| Patent | Date |
|---|
Wireless Network Performance Analysis
App 20220286935 - FANG; Jianmin ; et al. | 2022-09-08 |
Information Transmission Method And Apparatus, Storage Medium And Electronic Apparatus
App 20220279403 - YANG; Li ; et al. | 2022-09-01 |
Reporting Measurements For Minimization Of Driving Test In Wireless Communication
App 20220232410 - FANG; Jianmin ; et al. | 2022-07-21 |
Network Information Reporting Method And Apparatus, User Equipment, Service Node And Medium
App 20220225224 - SHI; Xiaojuan ; et al. | 2022-07-14 |
Bispecific Fusion Protein And Application Thereof
App 20220204626 - Fang; Jianmin | 2022-06-30 |
System And Method For Performing And Reporting Measurements In Wireless Communication Networks
App 20220191961 - QIU; Zhihong ; et al. | 2022-06-16 |
Method and apparatus for session offloading, device and storage medium
Grant 11,363,494 - Fang , et al. June 14, 2 | 2022-06-14 |
Anti Pd-l1 Antibody And Use Thereof
App 20220177590 - FANG; Jianmin ; et al. | 2022-06-09 |
Pharmaceutical Taci-fc Fusion Protein Formulation
App 20220133633 - Xu; Qiaoyu ; et al. | 2022-05-05 |
Secondary communication node change
Grant 11,310,704 - Fang , et al. April 19, 2 | 2022-04-19 |
Linker For Antibody-drug Conjugates And Its Use
App 20220072137 - Huang; Changjiang ; et al. | 2022-03-10 |
Anti-mesothelin Antibody And Antibody Drug Conjugate Thereof
App 20220056147 - Fang; Jianmin ; et al. | 2022-02-24 |
COVID-19 spike-ACE2 binding assay for drug and antibody screening
Grant 11,255,855 - Huang , et al. February 22, 2 | 2022-02-22 |
Covid-19 spike-ACE2 binding assay for drug and antibody screening
Grant 11,249,083 - Huang , et al. February 15, 2 | 2022-02-15 |
Method Of Performance Information Reporting
App 20220022058 - FANG; Jianmin ; et al. | 2022-01-20 |
Method And Apparatus For Monitoring Performance
App 20220014964 - FANG; Jianmin ; et al. | 2022-01-13 |
Method, apparatus and system for reporting radio access network traffic
Grant 11,223,968 - Fang , et al. January 11, 2 | 2022-01-11 |
Taci-fc Fusion Proteins And Uses Thereof
App 20220002381 - Fang; Jianmin ; et al. | 2022-01-06 |
Quality Of Service Implementations For Separating User Plane
App 20210409997 - Fang; Jianmin ; et al. | 2021-12-30 |
Handover method and device involving multiple core networks
Grant 11,206,585 - Huang , et al. December 21, 2 | 2021-12-21 |
Minimization Of Driving Tests In Dual Connectivity Networks
App 20210344430 - FANG; Jianmin ; et al. | 2021-11-04 |
Bifunctional Angiogenesis Inhibitor And Use Thereof
App 20210324039 - Jiang; Jing ; et al. | 2021-10-21 |
Quality of service implementations for separating user plane
Grant 11,146,984 - Fang , et al. October 12, 2 | 2021-10-12 |
Load Balancing Method and Device, Storage Medium, and Electronic Device
App 20210314837 - FANG; Jianmin | 2021-10-07 |
SARS-CoV-2 (COVID-19) spike-AXL binding assay
Grant 11,137,395 - Huang , et al. October 5, 2 | 2021-10-05 |
Semiconductor device and method of forming openings through insulating layer over encapsulant for enhanced adhesion of interconnect structure
Grant 11,127,666 - Lin , et al. September 21, 2 | 2021-09-21 |
Switching Evaluation And Reporting Method, Device, And Base Station
App 20210274399 - GAO; Yuan ; et al. | 2021-09-02 |
COVID-19 spike-ACE2 binding assay for drug and antibody screening
Grant 11,105,804 - Huang , et al. August 31, 2 | 2021-08-31 |
Antibody For Her2 Concomitant Diagnosis Immunohistochemical Detection And Application Thereof
App 20210238305 - YU; Zhanjiao ; et al. | 2021-08-05 |
Method, Network Device, And System For Implementing Data Processing, And Storage Medium
App 20210235314 - HUANG; He ; et al. | 2021-07-29 |
Asymmetric bispecific antibody
Grant 11,066,476 - Fang , et al. July 20, 2 | 2021-07-20 |
Pharmaceutical Formulations Of Her2 Antibody-drug Conjugate
App 20210154314 - Li; Zhuanglin ; et al. | 2021-05-27 |
Method, network device, and system for implementing data processing, and storage medium
