 2	2014-10-28
Carbon nanotube columns and methods of making and using carbon nanotube columns as probes Grant 8,354,855 - Eldridge , et al. January 15, 2	2013-01-15
Anchoring carbon nanotube columns Grant 8,272,124 - Fang , et al. September 25, 2	2012-09-25
Elastic Encapsulated Carbon Nanotube Based Electrical Contacts App 20120086004 - Fang; Treliant ; et al.	2012-04-12
Carbon nanotube spring contact structures with mechanical and electrical components Grant 8,149,007 - Chen , et al. April 3, 2	2012-04-03
Anchoring Carbon Nanotube Columns App 20100253375 - Fang; Treliant ; et al.	2010-10-07
Carbon Nanotube Columns And Methods Of Making And Using Carbon Nanotube Columns As Probes App 20100083489 - Eldridge; Benjamin N. ; et al.	2010-04-08
Three dimensional microstructures and methods for making three dimensional microstructures Grant 7,658,831 - Mathieu , et al. February 9, 2	2010-02-09
Carbon Nanotube Spring Contact Structures With Mechanical And Electrical Components App 20090197484 - Chen; Jimmy K. ; et al.	2009-08-06
Photoresist formulation for high aspect ratio plating Grant 7,563,559 - Fang July 21, 2	2009-07-21
Photoresist Formulation For High Aspect Ratio Plating App 20070248896 - Fang; Treliant	2007-10-25
A Probe Array Structure And A Method Of Making A Probe Array Structure App 20070152685 - Eldridge; Benjamin N. ; et al.	2007-07-05
Photoresist formulation for high aspect ratio plating Grant 7,238,464 - Fang July 3, 2	2007-07-03
Three Dimensional Microstructures And Methods For Making Three Dimensional Microstructures App 20070141743 - Mathieu; Gaetan L. ; et al.	2007-06-21
Simplification of ball attach method using super-saturated fine crystal flux Grant 7,108,755 - Wetz , et al. September 19, 2	2006-09-19
Photoresist formulation for high aspect ratio plating App 20060141394 - Fang; Treliant	2006-06-29
Photoresist formulation for high aspect ratio plating Grant 7,005,233 - Fang February 28, 2	2006-02-28
Apparatus and method for cleaning test probes Grant 6,840,374 - Khandros , et al. January 11, 2	2005-01-11
Photoresist formulation for high aspect ratio plating App 20040214098 - Fang, Treliant	2004-10-28
Phase separated system for fluxing Grant 6,796,482 - Wetz , et al. September 28, 2	2004-09-28
Phase separated system for fluxing App 20040084510 - Wetz, Li Ann ; et al.	2004-05-06
Simplification of ball attach method using super-saturated fine crystal flux App 20040020562 - Wetz, Li Ann ; et al.	2004-02-05
Conductive paste and semiconductor component having conductive bumps made from the conductive paste Grant 6,669,079 - Li , et al. December 30, 2	2003-12-30
Method of manufacturing a semiconductor component and polyimide etchant therefor Grant 6,664,200 - Prack , et al. December 16, 2	2003-12-16
Apparatus and method for cleaning test probes App 20030138644 - Khandros, Igor Y. ; et al.	2003-07-24
Photoresist formulation for high aspect ratio plating App 20030138731 - Fang, Treliant	2003-07-24
Conductive paste and semiconductor component having conductive bumps made from the conductive paste App 20020195171 - Li, Li ; et al.	2002-12-26
Stress compensation composition and semiconductor component formed using the stress compensation composition Grant 6,458,622 - Keser , et al. October 1, 2	2002-10-01
Conductive paste and semiconductor component having conductive bumps made from the conductive paste Grant 6,451,127 - Li , et al. September 17, 2	2002-09-17
Optical semiconductor component and method of manufacture Grant 6,303,978 - Daniels , et al. October 16, 2	2001-10-16
Method of forming an electrically conductive polymer bump over an aluminum electrode Grant 5,674,780 - Lytle , et al. October 7, 1	1997-10-07
Process for electrically connecting electrical devices using a conductive anisotropic material Grant 5,661,042 - Fang , et al. August 26, 1	1997-08-26
Method of making circuit devices comprising a dielectric layer of siloxane-caprolactone Grant 5,326,671 - Brown , et al. July 5, 1	1994-07-05
Triazine optical waveguides Grant 5,208,892 - Burack , et al. May 4, 1	1993-05-04
Nonlinear optical devices and methods Grant 5,045,364 - Fang September 3, 1	1991-09-03

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