Fab Solutions, Inc.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Fab Solutions, Inc..The latest application filed is for "production managing system of semiconductor device".

Company Profile

0.23.0

Fab Solutions, Inc. - Kanagawa JP
Fab Solutions, Inc - Kanagawa JP
Fab Solutions, Inc. - JP JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Production managing system of semiconductor device Grant 7,321,805 - Yamada , et al. January 22, 2	2008-01-22
Contact hole standard test device, method of forming the same, method of testing contact hole, method and apparatus for measuring a thickness of a film, and method of testing a wafer Grant 7,232,994 - Yamada June 19, 2	2007-06-19
Semiconductor device test method and semiconductor device tester Grant 7,049,834 - Yamada May 23, 2	2006-05-23
Film thickness measuring apparatus and a method for measuring a thickness of a film Grant 7,002,361 - Yamada , et al. February 21, 2	2006-02-21
Contact hole standard test device, method of forming the same, method of testing contact hole, method and apparatus for measuring a thickness of a film, and method of testing a wafer Grant 6,982,418 - Yamada January 3, 2	2006-01-03
Semiconductor device tester Grant 6,975,125 - Yamada , et al. December 13, 2	2005-12-13
Contact hole standard test device, method of forming the same, method testing contact hole, method and apparatus for measuring a thickness of a film, and method of testing a wafer Grant 6,967,327 - Yamada November 22, 2	2005-11-22
Semiconductor device tester Grant 6,946,857 - Yamada , et al. September 20, 2	2005-09-20
Surface contamination analyzer for semiconductor wafers, method used therein and process for fabricating semiconductor device Grant 6,943,043 - Ushiki , et al. September 13, 2	2005-09-13
Contact hole standard test device, method of forming the same, method of testing contact hole, method and apparatus for measuring a thickness of a film, and method of testing a wafer Grant 6,940,296 - Yamada September 6, 2	2005-09-06
Semiconductor device test method and semiconductor device tester Grant 6,914,444 - Yamada July 5, 2	2005-07-05
Semiconductor device test method and semiconductor device tester Grant 6,900,645 - Yamada May 31, 2	2005-05-31
Contact hole standard test device Grant 6,897,440 - Yamada May 24, 2	2005-05-24
Film thickness measuring apparatus and a method for measuring a thickness of a film Grant 6,850,079 - Yamada , et al. February 1, 2	2005-02-01
Production managing system of semiconductor device Grant 6,842,663 - Yamada , et al. January 11, 2	2005-01-11
Semiconductor manufacturing device Grant 6,837,936 - Ushiki , et al. January 4, 2	2005-01-04
Semiconductor device test method and semiconductor device tester Grant 6,809,534 - Yamada October 26, 2	2004-10-26
Semiconductor device tester which measures information related to a structure of a sample in a depth direction Grant 6,768,324 - Yamada , et al. July 27, 2	2004-07-27
Surface contamination analyzer for semiconductor wafers, method used therein and process for fabricating semiconductor device Grant 6,753,194 - Ushiki , et al. June 22, 2	2004-06-22
Production managing system of semiconductor device Grant 6,711,453 - Yamada , et al. March 23, 2	2004-03-23
Method and apparatus for measuring thickness of thin film Grant 6,683,308 - Itagaki , et al. January 27, 2	2004-01-27
Semiconductor manufacturing apparatus Grant 6,614,050 - Yamada , et al. September 2, 2	2003-09-02
Semiconductor device inspecting apparatus Grant 6,614,244 - Yamada , et al. September 2, 2	2003-09-02

Company Registrations

NCAGE Code	4Q8Z0	FAB SOLUTIONS INC
CAGE Code	4Q8Z0	FAB SOLUTIONS INC
DUNS	179885558	FAB SOLUTIONS INC

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