Grant 10,979,933 - Huang , et al. April 13, 2 | 2021-04-13 |
Application Of Taci-fc Fusion Protein In Preparation Of Drugs For Treating Neuromyelitis Optica Spectrum Disorders And Multiple Sclerosis
App 20210087253 - Fang; Jianmin ; et al. | 2021-03-25 |
C-met Agonistic Antibody And Use Thereof
App 20210087277 - FANG; Jianmin ; et al. | 2021-03-25 |
Information Acquisition Method, Apparatus And Device, And Computer Storage Medium
App 20210092629 - FANG; Jianmin ; et al. | 2021-03-25 |
Method, Apparatus And System For Reporting Radio Access Network Traffic, And Storage Medium
App 20210029568 - Fang; Jianmin ; et al. | 2021-01-28 |
Handover Method And Apparatus
App 20210029602 - Fang; Jianmin ; et al. | 2021-01-28 |
Secondary Communication Node Change
App 20210014750 - Fang; Jianmin ; et al. | 2021-01-14 |
Beam Measurement Reporting Method And Device, Terminal And Storage Medium
App 20200382980 - FANG; Jianmin ; et al. | 2020-12-03 |
Handover method and apparatus
Grant 10,805,849 - Fang , et al. October 13, 2 | 2020-10-13 |
Use Of Anti-her2 Antibody-drug Conjugate In Treating Urothelial Carcinoma
App 20200289663 - FANG; Jianmin | 2020-09-17 |
Covalent linkers in antibody-drug conjugates and methods of making and using the same
Grant 10,772,965 - Huang , et al. Sept | 2020-09-15 |
New Target For Treating Cancer
App 20200190210 - FANG; Jianmin ; et al. | 2020-06-18 |
Quality Of Service Implementations For Separating User Plane
App 20200178109 - Fang; Jianmin ; et al. | 2020-06-04 |
Process For Preparing Intermediate Of Antibody Drug Conjugate
App 20200138968 - HUANG; Changjiang ; et al. | 2020-05-07 |
Semiconductor device and method for forming a low profile embedded wafer level ball grid array molded laser package (EWLB-MLP)
Grant 10,622,293 - Yoon , et al. | 2020-04-14 |
Semiconductor device and method of forming interconnect substrate for FO-WLCSP
Grant 10,607,946 - Lin , et al. | 2020-03-31 |
Asymmetric Bispecific Antibody
App 20200087412 - FANG; Jianmin ; et al. | 2020-03-19 |
Handover Method And Device Involving Multiple Core Networks
App 20200092764 - HUANG; He ; et al. | 2020-03-19 |
Method And Apparatus For Session Offloading, Device And Storage Medium
App 20200077302 - FANG; Jianmin ; et al. | 2020-03-05 |
Covalent linkers in antibody-drug conjugates and methods of making and using the same
Grant 10,537,644 - Huang , et al. Ja | 2020-01-21 |
Method, Network Element, And System For Implementing Data Processing, And Storage Medium
App 20200015116 - HUANG; He ; et al. | 2020-01-09 |
Handover Method And Apparatus
App 20190261240 - Fang; Jianmin ; et al. | 2019-08-22 |
Semiconductor device and method of forming shielding layer over integrated passive device using conductive channels
Grant 10,211,183 - Lin , et al. Feb | 2019-02-19 |
Semiconductor device and method of forming sacrificial protective layer to protect semiconductor die edge during singulation
Grant 10,204,866 - Lin , et al. Feb | 2019-02-12 |
Method and device for controlling energy saving and compensation
Grant 10,200,948 - Chen , et al. Fe | 2019-02-05 |
Semiconductor device and method of forming vertical interconnect structure in substrate for IPD and baseband circuit separated by high-resistivity molding compound
Grant 10,192,801 - Lin , et al. Ja | 2019-01-29 |
Semiconductor device with dummy metal protective structure around semiconductor die for localized planarization of insulating layer
Grant 10,163,815 - Lin , et al. Dec | 2018-12-25 |
Anti-HER2 antibody and conjugate thereof
Grant 10,087,260 - Fang , et al. October 2, 2 | 2018-10-02 |
Covalent Linkers In Antibody-drug Conjugates And Methods Of Making And Using The Same
App 20180169250 - Huang; Changjiang ; et al. | 2018-06-21 |
FGFR-FC fusion proteins and the use thereof
Grant 9,957,313 - Fang , et al. May 1, 2 | 2018-05-01 |
Covalent Linkers in Antibody-Drug Conjugates and Methods of Making and Using the Same
