Essig; Kay Stefan

Patent Applications and Registrations

Patent applications and USPTO patent grants for Essig; Kay Stefan.The latest application filed is for "substrate structure, semiconductor package structure and method for manufacturing a substrate structure".

Company Profile

3.8.13

Essig; Kay Stefan - Kaohsiung TW
ESSIG; Kay Stefan - Radebeul DE

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor package structure and method for manufacturing the same Grant 11,437,247 - Essig , et al. September 6, 2	2022-09-06
Substrate Structure, Semiconductor Package Structure And Method For Manufacturing A Substrate Structure App 20220115288 - YEN; You-Lung ; et al.	2022-04-14
Semiconductor Device Package And Method For Manufacturing The Same App 20220037290 - YEN; You-Lung ; et al.	2022-02-03
Semiconductor Package Structure And Method For Manufacturing The Same App 20220020605 - ESSIG; Kay Stefan ; et al.	2022-01-20
Semiconductor device package and method for manufacturing the same Grant 11,145,624 - Yen , et al. October 12, 2	2021-10-12
Semiconductor Package And Manufacturing Process App 20210225746 - APPELT; Bernd Karl ; et al.	2021-07-22
Semiconductor device package and method of manufacturing the same Grant 10,978,312 - Yen , et al. April 13, 2	2021-04-13
Semiconductor Device Package And Method For Manufacturing The Same App 20210028150 - YEN; You-Lung ; et al.	2021-01-28
Semiconductor Device Package And Method Of Manufacturing The Same App 20200350180 - YEN; You-Lung ; et al.	2020-11-05
Semiconductor package device for power device Grant 10,777,478 - Appelt , et al. Sept	2020-09-15
Semiconductor Package And Manufacturing Process App 20190363039 - APPELT; Bernd Karl ; et al.	2019-11-28
Semiconductor Package And Method Of Manufacturing The Same App 20190088506 - APPELT; Bernd Karl ; et al.	2019-03-21
Semiconductor package and semiconductor process Grant 10,217,728 - Appelt , et al. Feb	2019-02-26
Semiconductor package device and method of manufacturing the same Grant 10,186,467 - Appelt , et al. Ja	2019-01-22
Semiconductor package device including microelectromechanical system Grant 10,005,660 - Essig June 26, 2	2018-06-26
Semiconductor device package Grant 9,991,193 - Essig , et al. June 5, 2	2018-06-05
Semiconductor Package And Semiconductor Process App 20180145060 - APPELT; Bernd Karl ; et al.	2018-05-24
Semiconductor Package Device And Method Of Manufacturing The Same App 20180019175 - APPELT; Bernd Karl ; et al.	2018-01-18
Semiconductor Package Device And Method Of Manufacturing The Same App 20180019221 - APPELT; Bernd Karl ; et al.	2018-01-18
Semiconductor Device Package App 20170365542 - ESSIG; Kay Stefan ; et al.	2017-12-21
Semiconductor Package And Method Of Manufacturing The Same App 20160218021 - APPELT; Bernd Karl ; et al.	2016-07-28

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