Fang; Chung-Wei
Patent Applications and Registrations
Patent applications and USPTO patent grants for Fang; Chung-Wei.The latest application filed is for "cvd apparatus with multi-zone thickness control".
- Fang; Chung-Wei - Hsinchu TW
| Patent | Date |
|---|---|
| CVD apparatus with multi-zone thickness control Grant 10,982,327 - Fang , et al. April 20, 2 | 2021-04-20 |
| CVD apparatus with multi-zone thickness control Grant 10,975,473 - Fang , et al. April 13, 2 | 2021-04-13 |
| Cvd Apparatus With Multi-zone Thickness Control App 20200017973 - Fang; Chung-Wei ; et al. | 2020-01-16 |
| Cvd Apparatus With Multi-zone Thickness Control App 20190360103 - Fang; Chung-Wei ; et al. | 2019-11-28 |
| CVD apparatus with multi-zone thickness control Grant 10,450,655 - Fang , et al. Oc | 2019-10-22 |
| Cvd Apparatus With Multi-zone Thickness Control App 20190127852 - Fang; Chung-Wei ; et al. | 2019-05-02 |
| Electromagnetic detection device and semiconductor manufacturing system Grant 9,953,888 - Fang , et al. April 24, 2 | 2018-04-24 |
uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.
While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.
All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.
| 