App 20180055948 - HUANG; Chang Jiang ; et al. | 2018-03-01 |
Semiconductor device and method of forming a fan-out structure with integrated passive device and discrete component
Grant 9,865,482 - Lin , et al. January 9, 2 | 2018-01-09 |
Semiconductor device and method of forming repassivation layer for robust low cost fan-out semiconductor package
Grant 9,754,867 - Lin , et al. September 5, 2 | 2017-09-05 |
Semiconductor Device and Method of Forming Interconnect Substrate for FO-WLCSP
App 20170236788 - Lin; Yaojian ; et al. | 2017-08-17 |
Semiconductor device and method of forming interconnect substrate for FO-WLCSP
Grant 9,679,863 - Lin , et al. June 13, 2 | 2017-06-13 |
Semiconductor device and method of forming insulating layer disposed over the semiconductor die for stress relief
Grant 9,666,500 - Lin , et al. May 30, 2 | 2017-05-30 |
Semiconductor Device and Method of Forming Openings Through Insulating Layer Over Encapsulant for Enhanced Adhesion of Interconnect Structure
App 20170148721 - Lin; Yaojian ; et al. | 2017-05-25 |
Semiconductor Device and Method of Forming Sacrificial Protective Layer to Protect Semiconductor Die Edge During Singulation
App 20170098612 - Lin; Yaojian ; et al. | 2017-04-06 |
Semiconductor Device and Method of Forming Repassivation Layer for Robust Low Cost Fan-Out Semiconductor Package
App 20170084526 - Lin; Yaojian ; et al. | 2017-03-23 |
Semiconductor device and method of forming openings through insulating layer over encapsulant for enhanced adhesion of interconnect structure
Grant 9,601,434 - Lin , et al. March 21, 2 | 2017-03-21 |
Method and Device for Controlling Energy Saving and Compensation
App 20170041870 - CHEN; Liping ; et al. | 2017-02-09 |
Semiconductor device and method of forming sacrificial protective layer to protect semiconductor die edge during singulation
Grant 9,558,958 - Lin , et al. January 31, 2 | 2017-01-31 |
Semiconductor device and method of forming repassivation layer for robust low cost fan-out semiconductor package
Grant 9,548,240 - Lin , et al. January 17, 2 | 2017-01-17 |
Fusion protein for antagonizing angiogenesis inducible factors and uses thereof
Grant 9,522,949 - Fang , et al. December 20, 2 | 2016-12-20 |
FGFR-FC Fusion Proteins and the Use Thereof
App 20160347817 - FANG; Jianmin ; et al. | 2016-12-01 |
Semiconductor device and method of forming protection and support structure for conductive interconnect structure
Grant 9,484,259 - Lin , et al. November 1, 2 | 2016-11-01 |
Anti-her2 Antibody And Conjugate Thereof
App 20160304621 - FANG; Jianmin ; et al. | 2016-10-20 |
Semiconductor device and method of forming repassivation layer with reduced opening to contact pad of semiconductor die
Grant 9,472,452 - Lin , et al. October 18, 2 | 2016-10-18 |
Integrated passive devices
Grant 9,449,925 - Lin , et al. September 20, 2 | 2016-09-20 |
Drive test minimization method and device for obtaining time delay
Grant 9,451,493 - Li , et al. September 20, 2 | 2016-09-20 |
Semiconductor device and method of forming insulating layer around semiconductor die
Grant 9,437,552 - Lin , et al. September 6, 2 | 2016-09-06 |
Semiconductor device and method of forming a vertical interconnect structure for 3-D FO-WLCSP
Grant 9,401,331 - Lin , et al. July 26, 2 | 2016-07-26 |
Semiconductor Device and Method of Forming Shielding Layer over Integrated Passive Device Using Conductive Channels
App 20160197059 - Lin; Yaojian ; et al. | 2016-07-07 |
FGFR-FC Fusion Proteins and the Use Thereof
App 20160176945 - FANG; Jianmin ; et al. | 2016-06-23 |
Semiconductor Device and Method for Forming a Low Profile Embedded Wafer Level Ball Grid Array Molded Laser Package (EWLB-MLP)
App 20160141238 - Yoon; Seung Wook ; et al. | 2016-05-19 |
Semiconductor device and method of forming shielding layer over integrated passive device using conductive channels
Grant 9,324,700 - Lin , et al. April 26, 2 | 2016-04-26 |
Semiconductor device and method for forming a low profile embedded wafer level ball grid array molded laser package (EWLP-MLP)
