Fan; Wenya

Patent Applications and Registrations

Patent applications and USPTO patent grants for Fan; Wenya.The latest application filed is for "dopant ink compositions for forming doped regions in semiconductor substrates, and methods for fabricating dopant ink compositions".

Company Profile

0.8.15

Fan; Wenya - Campbell CA US
Fan; Wenya - Cupertino CA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Dopant Ink Compositions For Forming Doped Regions In Semiconductor Substrates, And Methods For Fabricating Dopant Ink Compositions App 20150126653 - Zhou; Ligui ; et al.	2015-05-07
Dopant ink compositions for forming doped regions in semiconductor substrates, and methods for fabricating dopant ink compositions Grant 8,975,170 - Zhou , et al. March 10, 2	2015-03-10
Boron-comprising Inks For Forming Boron-doped Regions In Semiconductor Substrates Using Non-contact Printing Processes And Methods For Fabricating Such Boron-comprising Inks App 20130240794 - Leung; Roger Yu-Kwan ; et al.	2013-09-19
Boron-comprising inks for forming boron-doped regions in semiconductor substrates using non-contact printing processes and methods for fabricating such boron-comprising inks Grant 8,518,170 - Leung , et al. August 27, 2	2013-08-27
Dopant Ink Compositions For Forming Doped Regions In Semiconductor Substrates, And Methods For Fabricating Dopant Ink Compositions App 20130098266 - Zhou; Ligui ; et al.	2013-04-25
Compositions for forming doped regions in semiconductor substrates, methods for fabricating such compositions, and methods for forming doped regions using such compositions Grant 8,324,089 - Leung , et al. December 4, 2	2012-12-04
Methods for simultaneously forming N-type and P-type doped regions using non-contact printing processes Grant 7,951,696 - Leung , et al. May 31, 2	2011-05-31
Repair and restoration of damaged dielectric materials and films Grant 7,915,181 - Fan , et al. March 29, 2	2011-03-29
Compositions For Forming Doped Regions In Semiconductor Substrates, Methods For Fabricating Such Compositions, And Methods For Forming Doped Regions Using Such Compositions App 20110021012 - Leung; Roger Yu-Kwan ; et al.	2011-01-27
Boron-comprising Inks For Forming Boron-doped Regions In Semiconductor Substrates Using Non-contact Printing Processes And Methods For Fabricating Such Boron-comprising Inks App 20100162920 - Leung; Roger Yu-Kwan ; et al.	2010-07-01
Methods For Simultaneously Forming N-type And P-type Doped Regions Using Non-contact Printing Processes App 20100081264 - Leung; Roger Yu-Kwan ; et al.	2010-04-01
Methods For Forming Doped Regions In A Semiconductor Material App 20100035422 - Leung; Roger Yu-Kwan ; et al.	2010-02-11
Methods For Forming Doped Regions In Semiconductor Substrates Using Non-contact Printing Processes And Dopant-comprising Inks For Forming Such Doped Regions Using Non-contact Printing Processes App 20090239363 - Leung; Roger Yu-Kwan ; et al.	2009-09-24
Thermal Interface Materials, Methods Of Production And Uses Thereof App 20090111925 - Burnham; Kikue S. ; et al.	2009-04-30
Methods Of Making Low-refractive Index And/or Low-k Organosilicate Coatings App 20090026924 - Leung; Roger Y. ; et al.	2009-01-29
Repair and restoration of damaged dielectric materials and films App 20060141641 - Fan; Wenya ; et al.	2006-06-29
Electrical properties of shallow trench isolation materials via high temperature annealing in the presence of reactive gases App 20060051929 - Jin; Lei ; et al.	2006-03-09
Interlayer adhesion promoter for low k materials App 20050173803 - Lu, Victor ; et al.	2005-08-11
Nanoporous material fabricated using a dissolvable reagent Grant 6,214,746 - Leung , et al. April 10, 2	2001-04-10

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