Fan; Chen-Chuan

Patent Applications and Registrations

Patent applications and USPTO patent grants for Fan; Chen-Chuan.The latest application filed is for "substrate structure and package structure using the same".

Company Profile

0.6.5

Fan; Chen-Chuan - Kaohsiung TW
FAN; Chen-Chuan - Dali City TW
Fan; Chen-Chuan - Dali N/A TW
Fan; Chen-Chuan - Tainan County TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Substrate structure and package structure using the same Grant 9,578,737 - Chen , et al. February 21, 2	2017-02-21
Substrate Structure And Package Structure Using The Same App 20140144683 - CHEN; Kuo-Hua ; et al.	2014-05-29
Substrate structure and package structure using the same Grant 8,665,605 - Chen , et al. March 4, 2	2014-03-04
Wafer-level semiconductor device packages with electromagnetic interference shielding Grant 8,378,466 - Chiu , et al. February 19, 2	2013-02-19
Semiconductor device packages with electromagnetic interference shielding Grant 8,212,339 - Liao , et al. July 3, 2	2012-07-03
Wafer-Level Semiconductor Device Packages with Electromagnetic Interference Shielding App 20110115060 - Chiu; Chi-Tsung ; et al.	2011-05-19
Semiconductor Device Packages With Electromagnetic Interference Shielding App 20100207259 - Liao; Kuo-Hsien ; et al.	2010-08-19
Substrate Structure And Package Structure Using The Same App 20100206622 - Chen; Kuo-Hua ; et al.	2010-08-19
Manufacturing Method For Package Structure App 20100184255 - LIU; Chien ; et al.	2010-07-22

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