Grant 9,293,401 - Yoon , et al. March 22, 2 | 2016-03-22 |
FGFR-Fc fusion proteins and the use thereof
Grant 9,273,137 - Fang , et al. March 1, 2 | 2016-03-01 |
Semiconductor device and method of forming an IPD over a high-resistivity encapsulant separated from other IPDS and baseband circuit
Grant 9,269,598 - Lin , et al. February 23, 2 | 2016-02-23 |
Semiconductor device and method of forming a conductive via-in-via structure
Grant 9,252,075 - Tay , et al. February 2, 2 | 2016-02-02 |
Semiconductor device and method of forming RDL over contact pad with high alignment tolerance or reduced interconnect pitch
Grant 9,202,713 - Lin , et al. December 1, 2 | 2015-12-01 |
Semiconductor device having embedded integrated passive devices electrically interconnected using conductive pillars
Grant 9,184,103 - Lin , et al. November 10, 2 | 2015-11-10 |
Semiconductor Device and Method of Forming Insulating Layer Disposed Over the Semiconductor Die For Stress Relief
App 20150228552 - Lin; Yaojian ; et al. | 2015-08-13 |
Semiconductor device and method of forming insulating layer disposed over the semiconductor die for stress relief
Grant 9,087,930 - Lin , et al. July 21, 2 | 2015-07-21 |
Semiconductor device and method of forming protection and support structure for conductive interconnect structure
Grant 9,082,832 - Lin , et al. July 14, 2 | 2015-07-14 |
Semiconductor Device and Method of Forming Repassivation Layer for Robust Low Cost Fan-Out Semiconductor Package
App 20150155248 - Lin; Yaojian ; et al. | 2015-06-04 |
Method and system for waking up node B cell
Grant 9,019,881 - Fang , et al. April 28, 2 | 2015-04-28 |
Apparatus And Method For Identifying Batteries Of Different Thicknesses, And Electronic Device
App 20150102816 - Ma; Kai ; et al. | 2015-04-16 |
Drive Test Minimization Method and Device for Obtaining Time Delay
App 20150092579 - Li; Dapeng ; et al. | 2015-04-02 |
Method and system for processing cell sleeping
Grant 8,977,325 - Fang , et al. March 10, 2 | 2015-03-10 |
Semiconductor Device and Method of Forming Sacrificial Protective Layer to Protect Semiconductor Die Edge During Singulation
App 20150008597 - Lin; Yaojian ; et al. | 2015-01-08 |
Semiconductor device and method of forming sacrificial protective layer to protect semiconductor die edge during singulation
Grant 8,907,476 - Lin , et al. December 9, 2 | 2014-12-09 |
Semiconductor Device and Method of Forming Insulating Layer Around Semiconductor Die
App 20140339683 - Lin; Yaojian ; et al. | 2014-11-20 |
Semiconductor device and method of forming insulating layer around semiconductor die
Grant 8,878,359 - Lin , et al. November 4, 2 | 2014-11-04 |
Method and base station for determining an initial transmission power
Grant 8,843,172 - He , et al. September 23, 2 | 2014-09-23 |
Semiconductor Device and Method of Forming Repassivation Layer with Reduced Opening to Contact Pad of Semiconductor Die
App 20140252654 - Lin; Yaojian ; et al. | 2014-09-11 |
Semiconductor Device and Method of Forming Insulating Layer Disposed Over the Semiconductor Die For Stress Relief
App 20140246779 - Lin; Yaojian ; et al. | 2014-09-04 |
Semiconductor Device and Method of Forming a Vertical Interconnect Structure for 3-D FO-WLCSP
App 20140239495 - Lin; Yaojian ; et al. | 2014-08-28 |
Semiconductor device with a vertical interconnect structure for 3-D FO-WLCSP
Grant 8,796,846 - Lin , et al. August 5, 2 | 2014-08-05 |
Semiconductor device and method of forming repassivation layer with reduced opening to contact pad of semiconductor die
Grant 8,786,100 - Lin , et al. July 22, 2 | 2014-07-22 |
Semiconductor device and method of forming insulating layer disposed over the semiconductor die for stress relief
Grant 8,759,155 - Lin , et al. June 24, 2 | 2014-06-24 |
Semiconductor Device with Protective Structure Around Semiconductor Die for Localized Planarization of Insulating Layer
