Eto; Takuya

Patent Applications and Registrations

Patent applications and USPTO patent grants for Eto; Takuya.The latest application filed is for "molding die".

Company Profile

0.6.9

Eto; Takuya - Utsunomiya JP
Eto; Takuya - Utsunomiya-shi JP
Eto; Takuya - Ibaraki-shi JP
Eto; Takuya - Ibaraki JP
Eto; Takuya - Osaka JP
Eto; Takuya - Osaka-shi JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Molding die Grant 8,215,947 - Kato , et al. July 10, 2	2012-07-10
Molding Die App 20100303948 - KATO; Takashi ; et al.	2010-12-02
Spherical Sintered Ferrite Particles, Resin Composition For Semiconductor Encapsulation Comprising Them And Semiconductor Devices Produced By Using The Same App 20100193972 - Yamamoto; Kazumi ; et al.	2010-08-05
Epoxy Resin Composition For Semiconductor Encapsulation And Semiconductor Device Using The Same App 20090281225 - ETO; Takuya ; et al.	2009-11-12
Epoxy resin composition for semiconductor encapsulation and semiconductor device using the same Grant 7,501,711 - Eto , et al. March 10, 2	2009-03-10
Epoxy Resin Composition for Semiconductor Encapsulation and Semiconductor Device Using the Same App 20080136048 - Eto; Takuya ; et al.	2008-06-12
Image forming apparatus Grant 7,359,663 - Inui , et al. April 15, 2	2008-04-15
Method for producing epoxy resin composition for semiconductor encapsulation and epoxy resin composition for semiconductor encapsulation and semiconductor device obtained thereby Grant 7,268,191 - Toyoda , et al. September 11, 2	2007-09-11
Epoxy resin composition for semiconductor encapsulation, and semiconductor device using the same Grant 7,265,167 - Akizuki , et al. September 4, 2	2007-09-04
Image forming apparatus App 20070019998 - Inui; Hiroshi ; et al.	2007-01-25
Method for producing epoxy resin composition for semiconductor encapsulation and epoxy resin composition for semiconductor encapsulation and semiconductor device obtained thereby App 20050154152 - Toyoda, Eiji ; et al.	2005-07-14
Sheet transporting device App 20040256787 - Wada, Hiroshi ; et al.	2004-12-23
Automatic document feeder and image forming device Grant 6,814,353 - Kakuta , et al. November 9, 2	2004-11-09
Automatic Document Feeder And Image Forming Device App 20040212138 - Kakuta, Masayuki ; et al.	2004-10-28
Epoxy resin composition for semiconductor encapsulation, and semiconductor device using the same App 20040097632 - Akizuki, Shinya ; et al.	2004-05-20

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