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Patent applications and USPTO patent grants for Esteron; Connie Alagadan.The latest application filed is for "semiconductor die singulation".
Patent | Date |
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Semiconductor Die Singulation App 20210249306 - Esteron; Connie Alagadan ;   et al. | 2021-08-12 |
Semiconductor die singulation Grant 10,991,621 - Esteron , et al. April 27, 2 | 2021-04-27 |
Semiconductor Die Singulation App 20210043512 - Esteron; Connie Alagadan ;   et al. | 2021-02-11 |
Transport packaging and method for expanded wafers Grant 10,811,292 - Esteron , et al. October 20, 2 | 2020-10-20 |
Transport Packaging And Method For Expanded Wafers App 20200083076 - Esteron; Connie Alagadan ;   et al. | 2020-03-12 |
Air Blow For Semiconductor Wafers In A Vacuum Semiconductor Wafer Laminator System App 20180076072 - ESTERON; Connie Alagadan ;   et al. | 2018-03-15 |
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