Eugene Lee; Lee Han Meng@
Patent Applications and Registrations
Patent applications and USPTO patent grants for Eugene Lee; Lee Han Meng@.The latest application filed is for "flippable leadframe for packaged electronic system having vertically stacked chip and components".
- Eugene Lee; Lee Han Meng@ - Johor MY
- Eugene Lee; Lee Han Meng@ - Muar MY
| Patent | Date |
|---|---|
| Making a flat no-lead package with exposed electroplated side lead surfaces Grant 11,348,806 - Eugene Lee , et al. May 31, 2 | 2022-05-31 |
| Locking dual leadframe for flip chip on leadframe packages Grant 11,056,462 - Eugene Lee , et al. July 6, 2 | 2021-07-06 |
| Flippable Leadframe for Packaged Electronic System Having Vertically Stacked Chip and Components App 20210074613 - Eugene Lee; Lee Han Meng@ ; et al. | 2021-03-11 |
| Flippable leadframe for packaged electronic system having vertically stacked chips and components Grant 10,879,154 - Eugene Lee , et al. December 29, 2 | 2020-12-29 |
| Methods for making a multilevel leadframe by etching a conductive sheet from two opposite sides Grant 10,804,114 - Eugene Lee , et al. October 13, 2 | 2020-10-13 |
| Stacked semiconductor system having interposer of half-etched and molded sheet metal Grant 10,720,406 - Eugene Lee , et al. | 2020-07-21 |
| Stacked Semiconductor System Having Interposer Of Half-etched And Molded Sheet Metal App 20200091111 - Eugene Lee; Lee Han Meng@ ; et al. | 2020-03-19 |
| Methods of assembling a flip chip on a locking dual leadframe Grant 10,541,225 - Eugene Lee , et al. Ja | 2020-01-21 |
| Stacked semiconductor system having interposer of half-etched and molded sheet metal Grant 10,515,928 - Eugene Lee , et al. Dec | 2019-12-24 |
| Packaged semiconductor device having leadframe features preventing delamination Grant 9,892,936 - Lim , et al. February 13, 2 | 2018-02-13 |
| Integrated circuit package fabrication Grant 9,859,197 - Eugene Lee , et al. January 2, 2 | 2018-01-02 |
| Integrated circuit assembly Grant 9,842,807 - Eugene Lee , et al. December 12, 2 | 2017-12-12 |
| Locking Dual Leadframe For Flip Chip On Leadframe Packages App 20170345790 - Eugene Lee; Lee Han Meng @ ; et al. | 2017-11-30 |
| Locking Dual Leadframe For Flip Chip On Leadframe Packages App 20170309595 - Eugene Lee; Lee Han Meng @ ; et al. | 2017-10-26 |
| Forming a panel of triple stack semiconductor packages Grant 9,691,748 - Eugene Lee , et al. June 27, 2 | 2017-06-27 |
| Integrated Circuit Assembly App 20170110408 - Eugene Lee; Lee Han Meng@ ; et al. | 2017-04-20 |
| Packaged Semiconductor Device Having Leadframe Features Preventing Delamination App 20170053814 - Fen; Sueann Lim Wei ; et al. | 2017-02-23 |
| Flippable Leadframe for Packaged Electronic System Having Vertically Stacked Chips and Components App 20170025332 - Eugene Lee; Lee Han Meng@ ; et al. | 2017-01-26 |
| Packaged semiconductor device having leadframe features preventing delamination Grant 9,515,009 - Fen , et al. December 6, 2 | 2016-12-06 |
| Flippable leadframe for packaged electronic system having vertically stacked chips and components Grant 9,496,206 - Eugene Lee , et al. November 15, 2 | 2016-11-15 |
| Flippable Leadframe For Packaged Electronic System Having Vertically Stacked Chips And Components App 20160300784 - Eugene Lee; Lee Han Meng@ ; et al. | 2016-10-13 |
| Multilevel Leadframe App 20160240390 - Eugene Lee; Lee Han Meng@ ; et al. | 2016-08-18 |
| Packaged Semiconductor Device Having Leadframe Features Preventing Delamination App 20160204052 - Fen; Sueann Lim Wei ; et al. | 2016-07-14 |
| Making A Flat No-lead Package With Exposed Electroplated Side Lead Surfaces App 20160181122 - Eugene Lee; Lee Han Meng@ ; et al. | 2016-06-23 |
| Forming A Panel Of Triple Stack Semiconductor Packages App 20160133617 - EUGENE LEE; LEE HAN MENG @ ; et al. | 2016-05-12 |
| Triple Stack Semiconductor Package App 20160126230 - EUGENE LEE; LEE HAN MENG @ ; et al. | 2016-05-05 |
| Triple stack semiconductor package Grant 9,324,640 - Eugene Lee , et al. April 26, 2 | 2016-04-26 |
| Integrated circuit package Grant 9,275,983 - Eugene Lee , et al. March 1, 2 | 2016-03-01 |
| Lead frame with abutment surface Grant 9,184,119 - Eugene Lee , et al. November 10, 2 | 2015-11-10 |
| Integrated Circuit Package App 20150243641 - Eugene Lee; Lee Han Meng@ ; et al. | 2015-08-27 |
| Integrated Circuit Package Fabrication App 20150228581 - Eugene Lee; Lee Han Meng@ ; et al. | 2015-08-13 |
| Lead Frame With Abutment Surface App 20150228563 - Eugene Lee; Lee Han Meng@ ; et al. | 2015-08-13 |
| Multilevel Leadframe App 20150108626 - Eugene Lee; Lee Han Meng@ ; et al. | 2015-04-23 |
| Locking Dual Leadframe For Flip Chip On Leadframe Packages App 20150060123 - EUGENE LEE; LEE HAN MENG @ ; et al. | 2015-03-05 |
| Multilevel Leadframe App 20140346656 - Eugene Lee; Lee Han Meng@ ; et al. | 2014-11-27 |
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