Fang; Chee Hong
Patent Applications and Registrations
Patent applications and USPTO patent grants for Fang; Chee Hong.The latest application filed is for "semiconductor package and method for fabricating a semiconductor package".
- Fang; Chee Hong - Ipoh MY
| Patent | Date |
|---|---|
| Semiconductor package and method for fabricating a semiconductor package Grant 10,490,470 - Chong , et al. Nov | 2019-11-26 |
| Method and apparatus for simultaneously encapsulating semiconductor dies with layered lead frame strips Grant 10,099,411 - Wang , et al. October 16, 2 | 2018-10-16 |
| Semiconductor package and method for fabricating a semiconductor package App 20180174935 - CHONG; Hock Heng ; et al. | 2018-06-21 |
| Method and Apparatus for Simultaneously Encapsulating Semiconductor Dies with Layered Lead Frame Strips App 20160339616 - Wang; Choon Huey ; et al. | 2016-11-24 |
| Molded flip-clip semiconductor package Grant 9,219,025 - Lee , et al. December 22, 2 | 2015-12-22 |
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