App 20140084424 - Lin; Yaojian ; et al. | 2014-03-27 |
Semiconductor device and method of forming protective structure around semiconductor die for localized planarization of insulating layer
Grant 8,642,446 - Lin , et al. February 4, 2 | 2014-02-04 |
Semiconductor device and method for forming passive circuit elements with through silicon vias to backside interconnect structures
Grant 8,592,311 - Lin , et al. November 26, 2 | 2013-11-26 |
Semiconductor device and method of forming bump structure with multi-layer UBM around bump formation area
Grant 8,575,018 - Lin , et al. November 5, 2 | 2013-11-05 |
Semiconductor device and method of forming RDL wider than contact pad along first axis and narrower than contact pad along second axis
Grant 8,501,618 - Lin , et al. August 6, 2 | 2013-08-06 |
Method and system for mobility parameter negotiation between base stations
Grant 8,504,011 - Gao , et al. August 6, 2 | 2013-08-06 |
Fgfr-fc Fusion Protein And Use Thereof
App 20130195864 - FANG; JIANMIN ; et al. | 2013-08-01 |
Fusion Protein For Antagonizing Angiogenesis Inducible Factors And Uses Thereof
App 20130190235 - FANG; JIANMIN ; et al. | 2013-07-25 |
Semiconductor Device and Method of Forming Insulating Layer Disposed Over The Semiconductor Die For Stress Relief
App 20130175696 - Lin; Yaojian ; et al. | 2013-07-11 |
Semiconductor Device and Method of Making Integrated Passive Devices
App 20130175668 - Lin; Yaojian ; et al. | 2013-07-11 |
Semiconductor Device and Method of Forming Insulating Layer Around Semiconductor Die
App 20130147019 - Lin; Yaojian ; et al. | 2013-06-13 |
Semiconductor device and method of forming insulating layer disposed over the semiconductor die for stress relief
Grant 8,456,002 - Lin , et al. June 4, 2 | 2013-06-04 |
Semiconductor device and method of forming an inductor within interconnect layer vertically separated from semiconductor die
Grant 8,445,990 - Lin , et al. May 21, 2 | 2013-05-21 |
Semiconductor package with semiconductor core structure and method of forming same
Grant 8,445,323 - Lin , et al. May 21, 2 | 2013-05-21 |
Method And System For Waking Up Node B Cell
App 20130114490 - Fang; Jianmin ; et al. | 2013-05-09 |
Semiconductor Device And Method Of Forming Insulating Layer Disposed Over The Semiconductor Die For Stress Relief
App 20130113092 - Lin; Yaojian ; et al. | 2013-05-09 |
Semiconductor device and method of making integrated passive devices
Grant 8,409,970 - Lin , et al. April 2, 2 | 2013-04-02 |
Semiconductor device and method of forming insulating layer around semiconductor die
Grant 8,409,926 - Lin , et al. April 2, 2 | 2013-04-02 |
Semiconductor Device and Method of Forming Interconnect Substration for FO-WLCSP
App 20130075936 - Lin; Yaojian ; et al. | 2013-03-28 |
Semiconductor Device and Method of Forming Protection and Support Structure for Conductive Interconnect Structure
App 20130069227 - Lin; Yaojian ; et al. | 2013-03-21 |
Semiconductor Device and Method of Forming Protection and Support Structure for Conductive Interconnect Structure
App 20130069225 - Lin; Yaojian ; et al. | 2013-03-21 |
Semiconductor Device and Method of Forming Repassivation Layer with Reduced Opening to Contact Pad of Semiconductor Die
App 20130056879 - Lin; Yaojian ; et al. | 2013-03-07 |
Method And System For Processing Cell Sleeping
App 20130053051 - Fang; Jianmin ; et al. | 2013-02-28 |
Semiconductor Device and Method for Forming Passive Circuit Elements With Through Silicon Vias to Backside Interconnect Structures
App 20130015554 - Lin; Yaojian ; et al. | 2013-01-17 |
Semiconductor device and method of forming repassivation layer with reduced opening to contact pad of semiconductor die
Grant 8,343,809 - Lin , et al. January 1, 2 | 2013-01-01 |
Semiconductor Device and Method of Forming a Conductive Via-in-Via Structure
App 20120326329 - Tay; Lionel Chien Hui ; et al. | 2012-12-27 |
Semiconductor Device and Method of Forming Bump Structure with Multi-Layer UBM Around Bump Formation Area
