Fang; Tianzu
Patent Applications and Registrations
Patent applications and USPTO patent grants for Fang; Tianzu.The latest application filed is for "light-emitting diodes with buffer layers".
- Fang; Tianzu - Fujian CN
- Fang; Tianzu - Xiamen CN
| Patent | Date |
|---|---|
| Light-emitting diodes with buffer layers Grant 10,937,926 - Lin , et al. March 2, 2 | 2021-03-02 |
| Buffer layers having composite structures Grant 10,916,422 - Chen , et al. February 9, 2 | 2021-02-09 |
| Light-emitting Diodes With Buffer Layers App 20190296189 - Lin; Zhiwei ; et al. | 2019-09-26 |
| Light-emitting diode chips with enhanced brightness Grant 10,333,028 - Chen , et al. | 2019-06-25 |
| Buffer Layers Having Composite Structures App 20190088476 - Chen; Kaixuan ; et al. | 2019-03-21 |
| Buffer layers having composite structures Grant 10,121,656 - Chen , et al. November 6, 2 | 2018-11-06 |
| HV-LED module having 3D light-emitting structure and manufacturing method thereof Grant 10,043,850 - Lin , et al. August 7, 2 | 2018-08-07 |
| Light-emitting Diode Chips With Enhanced Brightness App 20170294557 - Chen; Liang ; et al. | 2017-10-12 |
| Method of Manufacturing Buffer Layers Having Composite Structures App 20170256403 - Chen; Kaixuan ; et al. | 2017-09-07 |
| Buffer Layers Having Composite Structures App 20170256404 - Chen; Kaixuan ; et al. | 2017-09-07 |
| Hv-led Module Having 3d Light-emitting Structure And Manufacturing Method Thereof App 20160276402 - Lin; Zhiwei ; et al. | 2016-09-22 |
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