Fan; Chih-Peng
Patent Applications and Registrations
Patent applications and USPTO patent grants for Fan; Chih-Peng.The latest application filed is for "electrical connector and method of making it".
- Fan; Chih-Peng - Tao-Yuan City CA TW
- Fan; Chih-Peng - Taoyuan TW
- Fan; Chih-Peng - Taoyuan County TW
- Fan; Chih-Peng - Taoyuan City TW
- Fan; Chih-Peng - Bade City TW
- Fan; Chih Peng - Hsinchu TW
- Fan, Chih-Peng - Taipei Hsien TW
| Patent | Date |
|---|---|
| Electrical Connector and Method of Making It App 20170194721 - Fan; Chih-Peng ; et al. | 2017-07-06 |
| Electrical Connector for USB and other external interface and method of making App 20160380372 - Hsieh; Ching-Ho ; et al. | 2016-12-29 |
| Connector Grant 9,420,690 - Fan , et al. August 16, 2 | 2016-08-16 |
| Manufacturing method of connector Grant 9,370,099 - Fan , et al. June 14, 2 | 2016-06-14 |
| Electrical connector Grant 9,184,520 - Fan , et al. November 10, 2 | 2015-11-10 |
| Manufacturing Method Of Connector App 20150289377 - FAN; CHIH-PENG ; et al. | 2015-10-08 |
| Connector App 20150289374 - Fan; Chih-Peng ; et al. | 2015-10-08 |
| Electrical Connector App 20140335705 - Fan; Chih-Peng ; et al. | 2014-11-13 |
| Electrical Connector App 20140335706 - Fan; Chih-Peng ; et al. | 2014-11-13 |
| Connector And Fabrication Method Thereof App 20130029500 - Fan; Chih-Peng ; et al. | 2013-01-31 |
| Package substrate having embedded capacitor Grant 8,289,725 - Fan October 16, 2 | 2012-10-16 |
| Method of making a circuit structure Grant 8,186,049 - Fan , et al. May 29, 2 | 2012-05-29 |
| Circuit Structure App 20120073867 - Fan; Chih-Peng ; et al. | 2012-03-29 |
| Composite circuit substrate structure Grant 7,906,200 - Tseng , et al. March 15, 2 | 2011-03-15 |
| Package Substrate Having Embedded Capacitor App 20100319973 - Fan; Chih-Peng | 2010-12-23 |
| Package Substrate Having Embedded Capacitor App 20100319970 - Fan; Chih-Peng | 2010-12-23 |
| Package Substrate Having Embedded Capacitor App 20100294553 - Fan; Chih-Peng | 2010-11-25 |
| Composite Circuit Substrate Structure App 20100215927 - Tseng; Tzyy-Jang ; et al. | 2010-08-26 |
| Chip package carrier and fabrication method thereof Grant 7,700,986 - Huang , et al. April 20, 2 | 2010-04-20 |
| Build-up printed circuit board structure for increasing fine circuit density and method of manufacturing the same App 20100044083 - Fan; Chih-Peng | 2010-02-25 |
| Chip Package Carrier And Fabrication Method Thereof App 20100013068 - Huang; Han-Pei ; et al. | 2010-01-21 |
| Circuit Structure And Manufacturing Method Thereof App 20090288858 - Fan; Chih-Peng ; et al. | 2009-11-26 |
| Circuit Substrate App 20090008135 - Fan; Chih-Peng | 2009-01-08 |
| Scalable QAM system and method Grant 7,471,640 - Huang , et al. December 30, 2 | 2008-12-30 |
| Circuit Substrate And Surface Treatment Process Thereof App 20080160334 - Fan; Chih-Peng | 2008-07-03 |
| Package Substrate Having Embedded Capacitor App 20080121417 - Fan; Chih-Peng | 2008-05-29 |
| Method of laminating copper foil onto a printed circuit board App 20050098262 - Lin, Chia-Pin ; et al. | 2005-05-12 |
| Scalable QAM system and method App 20050100050 - Huang, Cheng-Yi ; et al. | 2005-05-12 |
| Method of fabricating inter-layer solid conductive rods Grant 6,749,737 - Cheng , et al. June 15, 2 | 2004-06-15 |
| Method of forming IC package having upward-facing chip cavity Grant 6,709,897 - Cheng , et al. March 23, 2 | 2004-03-23 |
| Automatically adjusting gain/bandwidth loop filter Grant 6,696,886 - Ke , et al. February 24, 2 | 2004-02-24 |
| Method of forming IC package having upward-facing chip cavity App 20030134455 - Cheng, Jao-Chin ; et al. | 2003-07-17 |
| Method of fabricating inter-layer solid conductive rods App 20030029729 - Cheng, Jao-Chin ; et al. | 2003-02-13 |
| Method of forming IC package having downward-facing chip cavity Grant 6,506,632 - Cheng , et al. January 14, 2 | 2003-01-14 |
| Method of laminating copper foil onto a printed circuit board App 20030006007 - Lin, Chia-Pin ; et al. | 2003-01-09 |
| Method of forming micro-via Grant 6,395,633 - Cheng , et al. May 28, 2 | 2002-05-28 |
uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.
While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.
All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.
| 