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name:-0.027958154678345
name:-0.017543077468872
name:-0.0077459812164307
Fairbairn; Kevin Patent Filings

Fairbairn; Kevin

Patent Applications and Registrations

Patent applications and USPTO patent grants for Fairbairn; Kevin.The latest application filed is for "spatial monitoring and control of plasma processing environments".

Company Profile
14.42.16
  • Fairbairn; Kevin - Los Gatos CA
  • Fairbairn; Kevin - Saratoga CA
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Spatial Monitoring And Control Of Plasma Processing Environments
App 20220285131 - Shaw; Denis ;   et al.
2022-09-08
Spatial monitoring and control of plasma processing environments
Grant 11,437,221 - Carter , et al. September 6, 2
2022-09-06
Spatial monitoring and control of plasma processing environments
Grant 11,282,677 - Shaw , et al. March 22, 2
2022-03-22
Application of modulating supplies in a plasma processing system
Grant 11,264,209 - Van Zyl , et al. March 1, 2
2022-03-01
Spatial Monitoring And Control Of Plasma Processing Environments
App 20210241996 - Carter; Daniel ;   et al.
2021-08-05
Synchronization Between An Excitation Source And A Substrate Bias Supply
App 20210134562 - Fairbairn; Kevin ;   et al.
2021-05-06
Application Of Modulating Supplies In A Plasma Processing System
App 20210074513 - Van Zyl; Gideon ;   et al.
2021-03-11
Synchronization between an excitation source and a substrate bias supply
Grant 10,896,807 - Fairbairn , et al. January 19, 2
2021-01-19
Spatial Monitoring And Control Of Plasma Processing Environments
App 20210005428 - Shaw; Denis ;   et al.
2021-01-07
Application of modulating supplies in a plasma processing system
Grant 10,811,227 - Van Zyl , et al. October 20, 2
2020-10-20
Synchronization with a bias supply in a plasma processing system
Grant 10,811,229 - Van Zyl , et al. October 20, 2
2020-10-20
Control of plasma processing systems that include plasma modulating supplies
Grant 10,811,228 - Van Zyl , et al. October 20, 2
2020-10-20
Spatial and temporal control of ion bias voltage for plasma processing
Grant 10,707,055 - Shaw , et al.
2020-07-07
Synchronization Between An Excitation Source And A Substrate Bias Supply
App 20200203128 - Fairbairn; Kevin ;   et al.
2020-06-25
Synchronized pulsing of plasma processing source and substrate bias
Grant 10,607,813 - Fairbairn , et al.
2020-03-31
Synchronization With A Bias Supply In A Plasma Processing System
App 20190172685 - Van Zyl; Gideon ;   et al.
2019-06-06
Spatial And Temporal Control Of Ion Bias Voltage For Plasma Processing
App 20190157043 - Shaw; Denis ;   et al.
2019-05-23
Control Of Plasma Processing Systems That Include Plasma Modulating Supplies
App 20190157042 - Van Zyl; Gideon ;   et al.
2019-05-23
Application Of Modulating Supplies In A Plasma Processing System
App 20190157041 - Zyl; Gideon Van ;   et al.
2019-05-23
Synchronized Pulsing Of Plasma Processing Source And Substrate Bias
App 20190157040 - Fairbairn; Kevin ;   et al.
2019-05-23
Tandem process chamber
Grant 7,655,092 - Fairbairn , et al. February 2, 2
2010-02-02
Tandem process chamber
App 20080105202 - Fairbairn; Kevin ;   et al.
2008-05-08
Method of depositing an amorphous carbon layer
Grant 7,335,462 - Fairbairn , et al. February 26, 2
2008-02-26
Method Of Depositing An Amorphous Carbon Layer
App 20070128538 - FAIRBAIRN; KEVIN ;   et al.
2007-06-07
Method of depositing an amorphous carbon layer
Grant 7,223,526 - Fairbairn , et al. May 29, 2
2007-05-29
Method of depositing an amrphous carbon layer
App 20050112509 - Fairbairn, Kevin ;   et al.
2005-05-26
Method of depositing an amorphous carbon layer
