Fan; Haibo

Patent Applications and Registrations

Patent applications and USPTO patent grants for Fan; Haibo.The latest application filed is for "scan body with snap-in retention capability".

Company Profile

7.9.12

Fan; Haibo - Woodbridge CT
Fan; Haibo - Hong Kong HK
Fan; Haibo - Kwai Chung HK
FAN; Haibo - Nijmegen NL
Fan; Haibo - XinAn Town CN
Fan; Haibo - Lincoln NE

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Snap-coupling temporary abutment mount for dental prosthesis Grant 10,912,631 - Fan , et al. February 9, 2	2021-02-09
Semiconductor device and method with clip arrangement in IC package Grant 10,825,757 - Fan , et al. November 3, 2	2020-11-03
Electronic device Grant 10,658,274 - Boettcher , et al.	2020-05-19
Scan body with snap-in retention capability Grant 10,433,936 - Fan , et al. O	2019-10-08
Scan Body With Snap-in Retention Capability App 20190274789 - FAN; Haibo ; et al.	2019-09-12
Electronic Device App 20190189545 - BOETTCHER; Tim ; et al.	2019-06-20
Surface Mount Semiconductor Device and Method of Manufacture App 20190067033 - YANDOC; Ricardo ; et al.	2019-02-28
Coping System With Snap-in Retention Capability App 20180235734 - FAN; Haibo ; et al.	2018-08-23
Snap-coupling Temporary Abutment Mount For Dental Prosthesis App 20180200030 - FAN; Haibo ; et al.	2018-07-19
Semiconductor Device And Method With Clip Arrangement In Ic Package App 20180174951 - Fan; Haibo ; et al.	2018-06-21
Scan Body With Snap-in Retention Capability App 20170151038 - FAN; Haibo ; et al.	2017-06-01
Apparatus having an embedded 3D hybrid integration for optoelectronic interconnects Grant 9,057,853 - Lau , et al. June 16, 2	2015-06-16
Apparatus having thermal-enhanced and cost-effective 3D IC integration structure with through silicon via interposers Grant 8,604,603 - Lau , et al. December 10, 2	2013-12-10
Article Of Clothing Having An Electrically Conductive Assembly App 20130020304 - Zainzinger; Erich ; et al.	2013-01-24
Apparatus having thermal-enhanced and cost-effective 3D IC integration structure with through silicon via interposers App 20100213600 - Lau; Hon Shing ; et al.	2010-08-26
Apparatus Having an Embedded 3D Hybrid Integration for Optoelectronic Interconnects App 20100215314 - Lau; Hon Shing ; et al.	2010-08-26
Water heater with cross-sectionally elongated raw fuel jet pilot orifice Grant 7,387,089 - Peart , et al. June 17, 2	2008-06-17
Water heater with cross-sectionally elongated raw fuel jet pilot orifice App 20060207524 - Peart; Jacob A. ; et al.	2006-09-21

uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.

While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.

All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.