Estacio; Maria Cristina B.
Patent Applications and Registrations
Patent applications and USPTO patent grants for Estacio; Maria Cristina B..The latest application filed is for "semiconductor die package and method for making the same".
Company Profile
0.29.26
- Estacio; Maria Cristina B. - Lapu-Lapu N/A PH
- Estacio; Maria Cristina B. - Cebu PH
- Estacio; Maria Cristina B. - Relau N/A MY
- Estacio; Maria Cristina B. - Cebu City PH
- Estacio; Maria Cristina B. - Lapulapu City PH
- Estacio; Maria Cristina B. - Lapulapu PH
- Estacio; Maria Cristina B. - Penang MY
- Estacio; Maria Cristina B. - CebuCity PH
Patent Activity
| Patent | Date |
|---|---|
| Semiconductor die package including low stress configuration Grant 9,583,454 - Quinones , et al. February 28, 2 | 2017-02-28 |
| Semiconductor die package and method for making the same Grant 9,159,656 - Jeon , et al. October 13, 2 | 2015-10-13 |
| Flip chip MLP with conductive ink Grant 9,147,627 - Choi , et al. September 29, 2 | 2015-09-29 |
| Semiconductor Die Package And Method For Making The Same App 20140167238 - Jeon; Oseob ; et al. | 2014-06-19 |
| Semiconductor die package and method for making the same Grant 8,664,752 - Jeon , et al. March 4, 2 | 2014-03-04 |
| Pre-molded clip structure Grant 8,513,059 - Cruz , et al. August 20, 2 | 2013-08-20 |
| Semiconductor Die Package And Method For Making The Same App 20120181675 - Jeon; Oseob ; et al. | 2012-07-19 |
| Semiconductor die package and method for making the same Grant 8,183,088 - Jeon , et al. May 22, 2 | 2012-05-22 |
| Semiconductor Die Package Including Low Stress Configuration App 20120083071 - Quinones; Maria Clemens Y. ; et al. | 2012-04-05 |
| Semiconductor die package including low stress configuration Grant 8,106,501 - Quinones , et al. January 31, 2 | 2012-01-31 |
| Pre-molded Clip Structure App 20110272794 - Cruz; Erwin Victor ; et al. | 2011-11-10 |
| Pre-molded clip structure Grant 8,008,759 - Cruz , et al. August 30, 2 | 2011-08-30 |
| Semiconductor die package including exposed connections Grant 7,972,906 - Cruz , et al. July 5, 2 | 2011-07-05 |
| Pre-molded clip structure Grant 7,838,340 - Cruz , et al. November 23, 2 | 2010-11-23 |
| Pre-molded Clip Structure App 20100258924 - Cruz; Erwin Victor ; et al. | 2010-10-14 |
| Semiconductor Die Package And Method For Making The Same App 20100258925 - Jeon; Oseob ; et al. | 2010-10-14 |
| Pre-molded Clip Structure App 20100258923 - Cruz; Erwin Victor ; et al. | 2010-10-14 |
| Pre-molded clip structure Grant 7,768,105 - Cruz , et al. August 3, 2 | 2010-08-03 |
| Semiconductor Die Package Including Low Stress Configuration App 20100148346 - Quinones; Maria Clemens Y. ; et al. | 2010-06-17 |
| Wafer Level Chip Scale Semiconductor Packages App 20100127375 - Galera; Manolito ; et al. | 2010-05-27 |
| Flip Chip Mlp With Conductive Ink App 20100052127 - Choi; Seung-Yong ; et al. | 2010-03-04 |
| Flip chip MLP with conductive ink Grant 7,638,861 - Choi , et al. December 29, 2 | 2009-12-29 |
| Pre-molded Clip Structure App 20080173991 - Cruz; Erwin Victor ; et al. | 2008-07-24 |
| Molded leadless package having a partially exposed lead frame pad Grant 7,315,077 - Choi , et al. January 1, 2 | 2008-01-01 |
| Device And Method For Assembling A Top And Bottom Exposed Packaged Semiconductor App 20070132073 - Tiong; Toong Teik ; et al. | 2007-06-14 |
| Flip chip MLP with conductive ink App 20070132077 - Choi; Seung-Yong ; et al. | 2007-06-14 |
| Semiconductor die package and method for making the same App 20070001278 - Jeon; Oseob ; et al. | 2007-01-04 |
| Method for forming semiconductor device including stacked dies Grant 7,071,033 - Estacio July 4, 2 | 2006-07-04 |
| Flip clip attach and copper clip attach on MOSFET device Grant 7,052,938 - Estacio , et al. May 30, 2 | 2006-05-30 |
| Package and method for packaging an integrated circuit die App 20050275089 - Joshi, Rajeev Dinkar ; et al. | 2005-12-15 |
| Flip clip attach and copper clip attach on MOSFET device App 20050130350 - Estacio, Maria Cristina B. ; et al. | 2005-06-16 |
| Molded leadless package having improved reliability and high thermal transferability, and sawing type molded leadless package and method of manufacturing the same App 20050104168 - Choi, Yoon-hwa ; et al. | 2005-05-19 |
| Flip clip attach and copper clip attach on MOSFET device Grant 6,870,254 - Estacio , et al. March 22, 2 | 2005-03-22 |
| Semiconductor die package processable at the wafer level Grant 6,867,489 - Estacio March 15, 2 | 2005-03-15 |
| Method for making power chip scale package Grant 6,861,286 - Estacio , et al. March 1, 2 | 2005-03-01 |
| Method For Forming Semiconductor Device Including Stacked Dies App 20050001293 - Estacio, Maria Cristina B. | 2005-01-06 |
| Semiconductor die package with semiconductor die having side electrical connection Grant 6,830,959 - Estacio December 14, 2 | 2004-12-14 |
| Multichip module including substrate with an array of interconnect structures Grant 6,806,580 - Joshi , et al. October 19, 2 | 2004-10-19 |
| Semiconductor device including stacked dies mounted on a leadframe Grant 6,777,786 - Estacio August 17, 2 | 2004-08-17 |
| Power chip scale package App 20040130011 - Estacio, Maria Cristina B. ; et al. | 2004-07-08 |
| Multichip Module Including Substrate With An Array Of Interconnect Structures App 20040125573 - Joshi, Rajeev ; et al. | 2004-07-01 |
| Supporting gate contacts over source region on MOSFET devices Grant 6,649,961 - Estacio , et al. November 18, 2 | 2003-11-18 |
| Semiconductor die package including carrier with mask Grant 6,645,791 - Noquil , et al. November 11, 2 | 2003-11-11 |
| Power chip scale package Grant 6,646,329 - Estacio , et al. November 11, 2 | 2003-11-11 |
| Semiconductor die package including carrier with mask App 20030205798 - Noquil, Jonathan A. ; et al. | 2003-11-06 |
| Supporting Gate Contacts Over Source Region On Mosfet Devices App 20030189248 - Estacio, Maria Cristina B. ; et al. | 2003-10-09 |
| MOSFET device with multiple gate contacts offset from gate contact area and over source area Grant 6,617,655 - Estacio , et al. September 9, 2 | 2003-09-09 |
| Semiconductor die package with semiconductor die having side electrical connection App 20030139020 - Estacio, Maria Cristina B. | 2003-07-24 |
| Power chip scale package App 20020171126 - Estacio, Maria Cristina B. ; et al. | 2002-11-21 |
| Semiconductor die package including carrier with mask App 20020155642 - Noquil, Jonathan A. ; et al. | 2002-10-24 |
| Dual stacked die package App 20020125550 - Estacio, Maria Cristina B. | 2002-09-12 |
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