name:-0.0025508403778076
name:-0.012531995773315
name:-0.00056195259094238
F&K Delvotec Bondtechnik GmbH Patent Filings

F&K Delvotec Bondtechnik GmbH

Patent Applications and Registrations

Patent applications and USPTO patent grants for F&K Delvotec Bondtechnik GmbH.The latest application filed is for "method for producing wire bond connection and arrangement for implementing the method".

Company Profile
0.11.2
  • F&K Delvotec Bondtechnik GmbH - Ottobrunn DE
  • F & K Delvotec Bondtechnik GmbH - Ottoburn DE
  • F & K Delvotec Bondtechnik GmbH - Ottobrumm DE
  • F & K Delvotec Bondtechnik GmbH - DE DE
  • F & K Delvotec Bondtechnik GmbH - Oberhaching DE
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Trademarks
Patent Activity
PatentDate
Method For Producing Wire Bond Connection And Arrangement For Implementing The Method
App 20180218996 - Schlicht; Franz
2018-08-02
Transducer Of An Ultrasonic Bonder
App 20110259939 - Farassat; Farhad
2011-10-27
Method of testing bonded connections, and a wire bonder
Grant 7,735,711 - Farassat June 15, 2
2010-06-15
Wire bonder and method of operating the same
Grant 7,458,496 - Farassat December 2, 2
2008-12-02
Method and apparatus for the production and quality testing of a bonded wire connection
Grant 6,912,906 - Farassat July 5, 2
2005-07-05
Bonding tool and wire bonder
Grant 6,905,058 - Farassat June 14, 2
2005-06-14
Circuit housing
Grant 6,891,730 - Farassat May 10, 2
2005-05-10
Cutting device for bonded wires
Grant 6,827,248 - Farassat December 7, 2
2004-12-07
Chip-transferring station for a bonding machine
Grant 6,786,320 - Farassat September 7, 2
2004-09-07
Method and apparatus for the production and quality testing of a bonded wire connection
Grant 6,745,629 - Farassat June 8, 2
2004-06-08
Deep access, close proximity, fine pitch bonding of large wire
Grant 6,206,275 - Biggs March 27, 2
2001-03-27
Wire guide for a bonding machine
Grant 5,906,706 - Farassat May 25, 1
1999-05-25
Wire bonding ultrasonic control system responsive to wire deformation
Grant 5,314,105 - Farassat May 24, 1
1994-05-24

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