Fan; Wen-Jeng

Patent Applications and Registrations

Patent applications and USPTO patent grants for Fan; Wen-Jeng.The latest application filed is for "semiconductor package and manufacturing method thereof".

Company Profile

3.42.69

Fan; Wen-Jeng - Hsinchu County TW
FAN; Wen-Jeng - Hsinchu TW
FAN; Wen-Jeng - Hukou Shiang TW
FAN; Wen-Jeng - Hukou TW
Fan; Wen-Jeng - US

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor package with conductive via in encapsulation connecting to conductive element Grant 11,257,747 - Fan , et al. February 22, 2	2022-02-22
Semiconductor Package And Manufacturing Method Thereof App 20200357770 - Chiang; Chia-Wei ; et al.	2020-11-12
Semiconductor Package And Manufacturing Method Thereof App 20200335456 - Fan; Wen-Jeng	2020-10-22
Semiconductor Package And Manufacturing Method Thereof App 20200328144 - Fan; Wen-Jeng ; et al.	2020-10-15
Package Structure And Manufacturing Method Thereof App 20200243449 - Chiang; Chia-Wei ; et al.	2020-07-30
Semiconductor Package And Manufacturing Method Thereof App 20200243461 - Chiang; Chia-Wei ; et al.	2020-07-30
Semiconductor package with a conductive casing for heat dissipation and electromagnetic interference (EMI) shield and manufacturing method thereof Grant 10,593,629 - Chiang , et al.	2020-03-17
Semiconductor Package And Manufacturing Method Thereof App 20200013721 - Chiang; Chia-Wei ; et al.	2020-01-09
Semiconductor Package And Manufacturing Method Thereof App 20200006274 - Chiang; Chia-Wei ; et al.	2020-01-02
Semiconductor package and manufacturing method thereof Grant 10,431,549 - Huang , et al. O	2019-10-01
Semiconductor Package And Manufacturing Method Thereof App 20190244943 - Fan; Wen-Jeng	2019-08-08
Semiconductor Package And Manufacturing Method Thereof App 20190214347 - Huang; Chien-Wen ; et al.	2019-07-11
Semiconductor Device Package With Stress Relief Layer App 20180182682 - Fan; Wen-Jeng	2018-06-28
Method and device of pop stacking for preventing bridging of interposer solder balls Grant 9,991,248 - Fan June 5, 2	2018-06-05
Method And Device Of Pop Stacking For Preventing Bridging Of Interposer Solder Balls App 20180019235 - Fan; Wen-Jeng	2018-01-18
Semiconductor device package with reinforced redistribution layer Grant 9,859,233 - Fan January 2, 2	2018-01-02
Semiconductor device with stacking chips Grant 9,853,015 - Fan December 26, 2	2017-12-26
Substrate-less package structure Grant 9,837,385 - Fan December 5, 2	2017-12-05
Fan-out Back-to-back Chip Stacked Packages And The Method For Manufacturing The Same App 20170229426 - HUNG; Ching Wei ; et al.	2017-08-10
Package Structure App 20160163624 - Fan; Wen-Jeng	2016-06-09
Package structure Grant 9,324,651 - Fan April 26, 2	2016-04-26
Leadframe-type semiconductor package having EMI shielding layer connected to ground Grant 8,853,834 - Fan , et al. October 7, 2	2014-10-07
Leadframe-type Semiconductor Package Having Emi Shielding Layer Connected To Ground App 20140167231 - FAN; Wen-Jeng ; et al.	2014-06-19
Semiconductor package utilizing tape to reinforce fixing of leads to die pad Grant 8,541,870 - Fan , et al. September 24, 2	2013-09-24
Method for forming an EMI shielding layer on all surfaces of a semiconductor package Grant 8,420,437 - Fan April 16, 2	2013-04-16
Multi-chip stacked package and its mother chip to save interposer Grant 8,304,917 - Fan , et al. November 6, 2	2012-11-06
Lead frame package structure for side-by-side disposed chips Grant 8,299,587 - Fan October 30, 2	2012-10-30
Semiconductor Package Having Interconnection Of Dual Parallel Wires App 20120228759 - FAN; Wen-Jeng	2012-09-13
Method for forming an isolated inner lead from a leadframe Grant 8,240,029 - Fan , et al. August 14, 2	2012-08-14
Ball Grid Array Package App 20120049359 - FAN; Wen-Jeng	2012-03-01
Substrate panel having a plurality of substrate strips for semiconductor packages Grant 8,053,676 - Fan November 8, 2	2011-11-08
Semiconductor package having isolated inner lead Grant 8,049,339 - Fan , et al. November 1, 2	2011-11-01
Lead Frame Package Structure For Side-by-side Disposed Chips App 20110260306 - FAN; Wen-Jeng	2011-10-27
