loadpatents
Patent applications and USPTO patent grants for Ezaki; Toshiaki.The latest application filed is for "thermally conductive resin composition".
Patent | Date |
---|---|
Thermally conductive resin composition Grant 10,544,342 - Ezaki , et al. Ja | 2020-01-28 |
LED lamp heat sink Grant 10,355,188 - Ezaki , et al. July 16, 2 | 2019-07-16 |
Automotive LED lamp heat sink Grant 10,222,051 - Ezaki , et al. | 2019-03-05 |
Thermally Conductive Resin Composition App 20180194982 - Ezaki; Toshiaki ;   et al. | 2018-07-12 |
Metal Resin Composite App 20180085977 - Ezaki; Toshiaki | 2018-03-29 |
Led Lamp Heat Sink App 20170317257 - Ezaki; Toshiaki ;   et al. | 2017-11-02 |
Automotive Led Lamp Heat Sink App 20170167716 - Ezaki; Toshiaki ;   et al. | 2017-06-15 |
Thermally Conductive Resin Compact And Method For Manufacturing Thermally Conductive Resin Compact App 20150014603 - Yoshihara; Shusuke ;   et al. | 2015-01-15 |
Thermoplastic resin with high thermal conductivity Grant 8,921,507 - Yoshihara , et al. December 30, 2 | 2014-12-30 |
Thermoplastic resin with high thermal conductivity Grant 8,637,630 - Yoshihara , et al. January 28, 2 | 2014-01-28 |
Thermoplastic Resin With High Thermal Conductivity App 20130043425 - Yoshihara; Shusuke ;   et al. | 2013-02-21 |
Thermoplastic Resin With High Thermal Conductivity App 20130035468 - Yoshihara; Shusuke ;   et al. | 2013-02-07 |
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