EV Group GmbH
Patent Applications and Registrations
Patent applications and USPTO patent grants for EV Group GmbH.The latest application filed is for "method for producing a microlens".
Company Profile
3.43.36
- EV Group GmbH - St. Florian am Inn AT
- EV Group GmbH - AT AT
- EV Group GmbH - St. Florian N/A AT
- EV Group GMBH - Florian am Inn AT
- EV Group GmbH -
- EV Group GmbH; - St. Florian AT
Patent Activity
| Patent | Date |
|---|---|
| Die tool, device and method for producing a lens wafer Grant 10,668,678 - Kast , et al. | 2020-06-02 |
| Method for producing a microlens Grant 10,279,551 - Thallner , et al. | 2019-05-07 |
| Method For Producing A Microlens App 20180229458 - Thallner; Erich ; et al. | 2018-08-16 |
| Chuck adapted for automated coupling Grant 9,925,597 - Tiefenbock , et al. March 27, 2 | 2018-03-27 |
| Die Tool, Device And Method For Producing A Lens Wafer App 20170305086 - Kast; Michael ; et al. | 2017-10-26 |
| Device and method for processing of wafers Grant 9,771,223 - Lindner , et al. September 26, 2 | 2017-09-26 |
| Device and method for processing wafers Grant 9,751,698 - Lindner , et al. September 5, 2 | 2017-09-05 |
| Die tool, device and method for producing a lens wafer Grant 9,738,042 - Kast , et al. August 22, 2 | 2017-08-22 |
| Method and device for producing a lens wafer Grant 9,662,846 - Kast , et al. May 30, 2 | 2017-05-30 |
| Method and device for producing a lens wafer Grant 9,643,366 - Kast , et al. May 9, 2 | 2017-05-09 |
| Chuck Adapted For Automated Coupling App 20170100780 - Tiefenbock; Wolfgang ; et al. | 2017-04-13 |
| Chuck adapted for automated coupling Grant 9,555,479 - Tiefenbock , et al. January 31, 2 | 2017-01-31 |
| Method for detaching a product substrate off a carrier substrate Grant 9,457,552 - Lindner , et al. October 4, 2 | 2016-10-04 |
| Device for aligning and pre-fixing a wafer Grant 9,449,863 - Burggraf , et al. September 20, 2 | 2016-09-20 |
| Device for stripping a product substrate from a carrier substrate Grant 9,381,732 - Lindner , et al. July 5, 2 | 2016-07-05 |
| Device for detaching a product substrate off a carrier substrate Grant 9,381,729 - Lindner , et al. July 5, 2 | 2016-07-05 |
| Receiving device for receiving semiconductor substrates Grant 9,278,433 - Tiefenbock , et al. March 8, 2 | 2016-03-08 |
| Device for detaching a product substrate off a carrier substrate Grant 9,272,501 - Burggraf , et al. March 1, 2 | 2016-03-01 |
| Method for stripping a product substrate from a carrier substrate Grant 9,186,877 - Lindner , et al. November 17, 2 | 2015-11-17 |
| Method And Device For Producing A Lens Wafer App 20150290888 - KAST; Michael ; et al. | 2015-10-15 |
| Device for separating a substrate from a carrier substrate Grant 9,138,978 - Wimplinger , et al. September 22, 2 | 2015-09-22 |
| Method For Detaching A Product Substrate Off A Carrier Substrate App 20150251404 - Lindner; Friedrich Paul ; et al. | 2015-09-10 |
| Method And Device For Producing A Microlens App 20150231840 - Thallner; Erich ; et al. | 2015-08-20 |
| System having two oscillation components for machining a workpiece Grant 9,061,388 - Tiefenbock June 23, 2 | 2015-06-23 |
| Method and device for producing a microlens Grant 9,052,422 - Thallner , et al. June 9, 2 | 2015-06-09 |
| Method For Stripping A Product Substrate From A Carrier Substrate App 20150096690 - Lindner; Friedrich Paul ; et al. | 2015-04-09 |
| Device For Aligning And Pre-fixing A Wafer App 20150089783 - BURGGRAF; Jurgen ; et al. | 2015-04-02 |
| Device and method for stripping a product substrate from a carrier substrate Grant 8,986,496 - Lindner , et al. March 24, 2 | 2015-03-24 |
| Device For Stripping A Product Substrate From A Carrier Substrate App 20150075725 - Lindner; Friedrich Paul ; et al. | 2015-03-19 |
| Device for aligning and pre-fixing a wafer Grant 8,918,989 - Burggraf , et al. December 30, 2 | 2014-12-30 |
| Device for aligning and pre-fixing a wafer Grant 08918989 - | 2014-12-30 |
| Device for releasing an interconnect layer that provides connection between a carrier and a wafer Grant 8,905,111 - Thallner December 9, 2 | 2014-12-09 |
| Device and method for detaching a semiconductor wafer from a substrate Grant 8,894,807 - Lindner , et al. November 25, 2 | 2014-11-25 |
| Device and method for loosening a polymer layer from a surface of a substrate Grant 8,828,147 - Crowder , et al. September 9, 2 | 2014-09-09 |
| Handling device for handling of a wafer Grant 8,714,611 - Brandstatter , et al. May 6, 2 | 2014-05-06 |
| Device And Method For Stripping A Product Substrate From A Carrier Substrate App 20130340947 - Lindner; Friedrich Paul ; et al. | 2013-12-26 |
| Device For Releasing An Interconnect Layer That Provides Connection Between A Carrier And A Wafer App 20130327485 - Thallner; Erich | 2013-12-12 |
| Method for stripping a wafer from a carrier Grant 8,603,294 - Thallner December 10, 2 | 2013-12-10 |
| Method for bonding of chips on wafers Grant 8,597,980 - Wimplinger December 3, 2 | 2013-12-03 |
| Device And Method For Processing Of Wafers App 20130309046 - Lindner; Friedrich Paul ; et al. | 2013-11-21 |
| Device And Method For Detaching A Product Substrate Off A Carrier Substrate App 20130276990 - Lindner; Friedrich Paul ; et al. | 2013-10-24 |
| System Having Two Oscillation Components For Machining A Workplace App 20130259592 - Tiefenbock; Herbert | 2013-10-03 |
| Device And Method For Processing Wafers App 20130240113 - Lindner; Friedrich Paul ; et al. | 2013-09-19 |
| Method And Device For Producing A Lens Wafer App 20130193596 - Kast; Michael ; et al. | 2013-08-01 |
| Device For Separating A Substrate From A Carrier Substrate App 20130168027 - Wimplinger; Markus ; et al. | 2013-07-04 |
| Chuck Which Can Be Coupled By Automation App 20130154206 - Tiefenbock; Wolfgang ; et al. | 2013-06-20 |
| Method For Stripping A Wafer From A Carrier App 20130139972 - Thallner; Erich | 2013-06-06 |
| Device and method for separating a substrate from a carrier substrate Grant 8,449,716 - Wimplinger , et al. May 28, 2 | 2013-05-28 |
| Device for stripping a wafer from a carrier Grant 8,443,864 - Thallner May 21, 2 | 2013-05-21 |
| Device And Method For Stripping A Wafer From A Carrier App 20120000613 - Thallner; Erich | 2012-01-05 |
| Device And Method For Loosening A Polymer Layer From A Surface Of A Substrate App 20110265822 - Crowder; Matt ; et al. | 2011-11-03 |
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