Substrate And Flip Chip Package With Gradational Pad Pitches App 20110169157 - FAN; Wen-Jeng	2011-07-14
Wafer level packaging method Grant 7,972,904 - Fan July 5, 2	2011-07-05
Multi-chip Stacked Package And Its Mother Chip To Save Interposer App 20110133324 - FAN; Wen-Jeng ; et al.	2011-06-09
Substrate strip for semiconductor packages Grant 7,952,168 - Fan May 31, 2	2011-05-31
Semiconductor packaging method to save interposer Grant 7,927,919 - Fan , et al. April 19, 2	2011-04-19
Circuit board ready to slot Grant 7,919,715 - Fan April 5, 2	2011-04-05
Laminate substrate and semiconductor package utilizing the substrate Grant 7,919,851 - Fan April 5, 2	2011-04-05
Semiconductor package having stepwise depression in substrate Grant 7,902,663 - Fan March 8, 2	2011-03-08
Semiconductor device with wire-bonding on multi-zigzag fingers Grant 7,821,112 - Fan , et al. October 26, 2	2010-10-26
Wafer Level Packaging Method App 20100261315 - FAN; Wen-Jeng	2010-10-14
Method for fabricating wafer level chip scale packages Grant 7,776,649 - Fan August 17, 2	2010-08-17
Lead-on-chip semiconductor package and leadframe for the package Grant 7,750,444 - Fan , et al. July 6, 2	2010-07-06
Window Ball Grid Array Substrate And Its Package Structure App 20100147565 - Fan; Wen-Jeng ; et al.	2010-06-17
Window type BGA semiconductor package and its substrate Grant 7,732,921 - Fan , et al. June 8, 2	2010-06-08
Semiconductor Package Having Isolated Inner Lead App 20100127362 - FAN; Wen-Jeng ; et al.	2010-05-27
Semiconductor package with leads on a chip having multi-row of bonding pads Grant 7,723,828 - Fan , et al. May 25, 2	2010-05-25
Method For Forming An Isolated Inner Lead From A Leadframe App 20100122454 - Fan; Wen-Jeng ; et al.	2010-05-20
POP (package-on-package) semiconductor device Grant 7,696,618 - Fan April 13, 2	2010-04-13
Substrate and semiconductor package for lessening warpage Grant 7,692,313 - Fan April 6, 2	2010-04-06
Mold array process for semiconductor packages Grant 7,691,676 - Fan , et al. April 6, 2	2010-04-06
POP (package-on-package) device encapsulating soldered joints between external leads Grant 7,692,311 - Fan , et al. April 6, 2	2010-04-06
IC package with a protective encapsulant and a stiffening encapsulant Grant 7,675,186 - Chen , et al. March 9, 2	2010-03-09
Leadframe-based semiconductor package Grant 7,667,306 - Fan February 23, 2	2010-02-23
Substrate Panel App 20100038118 - Fan; Wen-Jeng	2010-02-18
Universal Substrate For Semiconductor Packages And The Packages App 20100019373 - FAN; Wen-Jeng	2010-01-28
Semiconductor package having plural chips side by side arranged on a leadframe Grant 7,633,143 - Fan December 15, 2	2009-12-15
Col (chip-on-lead) Multi-chip Package App 20090302441 - Fan; Wen-Jeng	2009-12-10
Laminate Substrate And Semiconductor Package Utilizing The Substrate App 20090302485 - FAN; Wen-Jeng	2009-12-10
COL (Chip-On-Lead) multi-chip package Grant 7,622,794 - Fan November 24, 2	2009-11-24
Lead-on-chip Semiconductor Package And Leadframe For The Package App 20090283878 - FAN; Wen-Jeng ; et al.	2009-11-19
Semiconductor package-on-package (POP) device avoiding crack at solder joints of micro contacts during package stacking Grant 7,619,305 - Fan , et al. November 17, 2	2009-11-17
Semiconductor Package Enhancing Variation Of Movability At Ball Terminals App 20090278256 - FAN; Wen-Jeng	2009-11-12
Method for forming a die-attach layer during semiconductor packaging processes Grant 7,605,018 - Fan October 20, 2	2009-10-20
Window Type Bga Semiconductor Package And Its Substrate App 20090243099 - FAN; Wen-Jeng ; et al.	2009-10-01
Substrate Panel App 20090223435 - FAN; Wen-Jeng ; et al.	2009-09-10
Semiconductor Device With Wire-bonding On Multi-zigzag Fingers App 20090224377 - Fan; Wen-Jeng ; et al.	2009-09-10
Non-planar Substrate Strip And Semiconductor Packaging Method Utilizing The Substrate Strip App 20090224412 - FAN; Wen-Jeng	2009-09-10
Substrate Strip For Semiconductor Packages App 20090224395 - FAN; Wen-Jeng	2009-09-10
