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Patent applications and USPTO patent grants for Fan; Xuejun.The latest application filed is for "method and apparatus for providing double-sided cooling of leadframe-based wire-bonded electronic packages".
Patent | Date |
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Method and apparatus for providing double-sided cooling of leadframe-based wire-bonded electronic packages App 20070085173 - Fan; Xuejun | 2007-04-19 |
Thermal-efficient power converter enclosure for solar panels App 20060124167 - Fan; Xuejun ;   et al. | 2006-06-15 |
Junction temperatures measurements in semiconductor chip package technology Grant 6,853,944 - Fan February 8, 2 | 2005-02-08 |
Integrated circuit package including sealed gaps and prevention of vapor induced failures and method of manufacturing the same Grant 6,773,964 - Fan August 10, 2 | 2004-08-10 |
Junction temperatures measurements in semiconductor chip package technology App 20040083075 - Fan, Xuejun | 2004-04-29 |
Integrated circuit package including sealed gaps and prevention of vapor induced failures and method of manufacturing the same App 20040061127 - Fan, Xuejun | 2004-04-01 |
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