Falola; Bamidele Daniel
Patent Applications and Registrations
Patent applications and USPTO patent grants for Falola; Bamidele Daniel.The latest application filed is for "integrated circuit die package stiffeners of metal alloys having exceptionally high cte".
- Falola; Bamidele Daniel - Chandler AZ
| Patent | Date |
|---|---|
| Integrated Circuit Die Package Stiffeners Of Metal Alloys Having Exceptionally High Cte App 20220285288 - Ouvarov-Bancalero; Valery ; et al. | 2022-09-08 |
| Integrated Circuit Heat Spreader Including Sealant Interface Material App 20210398871 - Eid; Feras ; et al. | 2021-12-23 |
| Integrated Heat Spreader (ihs) With Heating Element App 20210013117 - Li; Peng ; et al. | 2021-01-14 |
| Channeled Lids For Integrated Circuit Packages App 20200395269 - Dubey; Manish ; et al. | 2020-12-17 |
| Lids For Integrated Circuit Packages With Solder Thermal Interface Materials App 20200388554 - Falola; Bamidele Daniel ; et al. | 2020-12-10 |
| Solder Thermal Interface Material (stim) With Dopant App 20200357764 - Das Mahapatra; Susmriti ; et al. | 2020-11-12 |
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