Grant 6,841,341 - Fairbairn , et al. January 11, 2
2005-01-11
Tandem process chamber
App 20040069225 - Fairbairn, Kevin ;   et al.
2004-04-15
Tandem process chamber
Grant 6,635,115 - Fairbairn , et al. October 21, 2
2003-10-21
Method for depositing an amorphous carbon layer
Grant 6,573,030 - Fairbairn , et al. June 3, 2
2003-06-03
Method of depositing an amorphous carbon layer
App 20030091938 - Fairbairn, Kevin ;   et al.
2003-05-15
Method and apparatus for reducing perfluorocompound gases from substrate processing equipment emissions
Grant 6,517,913 - Cheung , et al. February 11, 2
2003-02-11
Load-lock with external staging area
Grant 6,486,444 - Fairbairn , et al. November 26, 2
2002-11-26
Mixed frequency CVD process
Grant 6,358,573 - Raoux , et al. March 19, 2
2002-03-19
Heated electrostatic particle trap for in-situ vacuum line cleaning of a substrated processing
Grant 6,354,241 - Tanaka , et al. March 12, 2
2002-03-12
Apparatus and methods for upgraded substrate processing system with microwave plasma source
Grant 6,230,652 - Tanaka , et al. May 15, 2
2001-05-15
High density plasma CVD reactor with combined inductive and capacitive coupling
Grant 6,220,201 - Nowak , et al. April 24, 2
2001-04-24
Method and apparatus for reducing perfluorocompound gases from substrate processing equipment emissions
Grant 6,187,072 - Cheung , et al. February 13, 2
2001-02-13
Multideck wafer processing system
Grant 6,176,667 - Fairbairn , et al. January 23, 2
2001-01-23
Tandem process chamber
Grant 6,152,070 - Fairbairn , et al. November 28, 2
2000-11-28
Mixed frequency CVD apparatus
Grant 6,098,568 - Raoux , et al. August 8, 2
2000-08-08
Front end wafer staging with wafer cassette turntables and on-the-fly wafer center finding
Grant 6,082,950 - Altwood , et al. July 4, 2
2000-07-04
Process chamber exhaust system
Grant 6,077,157 - Fairbairn , et al. June 20, 2
2000-06-20
Microwave apparatus for in-situ vacuum line cleaning for substrate processing equipment
Grant 6,045,618 - Raoux , et al. April 4, 2
2000-04-04
Apparatus and methods for upgraded substrate processing system with microwave plasma source
Grant 6,039,834 - Tanaka , et al. March 21, 2
2000-03-21
High density plasma CVD and etching reactor
Grant 5,976,308 - Fairbairn , et al. November 2, 1
1999-11-02
Gas delivery system
Grant 5,911,834 - Fairbairn , et al. June 15, 1
1999-06-15
Single loadlock chamber with wafer cooling function
Grant 5,902,088 - Fairbairn , et al. May 11, 1
1999-05-11
High density plasma CVD reactor with combined inductive and capacitive coupling
Grant 5,865,896 - Nowak , et al. February 2, 1
1999-02-02
Ultra high throughput wafer vacuum processing system
Grant 5,855,681 - Maydan , et al. January 5, 1
1999-01-05
CVD processing chamber
Grant 5,853,607 - Zhao , et al. December 29, 1
1998-12-29
Remote plasma source
Grant 5,844,195 - Fairbairn , et al. December 1, 1
1998-12-01
Dual blade robot
Grant 5,838,121 - Fairbairn , et al. November 17, 1
1998-11-17
Wafer tray and ceramic blade for semiconductor processing apparatus
Grant 5,636,964 - Somekh , et al. June 10, 1
1997-06-10
High density plasma CVD and etching reactor
Grant 5,614,055 - Fairbairn , et al. March 25, 1
1997-03-25
Wafer tray and ceramic blade for semiconductor processing apparatus
Grant 5,570,994 - Somekh , et al. November 5, 1
1996-11-05
CVD Processing chamber
Grant 5,558,717 - Zhao , et al. September 24, 1
1996-09-24
Wafer tray and ceramic blade for semiconductor processing apparatus
Grant 5,556,147 - Somekh , et al. September 17, 1
1996-09-17
Company Registrations
SEC0001237232FAIRBAIRN KEVIN

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