Fallon; Kenneth M.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Fallon; Kenneth M..The latest application filed is for "image sensor positioning system and method".

Company Profile

0.8.6

Fallon; Kenneth M. - Rochester NY
FALLON, KENNETH M. - VESTAL NY
Fallon; Kenneth M. - Johnson City NY

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method of constructing a liquid crystal display element that includes dispensing an optical grade adhesive to fill vias in a transparent substrate Grant 6,924,866 - Fallon , et al. August 2, 2	2005-08-02
Image sensor positioning system and method App 20040121503 - Ferland, Albert ; et al.	2004-06-24
Apparatus for introducing a fluid into vias formed in a liquid crystal display element Grant 6,674,506 - Fallon , et al. January 6, 2	2004-01-06
Method of delivering fluid into constricted openings free of voids Grant 6,619,334 - Fallon , et al. September 16, 2	2003-09-16
Method of constructing a liquid crystal display element or similar article of manufacture App 20030098941 - Fallon, Kenneth M. ; et al.	2003-05-29
Apparatus for introducing a fluid into vias formed in a liquid crystal display element App 20030098942 - Fallon, Kenneth M. ; et al.	2003-05-29
Method of delivering fluid into constricted openings free of voids App 20030098087 - Fallon, Kenneth M. ; et al.	2003-05-29
Liquid crystal display element App 20030098947 - Fallon, Kenneth M. ; et al.	2003-05-29
Flip Chip Attach On Flexible Circuit Carrier Using Chip With Metallic Cap On Solder App 20010013423 - DALAL, HORMAZDYAR M. ; et al.	2001-08-16
Method for attaching a flip chip on flexible circuit carrier using chip with metallic cap on solder Grant 5,729,896 - Dalal , et al. March 24, 1	1998-03-24
Method for making direct chip attach circuit card Grant 5,634,268 - Dalal , et al. June 3, 1	1997-06-03
Process for selective application of solder to circuit packages Grant 5,597,469 - Carey , et al. January 28, 1	1997-01-28
Rework process for semiconductor chips mounted in a flip chip configuration on an organic substrate Grant 5,542,601 - Fallon , et al. August 6, 1	1996-08-06
Low temperature controlled collapse chip attach process Grant 5,075,965 - Carey , et al. December 31, 1	1991-12-31

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