| Patent | Date |
|---|
Colors only process to reduce package yield loss
Grant 7,816,169 - Fan , et al. October 19, 2 | 2010-10-19 |
Colors Only Process To Reduce Package Yield Loss
App 20090111208 - FAN; Yang-Tung ; et al. | 2009-04-30 |
Colors only process to reduce package yield loss
Grant 7,485,906 - Fan , et al. February 3, 2 | 2009-02-03 |
Colors only process to reduce package yield loss
App 20070120155 - Fan; Yang-Tung ; et al. | 2007-05-31 |
Colors only process to reduce package yield loss
Grant 7,183,598 - Fan , et al. February 27, 2 | 2007-02-27 |
Bumping process to increase bump height and to create a more robust bump structure
Grant 6,956,292 - Fan , et al. October 18, 2 | 2005-10-18 |
Method to form very a fine pitch solder bump using methods of electroplating
Grant 6,936,923 - Lin , et al. August 30, 2 | 2005-08-30 |
Colors only process to reduce package yield loss
App 20050121737 - Fan, Yang-Tung ; et al. | 2005-06-09 |
Colors only process to reduce package yield loss
Grant 6,876,049 - Fan , et al. April 5, 2 | 2005-04-05 |
Microelectronic fabrication with corrosion inhibited bond pad
Grant 6,765,277 - Chen , et al. July 20, 2 | 2004-07-20 |
Bumping process to increase bump height and to create a more robust bump structure
App 20040005771 - Fan, Yang-Tung ; et al. | 2004-01-08 |
Dual layer photoresist method for fabricating a mushroom bumping plating structure
Grant 6,649,507 - Chen , et al. November 18, 2 | 2003-11-18 |
Method to form a color image sensor cell while protecting the bonding pad structure from damage
Grant 6,632,700 - Fan , et al. October 14, 2 | 2003-10-14 |
Bumping process to increase bump height and to create a more robust bump structure
Grant 6,605,524 - Fan , et al. August 12, 2 | 2003-08-12 |
Microelectronic fabrication with corrosion inhibited bond pad
App 20030132497 - Chen, Yen-Ming ; et al. | 2003-07-17 |
Colors only process to reduce package yield loss
App 20030124763 - Fan, Yang-Tung ; et al. | 2003-07-03 |
Method for dual-layer polyimide processing on bumping technology
Grant 6,586,323 - Fan , et al. July 1, 2 | 2003-07-01 |
Method of forming a bump on a copper pad
Grant 6,583,039 - Chen , et al. June 24, 2 | 2003-06-24 |
Method Of Forming A Bump On A Copper Pad
App 20030073300 - Chen, Yen-Ming ; et al. | 2003-04-17 |
Multi-microlens design for semiconductor imaging devices to increase light collection efficiency in the color filter process
Grant 6,495,813 - Fan , et al. December 17, 2 | 2002-12-17 |
Method to achieve robust solder bump height
Grant 6,486,054 - Fan , et al. November 26, 2 | 2002-11-26 |
Colors only process to reduce package yield loss
Grant 6,482,669 - Fan , et al. November 19, 2 | 2002-11-19 |
Method to form bump in bumping technology
App 20020127836 - Lin, Kuo-Wei ; et al. | 2002-09-12 |
Method to form bump in bumping technology
Grant 6,426,281 - Lin , et al. July 30, 2 | 2002-07-30 |
Method For Bumping And Backlapping A Semiconductor Wafer
App 20020068425 - Chen, Yen-Ming ; et al. | 2002-06-06 |
High efficiency color filter process for semiconductor array imaging devices
Grant 6,274,917 - Fan , et al. August 14, 2 | 2001-08-14 |
Method for adding plasma treatment on bond pad to prevent bond pad staining problems
Grant 6,214,717 - Lan , et al. April 10, 2 | 2001-04-10 |
Image array optoelectronic microelectronic fabrication with enhanced optical stability and method for fabrication thereof
Grant 6,171,883 - Fan , et al. January 9, 2 | 2001-01-09 |
High efficiency color filter process for semiconductor array imaging devices
Grant 6,171,885 - Fan , et al. January 9, 2 | 2001-01-09 |
Fabrication of uniform areal sensitivity image array
Grant 6,168,966 - Fan , et al. January 2, 2 | 2001-01-02 |
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