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name:-0.0046529769897461
name:-0.00040102005004883
Fan; Yuh-Da Patent Filings

Fan; Yuh-Da

Patent Applications and Registrations

Patent applications and USPTO patent grants for Fan; Yuh-Da.The latest application filed is for "cyclic epitaxial deposition and etch processes".

Company Profile
0.4.8
  • Fan; Yuh-Da - Shin Chu TW
  • FAN; Yuh-Da - Shin Chu City TW
  • Fan; Yuh-Da - Hsinchu City TW
  • Fan; Yuh-Da - Hsinchu TW
  • Fan, Yuh-Da - Tou-Wu Counery TW
  • Fan; Yuh-Da - Miao-Li TW
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Cyclic epitaxial deposition and etch processes
Grant 9,564,321 - Tsai , et al. February 7, 2
2017-02-07
Cyclic Epitaxial Deposition And Etch Processes
App 20140256119 - TSAI; Chun Hsiung ;   et al.
2014-09-11
Methods to completely eliminate or significantly reduce defects in copper metallization in IC manufacturing
App 20100099252 - Lin; Chun-Hung ;   et al.
2010-04-22
Methods to completely eliminate or significantly reduce defects in copper metallization in IC manufacturing
App 20080176397 - Lin; Chun-Hung ;   et al.
2008-07-24
Method for conductive film quality evaluation
Grant 7,262,067 - Feng , et al. August 28, 2
2007-08-28
Methods to completely eliminate or significantly reduce defects in copper metallization in IC manufacturing
App 20060094237 - Lin; Chun-Hung ;   et al.
2006-05-04
Method for conductive film quality evaluation
App 20050239221 - Feng, Hsien-Ping ;   et al.
2005-10-27
Method of removing metal etching residues following a metal etchback process to improve a CMP process
Grant 6,936,544 - Huang , et al. August 30, 2
2005-08-30
Interconnect structure and method for its fabricating
App 20050173799 - Jou, Juan-Jann ;   et al.
2005-08-11
Method of removing metal etching residues following a metal etchback process to improve a CMP process
App 20040178172 - Huang, Yai-Yei ;   et al.
2004-09-16
Method to calibrate the wafer transfer for oxide etcher (with clamp)
App 20020013056 - Chen, Ching-Ming ;   et al.
2002-01-31
Method to calibrate the wafer transfer for oxide etcher (with clamp)
Grant 6,303,509 - Chen , et al. October 16, 2
2001-10-16

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