Factor; Bradford J.
Patent Applications and Registrations
Patent applications and USPTO patent grants for Factor; Bradford J..The latest application filed is for "chip scale package structure and fabrication method thereof".
- Factor; Bradford J. - Paris FR
- Factor; Bradford J. - Palto Alto CA
| Patent | Date |
|---|---|
| Stacked Type Chip Package Structure App 20100052186 - Appelt; Bernd Karl ; et al. | 2010-03-04 |
| Chip Scale Package Structure And Fabrication Method Thereof App 20100052156 - Appelt; Bernd Karl ; et al. | 2010-03-04 |
| Metal transfer to form printing master plate or printed circuit board Grant 4,800,397 - Afzali-Ardakani , et al. January 24, 1 | 1989-01-24 |
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