App 20120299176 - Lin; Yaojian ; et al. | 2012-11-29 |
Semiconductor Device and Method of Forming an IPD over a High-Resistivity Encapsulant Separated from other IPDS and Baseband Circuit
App 20120292738 - Lin; Yaojian ; et al. | 2012-11-22 |
Semiconductor device and method for forming passive circuit elements with through silicon vias to backside interconnect structures
Grant 8,310,058 - Lin , et al. November 13, 2 | 2012-11-13 |
Method and System for Mobility Parameter Negotiation Between Base Stations
App 20120264417 - Gao; Yin ; et al. | 2012-10-18 |
Semiconductor device and method of forming a conductive via-in-via structure
Grant 8,283,250 - Tay , et al. October 9, 2 | 2012-10-09 |
Semiconductor device and method of forming an IPD over a high-resistivity encapsulant separated from other IPDS and baseband circuit
Grant 8,263,437 - Lin , et al. September 11, 2 | 2012-09-11 |
Semiconductor Device and Method of Forming Sacrificial Protective Layer to Protect Semiconductor Die Edge During Singulation
App 20120199965 - Lin; Yaojian ; et al. | 2012-08-09 |
Semiconductor Device and Method of Forming a Fan-Out Structure with Integrated Passive Device and Discrete Component
App 20120187572 - Lin; Yaojian ; et al. | 2012-07-26 |
Semiconductor Package with Semiconductor Core Structure and Method of Forming Same
App 20120175732 - Lin; Yaojian ; et al. | 2012-07-12 |
Semiconductor Device and Method of Forming Vertical Interconnect Structure in Substrate for IPD and Baseband Circuit Separated by High-Resistivity Molding Compound
App 20120175784 - Lin; Yaojian ; et al. | 2012-07-12 |
Semiconductor Device and Method of Forming an Inductor Within Interconnect Layer Vertically Separated from Semiconductor Die
App 20120146181 - Lin; Yaojian ; et al. | 2012-06-14 |
Semiconductor Device and Method of Forming Openings Through Insulating Layer Over Encapsulant for Enhanced Adhesion of Interconnect Structure
App 20120146236 - Lin; Yaojian ; et al. | 2012-06-14 |
TACI-Fc fusion proteins, methods of making and uses thereof
Grant 8,193,316 - Fang , et al. June 5, 2 | 2012-06-05 |
Semiconductor package with semiconductor core structure and method of forming the same
Grant 8,193,604 - Lin , et al. June 5, 2 | 2012-06-05 |
Semiconductor device and method of forming a fan-out structure with integrated passive device and discrete component
Grant 8,183,087 - Lin , et al. May 22, 2 | 2012-05-22 |
Semiconductor device and method of forming sacrificial protective layer to protect semiconductor die edge during singulation
Grant 8,183,095 - Lin , et al. May 22, 2 | 2012-05-22 |
Semiconductor Device and Method of Forming Insulating Layer Disposed Over The Semiconductor Die For Stress Relief
App 20120112340 - Lin; Yaojian ; et al. | 2012-05-10 |
Method And Base Station For Determining An Initial Transmission Power
App 20120115532 - He; Feng ; et al. | 2012-05-10 |
Semiconductor device and method of forming vertical interconnect structure in substrate for IPD and baseband circuit separated by high-resistivity molding compound
Grant 8,168,470 - Lin , et al. May 1, 2 | 2012-05-01 |
Semiconductor Device and Method of Forming Protective Structure Around Semiconductor Die for Localized Planarization of Insulating Layer
App 20120074534 - Lin; Yaojian ; et al. | 2012-03-29 |
Semiconductor device and method of forming high-frequency circuit structure and method thereof
Grant 8,110,477 - Lin , et al. February 7, 2 | 2012-02-07 |
Semiconductor Device and Method of Forming RDL Wider than Contact Pad along First Axis and Narrower than Contact Pad Along Second Axis
App 20120018904 - Lin; Yaojian ; et al. | 2012-01-26 |
Semiconductor Device and Method of Forming RDL over Contact Pad with High Alignment Tolerance or Reduced Interconnect Pitch
App 20120018874 - Lin; Yaojian ; et al. | 2012-01-26 |
Semiconductor Device and Method of Forming Repassivation Layer with Reduced Opening to Contact Pad of Semiconductor Die
