loadpatents
name:-0.020899057388306
name:-0.016282796859741
name:-0.00047683715820312
Fan; Chonglun Patent Filings

Fan; Chonglun

Patent Applications and Registrations

Patent applications and USPTO patent grants for Fan; Chonglun.The latest application filed is for "silver plating in electronics manufacture".

Company Profile
0.15.14
  • Fan; Chonglun - Portland OR
  • Fan; Chonglun - Bridgewater NJ
  • Fan; Chonglun - Hillsboro OR
  • Fan; Chonglun - Hillshoro OR
  • Fan; Chonglun - Township of Bridgewater Somerset County
  • Fan; Chonglun - Basking Ridge NJ
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Silver plating in electronics manufacture
Grant 9,730,321 - Yau , et al. August 8, 2
2017-08-08
Electrolytic deposition of metal-based composite coatings comprising nano-particles
Grant 9,217,205 - Abys , et al. December 22, 2
2015-12-22
Silver Plating In Electronics Manufacture
App 20150257264 - Yau; Yung-Herng ;   et al.
2015-09-10
Silver plating in electronics manufacture
Grant 8,986,434 - Yau , et al. March 24, 2
2015-03-24
Metallic surface enhancement
Grant 8,741,390 - Abys , et al. June 3, 2
2014-06-03
Silver Plating In Electronics Manufacture
App 20130180768 - Yau; Yung-Herng ;   et al.
2013-07-18
Silver plating in electronics manufacture
Grant 8,349,393 - Yau , et al. January 8, 2
2013-01-08
Metallic surface enhancement
Grant 7,883,738 - Abys , et al. February 8, 2
2011-02-08
Electrolytic Deposition Of Metal-based Composite Coatings Comprising Nano-particles
App 20100294669 - Abys; Joseph A. ;   et al.
2010-11-25
Metallic Surface Enhancement
App 20100151263 - Abys; Joseph A. ;   et al.
2010-06-17
Preserving Solderability and Inhibiting Whisker Growth in Tin Surfaces of Electronic Components
App 20080261071 - Xu; Chen ;   et al.
2008-10-23
Metallic Surface Enhancement
App 20080261025 - Abys; Joseph A. ;   et al.
2008-10-23
Silver plating in electronics manufacture
App 20060024430 - Yau; Yung-Herng ;   et al.
2006-02-02
Corrosion resistance enhancement of tin surfaces
App 20050268991 - Fan, Chonglun ;   et al.
2005-12-08
Preserving solderability and inhibiting whisker growth in tin surfaces of electronic components
App 20050249969 - Xu, Chen ;   et al.
2005-11-10
Whisker inhibition in tin surfaces of electronic components
App 20050249968 - Xu, Chen ;   et al.
2005-11-10
Multi-purpose finish for printed wiring boards and method of manufacture of such boards
Grant 6,534,192 - Abys , et al. March 18, 2
2003-03-18
Method of manufacture of printed wiring boards having multi-purpose finish
Grant 6,517,893 - Abys , et al. February 11, 2
2003-02-11
Metal article coated with tin or tin alloy under tensile stress to inhibit whisker growth
App 20030025182 - Abys, Joseph A. ;   et al.
2003-02-06
Metal article coated with near-surface doped tin or tin alloy
App 20020192492 - Abys, Joseph Anthony ;   et al.
2002-12-19
Metal article coated with multilayer finish inhibiting whisker growth
App 20020185716 - Abys, Joseph Anthony ;   et al.
2002-12-12
Ultra-thin composite surface finish for electronic packaging
Grant 6,452,258 - Abys , et al. September 17, 2
2002-09-17
Conformable nickel coating and process for coating an article with a conformable nickel coating
Grant 6,399,220 - Abys , et al. June 4, 2
2002-06-04
Multi-purpose finish for printed wiring boards and method of manufacture of such boards
App 20020015782 - Abys, Joseph A. ;   et al.
2002-02-07
Metal article coated with multilayer surface finish for porosity reduction
Grant 6,335,107 - Abys , et al. January 1, 2
2002-01-01
Electrodeposited precious metal finishes having wear resistant particles therein
Grant 6,274,254 - Abys , et al. August 14, 2
2001-08-14
Palladium surface coating suitable for wirebonding and process for forming palladium surface coatings
Grant 6,139,977 - Abys , et al. October 31, 2
2000-10-31

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