Substrate And Semiconductor Package For Lessening Warpage App 20090224397 - FAN; Wen-Jeng	2009-09-10
Method For Die Bonding Having Pick-and-probing Feature App 20090227048 - FANG; Li-Chih ; et al.	2009-09-10
Pillar-to-pillar flip-chip assembly Grant 7,569,935 - Fan August 4, 2	2009-08-04
Stacked assembly of semiconductor packages with fastening lead-cut ends of leadframe Grant 7,566,963 - Fan July 28, 2	2009-07-28
Circuit Board Ready To Slot App 20090173528 - FAN; Wen-Jeng	2009-07-09
Method for forming a die-attach layer during semiconductor packaging processes App 20090176334 - Fan; Wen-Jeng	2009-07-09
Substrate package structure App 20090160041 - Fan; Wen-Jeng	2009-06-25
Semiconductor package with leads on a chip having multi-row of bonding pads App 20090160038 - Fan; Wen-Jeng ; et al.	2009-06-25
Wiring substrate with improvement in tensile strength of traces Grant 7,547,974 - Fan June 16, 2	2009-06-16
Chip packaging process including simpification and mergence of burn-in test and high temperature test App 20090137069 - Fang; Li-Chih ; et al.	2009-05-28
Stacked assembly of semiconductor packages with fastening lead-cut ends of leadframe App 20090127678 - Fan; Wen-Jeng	2009-05-21
POP (Package-On-Package) device encapsulating soldered joints between externals leads App 20090127679 - Fan; Wen-Jeng ; et al.	2009-05-21
POP (package-on-package) semiconductor device App 20090127687 - Fan; Wen-Jeng	2009-05-21
Semiconductor package and substrate for the same App 20090096070 - Fan; Wen-Jeng ; et al.	2009-04-16
Stackable semiconductor package having plural pillars per pad App 20090091026 - Fan; Wen-Jeng	2009-04-09
Semiconductor package having restraining ring surfaces against soldering crack App 20090091027 - Fan; Wen-Jeng	2009-04-09
Semiconductor package-on-package (POP) device avoiding crack at solder joints of micro contacts during package stacking App 20090045523 - Fan; Wen-Jeng ; et al.	2009-02-19
Mounting assembly of semiconductor packages prevent soldering defects caused by substrate warpage App 20090039490 - Fan; Wen-Jeng	2009-02-12
Memory module capable of lessening shock stress App 20090026599 - Fan; Wen-Jeng	2009-01-29
Substrate improving immobilization of ball pads for BGA packages Grant 7,479,704 - Fan January 20, 2	2009-01-20
Semiconductor package App 20080296751 - Fan; Wen-Jeng	2008-12-04
Package substrate and its solder pad App 20080272489 - Fang; Li-Chih ; et al.	2008-11-06
Ball grid array package and its substrate App 20080237855 - Fan; Wen-Jeng ; et al.	2008-10-02
Anti-Impact memory module App 20080179731 - Fan; Wen-Jeng	2008-07-31
Lead frame for chip packages with wire-bonding at single-side pads App 20080179720 - Fan; Wen-Jeng ; et al.	2008-07-31
IC chip package with near substrate scale chip attachment App 20080169551 - Fan; Wen-Jeng ; et al.	2008-07-17
Substrate improving immobilization of ball pads for BGA packages App 20080164610 - Fan; Wen-Jeng	2008-07-10
Memory module for improving impact resistance App 20080157334 - Fan; Wen-Jeng	2008-07-03
Wiring substrate with improvement in tensile strength of traces App 20080142985 - Fan; Wen-Jeng	2008-06-19
IC package keeping attachment level of leads on chip during molding process App 20080116547 - Fan; Wen-Jeng	2008-05-22
Mold array process for chip encapsulation and substrate strip utilized App 20080119012 - Fan; Wen-Jeng	2008-05-22
BGA package with encapsulation on bottom of substrate App 20080116574 - Fan; Wen-Jeng	2008-05-22
Ball grid array package structure App 20080099890 - Chen; Cheng-Pin ; et al.	2008-05-01
IC package App 20080054494 - Chen; Cheng-Ping ; et al.	2008-03-06
Map type semiconductor package App 20080057622 - Fan; Wen-Jeng	2008-03-06
Ball grind array package structure App 20070278671 - Fan; Wen-Jeng	2007-12-06
Package structure to reduce warpage App 20070257345 - Fan; Wen-Jeng ; et al.	2007-11-08
Structure of electronic package and printed circuit board thereof App 20070252252 - Fan; Wen-Jeng	2007-11-01
Ball Grid array package structure App 20070246814 - Fan; Wen-Jeng ; et al.	2007-10-25

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