Fan; Chun-Liang
Patent Applications and Registrations
Patent applications and USPTO patent grants for Fan; Chun-Liang.The latest application filed is for "process of ultra thick trench etch with multi-slope profile".
- Fan; Chun-Liang - Tainan TW
- Fan; Chun-Liang - Tainan City TW
- Fan; Chun-Liang - Yung Kong TW
| Patent | Date |
|---|---|
| Process of ultra thick trench etch with multi-slope profile Grant 8,884,441 - Hsueh , et al. November 11, 2 | 2014-11-11 |
| Process of Ultra Thick Trench Etch with Multi-Slope Profile App 20140231955 - Hsueh; Chih-Hung ; et al. | 2014-08-21 |
| Method for dual-damascene formation using a via plug Grant 6,764,810 - Ma , et al. July 20, 2 | 2004-07-20 |
| Method for dual-damascene formation using a via plug App 20030203321 - Ma, Ching-Tien ; et al. | 2003-10-30 |
| Method for forming a trench power metal-oxide semiconductor transistor Grant 6,080,627 - Fan , et al. June 27, 2 | 2000-06-27 |
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