| Patent | Date |
|---|
Method of manufacturing a superjunction semiconductor device
Grant 11,329,126 - Tilke , et al. May 10, 2 | 2022-05-10 |
Method for Forming an Insulation Layer in a Semiconductor Body and Transistor Device
App 20220077309 - Weber; Hans ; et al. | 2022-03-10 |
Chip-substrate Composite Semiconductor Device
App 20220028699 - Fachmann; Christian ; et al. | 2022-01-27 |
Power Relay Circuit
App 20210407746 - Muri; Ingo ; et al. | 2021-12-30 |
Method for forming an insulation layer in a semiconductor body and transistor device
Grant 11,211,483 - Weber , et al. December 28, 2 | 2021-12-28 |
Multi-Die-Package and Method
App 20210335696 - Riegler; Andreas ; et al. | 2021-10-28 |
Power relay circuit
Grant 11,139,125 - Muri , et al. October 5, 2 | 2021-10-05 |
Method for operating a superjunction transistor device
Grant 11,088,275 - Weber , et al. August 10, 2 | 2021-08-10 |
Multi-die-package and method
Grant 11,081,430 - Riegler , et al. August 3, 2 | 2021-08-03 |
Semiconductor Device
App 20200388703 - Hirler; Franz ; et al. | 2020-12-10 |
Transistor device with gate resistor
Grant 10,811,529 - Riegler , et al. October 20, 2 | 2020-10-20 |
Method for Operating a Superjunction Transistor Device
App 20200287535 - Weber; Hans ; et al. | 2020-09-10 |
Power Relay Circuit
App 20200161062 - Muri; Ingo ; et al. | 2020-05-21 |
Charge compensation semiconductor devices
Grant 10,651,271 - Tutuc , et al. | 2020-05-12 |
Method for Forming an Insulation Layer in a Semiconductor Body and Transistor Device
App 20200105918 - Weber; Hans ; et al. | 2020-04-02 |
Semiconductor Oxide or Glass Based Connection Body with Wiring Structure
App 20200091058 - Riegler; Andreas ; et al. | 2020-03-19 |
Transistor Device with Gate Resistor
App 20190319124 - Riegler; Andreas ; et al. | 2019-10-17 |
Semiconductor device having a first through contact structure in ohmic contact with the gate electrode
Grant 10,411,126 - Riegler , et al. Sept | 2019-09-10 |
Field-effect semiconductor device having N and P-doped pillar regions
Grant 10,374,032 - Weber , et al. | 2019-08-06 |
Multi-Die-Package and Method
App 20190157191 - Riegler; Andreas ; et al. | 2019-05-23 |
Charge Compensation Semiconductor Devices
App 20190123137 - Tutuc; Daniel ; et al. | 2019-04-25 |
Superjunction semiconductor device having a superstructure
Grant 10,224,394 - Weber , et al. | 2019-03-05 |
Field-Effect Semiconductor Device and a Manufacturing Method Therefor
App 20190051742 - Riegler; Andreas ; et al. | 2019-02-14 |
Method of Manufacturing a Superjunction Semiconductor Device
App 20180374919 - Tilke; Armin ; et al. | 2018-12-27 |
Charge compensation semiconductor devices
Grant 10,157,982 - Tutuc , et al. Dec | 2018-12-18 |
Field-Effect Semiconductor Device and a Manufacturing Method Therefor
App 20180294333 - Weber; Hans ; et al. | 2018-10-11 |
Superjunction Semiconductor Device Having a Superstructure
App 20180158901 - Weber; Hans ; et al. | 2018-06-07 |
Charge Compensation Semiconductor Devices
App 20180061937 - Tutuc; Daniel ; et al. | 2018-03-01 |
Method of manufacturing superjunction semiconductor devices with a superstructure in alignment with a foundation
Grant 9,905,639 - Weber , et al. February 27, 2 | 2018-02-27 |
Semiconductor package with top side cooling heat sink thermal pathway
Grant 9,812,373 - Fachmann , et al. November 7, 2 | 2017-11-07 |
Intermediate layer for copper structuring and methods of formation thereof
Grant 9,773,736 - Joshi , et al. September 26, 2 | 2017-09-26 |
Semiconductor device having switchable regions with different transconductances
Grant 9,679,895 - Fachmann , et al. June 13, 2 | 2017-06-13 |
Method of Manufacturing Superjunction Semiconductor Devices with a Superstructure in Alignment with a Foundation
App 20170154956 - Weber; Hans ; et al. | 2017-06-01 |
Method for manufacturing a semiconductor switching device with different local cell geometry
Grant 9,583,395 - Fachmann , et al. February 28, 2 | 2017-02-28 |
Intermediate Layer for Copper Structuring and Methods of Formation Thereof
App 20160218033 - Joshi; Ravi Keshav ; et al. | 2016-07-28 |
Semiconductor Device Having Switchable Regions with Different Transconductances
App 20160190125 - Fachmann; Christian ; et al. | 2016-06-30 |
Heat Spreader, Electronic Module Comprising a Heat Spreader and Method of Fabrication Thereof
App 20160163616 - Fachmann; Christian ; et al. | 2016-06-09 |
Semiconductor switching device with different local threshold voltage
Grant 9,349,795 - Fachmann , et al. May 24, 2 | 2016-05-24 |
Layer arrangement
Grant 9,349,794 - Trichy Rengarajan , et al. May 24, 2 | 2016-05-24 |
Method for Manufacturing a Semiconductor Switching Device with Different Local Cell Geometry
App 20160099180 - Fachmann; Christian ; et al. | 2016-04-07 |
Semiconductor switching devices with different local transconductance
Grant 9,293,533 - Fachmann , et al. March 22, 2 | 2016-03-22 |
Semiconductor switching device with different local cell geometry
Grant 9,231,049 - Fachmann , et al. January 5, 2 | 2016-01-05 |
Semiconductor Switching Device with Different Local Cell Geometry
App 20150372076 - Fachmann; Christian ; et al. | 2015-12-24 |
Semiconductor Switching Device with Different Local Threshold Voltage
App 20150372086 - Fachmann; Christian ; et al. | 2015-12-24 |
Semiconductor Switching Devices with Different Local Transconductance
App 20150372087 - Fachmann; Christian ; et al. | 2015-12-24 |
Layer Arrangement
App 20140264764 - TRICHY RENGARAJAN; Gopalakrishnan ; et al. | 2014-09-18 |
Method for manufacturing a layer arrangement, and a layer arrangement
Grant 8,772,948 - Trichy Rengarajan , et al. July 8, 2 | 2014-07-08 |
Method For Manufacturing A Layer Arrangement, And A Layer Arrangement
App 20140061935 - TRICHY RENGARAJAN; Gopalakrishnan ; et al. | 2014-03-06 |
Semiconductor device
Grant 8,097,944 - Landau , et al. January 17, 2 | 2012-01-17 |
Semiconductor Device
App 20100276797 - Landau; Stefan ; et al. | 2010-11-04 |
Device Including An Imide Layer With Non-contact Openings And Method
App 20100007028 - Fachmann; Christian ; et al. | 2010-01-14 |
Selective deposition method
App 20080242097 - Boescke; Tim ; et al. | 2008-10-02 |
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