App 20110221055 - Lin; Yaojian ; et al. | 2011-09-15 |
Semiconductor Device and Method of Forming Insulating Layer Around Semiconductor Die
App 20110221041 - Lin; Yaojian ; et al. | 2011-09-15 |
Semiconductor Device and Method of Forming Sacrificial Protective Layer to Protect Semiconductor Die Edge During Singulation
App 20110221057 - Lin; Yaojian ; et al. | 2011-09-15 |
Semiconductor Device Having Embedded Integrated Passive Devices Electrically Interconnected Using Conductive Pillars
App 20110163414 - Lin; Yaojian ; et al. | 2011-07-07 |
Semiconductor Device and Method of Forming Bump Structure with Multi-Layer UBM Around Bump Formation Area
App 20110127668 - Lin; Yaojian ; et al. | 2011-06-02 |
Semiconductor device and method of embedding integrated passive devices into the package electrically interconnected using conductive pillars
Grant 7,935,570 - Lin , et al. May 3, 2 | 2011-05-03 |
Semiconductor Package with Semiconductor Core Structure and Method of Forming the Same
App 20110068468 - Lin; Yaojian ; et al. | 2011-03-24 |
Aav Vector Compositions And Methods For Enhanced Expression Of Immunoglobulins Using The Same
App 20110065779 - Fang; Jianmin ; et al. | 2011-03-17 |
Methods To Express Recombinant Proteins From Lentiviral Vectors
App 20110028694 - Fang; Jianmin ; et al. | 2011-02-03 |
Semiconductor package with semiconductor core structure and method of forming same
Grant 7,858,441 - Lin , et al. December 28, 2 | 2010-12-28 |
Compositions and methods for enhanced expression of recombinant polypeptides from a single vector using a peptide cleavage site
App 20100317096 - Fang; Jianmin ; et al. | 2010-12-16 |
Semiconductor Device and Method of Forming High-Frequency Circuit Structure and Method Thereof
App 20100264512 - Lin; Yaojian ; et al. | 2010-10-21 |
Semiconductor device and method of forming integrated passive device module
Grant 7,790,503 - Lin , et al. September 7, 2 | 2010-09-07 |
Angiogenesis-inhibiting Chimeric Proteins And The Use
App 20100215655 - FANG; Jianmin ; et al. | 2010-08-26 |
Semiconductor device and method of forming high-frequency circuit structure and method thereof
Grant 7,772,081 - Lin , et al. August 10, 2 | 2010-08-10 |
Semiconductor device with integrated passive circuit and method of making the same using sacrificial substrate
Grant 7,749,814 - Lin , et al. July 6, 2 | 2010-07-06 |
Angiogenesis-inhibiting chimeric protein and the use
Grant 7,750,138 - Fang , et al. July 6, 2 | 2010-07-06 |
Semiconductor Device and Method of Forming a Vertical Interconnect Structure for 3-D FO-WLCSP
App 20100148360 - Lin; Yaojian ; et al. | 2010-06-17 |
Regulated Expression Of Recombinant Proteins From Adeno-associated Viral Vectors
App 20100151523 - FANG; JIANMIN ; et al. | 2010-06-17 |
Semiconductor Device and Method of Forming Vertical Interconnect Structure in Substrate for IPD and Baseband Circuit Separated by High-Resistivity Molding Compound
App 20100140772 - Lin; Yaojian ; et al. | 2010-06-10 |
Semiconductor Device and Method of Embedding Integrated Passive Devices into the Package Electrically Interconnected Using Conductive Pillars
App 20100140736 - Lin; Yaojian ; et al. | 2010-06-10 |
Semiconductor Device and Method of Forming a Conductive Via-in-Via Structure
App 20100140751 - Tay; Lionel Chien Hui ; et al. | 2010-06-10 |
Semiconductor Package with Semiconductor Core Structure and Method of Forming Same
App 20100140779 - Lin; Yaojian ; et al. | 2010-06-10 |
Semiconductor Device and Method for Forming Passive Circuit Elements With Through Silicon Vias to Backside Interconnect Structures
App 20100140737 - Lin; Yaojian ; et al. | 2010-06-10 |
TACI-Fc Fusion Proteins, Methods of Making and Uses Thereof
App 20100136008 - Fang; Jianmin ; et al. | 2010-06-03 |
AAV vector compositions and methods for enhanced expression of immunoglobulins using the same
Grant 7,714,119 - Fang , et al. May 11, 2 | 2010-05-11 |
