Ewe; Henrik

Patent Applications and Registrations

Patent applications and USPTO patent grants for Ewe; Henrik.The latest application filed is for "chip package and method for manufacturing the same".

Company Profile

0.25.25

Ewe; Henrik - Burglengenfeld DE

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Laminate electronic device Grant 10,020,245 - Ewe , et al. July 10, 2	2018-07-10
Chip package and method for manufacturing the same Grant 9,437,548 - Ewe , et al. September 6, 2	2016-09-06
Chip Package And Method For Manufacturing The Same App 20150279783 - Ewe; Henrik ; et al.	2015-10-01
Semiconductor Device App 20150279782 - Ewe; Henrik ; et al.	2015-10-01
Method and system for providing a reliable light emitting diode semiconductor device Grant 9,142,739 - Eder , et al. September 22, 2	2015-09-22
Method of manufacturing a semiconductor device Grant 9,123,687 - Ewe , et al. September 1, 2	2015-09-01
Semiconductor device Grant 9,059,083 - Ewe , et al. June 16, 2	2015-06-16
Chip package and method for manufacturing the same Grant 9,059,155 - Ewe , et al. June 16, 2	2015-06-16
Electronic device including a carrier and a semiconductor chip attached to the carrier and manufacturing thereof Grant 8,952,545 - Otremba , et al. February 10, 2	2015-02-10
Device including two semiconductor chips and manufacturing thereof Grant 8,866,302 - Ewe , et al. October 21, 2	2014-10-21
Chip Package And Method For Manufacturing The Same App 20140264790 - Ewe; Henrik ; et al.	2014-09-18
Laminate Electronic Device App 20140117565 - Ewe; Henrik ; et al.	2014-05-01
Method of manufacturing a laminate electronic device including separating a carrier into a plurality of parts Grant 8,664,043 - Ewe , et al. March 4, 2	2014-03-04
Chip Arrangements And A Method For Forming A Chip Arrangement App 20130341780 - Scharf; Thorsten ; et al.	2013-12-26
Electronic Device Including A Carrier And A Semiconductor Chip Attached To The Carrier And Manufacturing Thereof App 20130328213 - Otremba; Ralf ; et al.	2013-12-12
Method and System for Providing a Reliable Light Emitting Diode Semiconductor Device App 20130277704 - Eder; Andreas ; et al.	2013-10-24
Electronic device including a carrier and a semiconductor chip attached to the carrier and manufacturing thereof Grant 8,507,320 - Otremba , et al. August 13, 2	2013-08-13
Method Of Manufacturing A Semiconductor Device And Semiconductor Device App 20120267774 - Ewe; Henrik ; et al.	2012-10-25
Device Including Two Semiconductor Chips and Manufacturing Thereof App 20120187565 - Ewe; Henrik ; et al.	2012-07-26
Method of manufacturing a semiconductor device Grant 8,201,326 - Ewe , et al. June 19, 2	2012-06-19
Method And System For Providing A Reliable Light Emitting Diode Semiconductor Device App 20120061700 - EDER; Andreas ; et al.	2012-03-15
Laminate electronic device Grant 8,120,158 - Ewe , et al. February 21, 2	2012-02-21
Component, power component, apparatus, method of manufacturing a component, and method of manufacturing a power semiconductor component Grant 8,097,936 - Ewe , et al. January 17, 2	2012-01-17
Method for producing a power semiconductor module comprising surface-mountable flat external contacts Grant 7,955,901 - Ewe , et al. June 7, 2	2011-06-07
Laminate Electronic Device App 20110127675 - Ewe; Henrik ; et al.	2011-06-02
Laminate Electronic Device App 20110108971 - Ewe; Henrik ; et al.	2011-05-12
Semiconductor device Grant 7,838,978 - Mahler , et al. November 23, 2	2010-11-23
Power semiconductor device having lines within a housing Grant 7,821,128 - Ewe , et al. October 26, 2	2010-10-26
Electronic device and method of manufacturing same Grant 7,799,601 - Nikitin , et al. September 21, 2	2010-09-21
Method Of Manufacturing A Semiconductor Device And Semiconductor Device App 20100157568 - Ewe; Henrik ; et al.	2010-06-24
Data Carrier For Contactless Data Transmission And A Method For Producing Such A Data Carrier App 20100067200 - EWE; Henrik	2010-03-18
Integrated circuit device having a gas-phase deposited insulation layer Grant 7,662,726 - Mahler , et al. February 16, 2	2010-02-16
Electronic Device And Manufacturing Thereof App 20090236749 - Otremba; Ralf ; et al.	2009-09-24
Electronic Device and Method of Manufacturing Same App 20090191665 - Nikitin; Ivan ; et al.	2009-07-30
Method for producing a dielectric layer for an electronic component Grant 7,524,775 - Ewe , et al. April 28, 2	2009-04-28
Method For Producing A Power Semiconductor Module Comprising Surface-mountable Flat External Contacts App 20090093090 - Ewe; Henrik ; et al.	2009-04-09
Integrated Circuit Device Having A Gas-phase Deposited Insulation Layer App 20090072415 - Mahler; Joachim ; et al.	2009-03-19
Semiconductor Device App 20090072379 - Ewe; Henrik ; et al.	2009-03-19
Semiconductor Device App 20090072413 - Mahler; Joachim ; et al.	2009-03-19
Power semiconductor module having surface-mountable flat external contacts and method for producing the same Grant 7,479,691 - Ewe , et al. January 20, 2	2009-01-20
Component, Power Component, Apparatus, Method Of Manufacturing A Component, And Method Of Manufacturing A Power Semiconductor Component App 20080203550 - Ewe; Henrik ; et al.	2008-08-28
Method for Producing a Dielectric Layer for an Electronic Component App 20080013249 - Ewe; Henrik ; et al.	2008-01-17
Power semiconductor module having surface-mountable flat external contacts and method for producing the same App 20070246808 - Ewe; Henrik ; et al.	2007-10-25
Power semiconductor device having lines within a housing App 20070045745 - Ewe; Henrik ; et al.	2007-03-01

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