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name:-0.0076858997344971
name:-0.0058989524841309
name:-0.0014839172363281
Eum; Yo Se Patent Filings

Eum; Yo Se

Patent Applications and Registrations

Patent applications and USPTO patent grants for Eum; Yo Se.The latest application filed is for "apparatus for sawing a semiconductor package".

Company Profile
1.4.6
  • Eum; Yo Se - Cheonan-si KR
  • Eum; Yo-Se - Chungcheongnam-do KR
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Apparatus for sawing a semiconductor package
Grant 11,018,038 - Kim , et al. May 25, 2
2021-05-25
Apparatus For Sawing A Semiconductor Package
App 20200111691 - KIM; YONG KI ;   et al.
2020-04-09
Solder ball mounter
Grant 10,016,833 - Lee , et al. July 10, 2
2018-07-10
Method of forming external terminals of a package and apparatus for performing the same
Grant 9,113,585 - Eum , et al. August 18, 2
2015-08-18
Solder Ball Mounter
App 20150001278 - LEE; SEOK-YONG ;   et al.
2015-01-01
Method Of Forming External Terminals Of A Package And Apparatus For Performing The Same
App 20140220774 - EUM; Yo-Se ;   et al.
2014-08-07
Molding Apparatus For Semiconductor Package
App 20120225150 - HAN; Dong-Chul ;   et al.
2012-09-06
Equipment And Method To Classify Semiconductor Packages
App 20120194214 - EUM; Yo-se ;   et al.
2012-08-02
Equipment and method for cutting package
Grant 8,132,305 - Choi , et al. March 13, 2
2012-03-13
Equipment And Method For Cutting Package
App 20080056832 - CHOI; Tai-Kew ;   et al.
2008-03-06

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