Compositions and methods for enhanced expression of recombinant polypeptides from a single vector using a peptide cleavage site
Grant 7,709,224 - Fang , et al. May 4, 2 | 2010-05-04 |
Semiconductor device and method for forming passive circuit elements with through silicon vias to backside interconnect structures
Grant 7,691,747 - Lin , et al. April 6, 2 | 2010-04-06 |
Semiconductor Device and Method of Forming High-Frequency Circuit Structure and Method Thereof
App 20100065942 - Lin; Yaojian ; et al. | 2010-03-18 |
Semiconductor Device and Method of Forming a Fan-Out Structure with Integrated Passive Device and Discrete Component
App 20100059855 - Lin; Yaojian ; et al. | 2010-03-11 |
Semiconductor Device and Method of Forming Shielding Layer over Integrated Passive Device Using Conductive Channels
App 20100059853 - Lin; Yaojian ; et al. | 2010-03-11 |
Semiconductor Device and Method of Forming an IPD over a High-Resistivity Encapsulant Separated from other IPDS and Baseband Circuit
App 20100059854 - Lin; Yaojian ; et al. | 2010-03-11 |
Compositions and methods for enhanced expression of recombinant polypeptides from a single vector using a peptide cleavage site
Grant 7,662,623 - Fang , et al. February 16, 2 | 2010-02-16 |
Semiconductor device and method of forming a vertical interconnect structure for 3-D FO-WLCSP
Grant 7,642,128 - Lin , et al. January 5, 2 | 2010-01-05 |
Methods to express recombinant proteins from lentiviral vectors
Grant 7,632,509 - Fang , et al. December 15, 2 | 2009-12-15 |
Cell specific replication-competent viral vectors comprising a self processing peptide cleavage site
App 20090270485 - Ko; Derek ; et al. | 2009-10-29 |
Semiconductor Device With Integrated Passive Circuit and Method of Making the Same Using Sacrificial Substrate
App 20090230542 - Lin; Yaojian ; et al. | 2009-09-17 |
Semiconductor Device and Method of Forming Integrated Passive Device Module
App 20090155959 - Lin; Yaojian ; et al. | 2009-06-18 |
Semiconductor Device and Method of Making Integrated Passive Devices
App 20090140421 - Lin; Yaojian ; et al. | 2009-06-04 |
Semiconductor Device and Method for Forming Passive Circuit Elements with Through Silicon Vias to Backside Interconnect Structures
App 20090140381 - Lin; Yaojian ; et al. | 2009-06-04 |
Compositions and methods for enhanced expression of immunoglobulins from a single vector using a peptide cleavage site
Grant 7,498,024 - Fang , et al. March 3, 2 | 2009-03-03 |
Compositions and methods for generating multiple polypeptides from a single vector using a virus derived peptide cleavage site, and uses thereof
Grant 7,485,291 - Fang , et al. February 3, 2 | 2009-02-03 |
Compositions and methods for enhanced expression of recombinant polypeptides from a single vector using a peptide cleavage site
App 20080280356 - Fang; Jianmin ; et al. | 2008-11-13 |
Regulated expression of recombinant proteins from adeno-associated viral vectors
App 20070292922 - Fang; Jianmin ; et al. | 2007-12-20 |
Methods to express recombinant proteins from lentiviral vectors
App 20070059820 - Fang; Jianmin ; et al. | 2007-03-15 |
AAV vector compositions and methods for enhanced expression of immunoglobulins using the same
App 20060034805 - Fang; Jianmin ; et al. | 2006-02-16 |
Cell specific replication-competent viral vectors comprising a self processing peptide cleavage site
App 20050136035 - Ko, Derek ; et al. | 2005-06-23 |
Compositions and methods for enhanced expression of recombinant polypeptides from a single vector using a peptide cleavage site
App 20050042721 - Fang, Jianmin ; et al. | 2005-02-24 |
Compositions and methods for enhanced expression of immunoglobulins from a single vector using a peptide cleavage site
App 20050003482 - Fang, Jianmin ; et al. | 2005-01-06 |
Compositions and methods for generating multiple polypeptides from a single vector using a virus derived peptide cleavage site, and uses thereof
App 20040265955 - Fang, Jianmin ; et al. | 2004-12-30 |
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