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name:-0.0051968097686768
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Esquejo; Jovenic Romero Patent Filings

Esquejo; Jovenic Romero

Patent Applications and Registrations

Patent applications and USPTO patent grants for Esquejo; Jovenic Romero.The latest application filed is for "flipchip package with an ic having a covered cavity comprising metal posts".

Company Profile
1.3.4
  • Esquejo; Jovenic Romero - Baguio PH
  • Esquejo; Jovenic Romero - Baguio City PH
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Flipchip package with an IC having a covered cavity comprising metal posts
Grant 11,362,020 - Manack , et al. June 14, 2
2022-06-14
Flipchip Package With An Ic Having A Covered Cavity Comprising Metal Posts
App 20220157698 - Manack; Christopher Daniel ;   et al.
2022-05-19
Solder-metal-solder stack for electronic interconnect
Grant 11,239,190 - Guevara , et al. February 1, 2
2022-02-01
Packaged Semiconductor Device With Electroplated Pillars
App 20210375808 - Mallari; Arvin Cedric Quiambao ;   et al.
2021-12-02
Packaged semiconductor device with electroplated pillars
Grant 11,094,656 - Mallari , et al. August 17, 2
2021-08-17
Solder-metal-solder Stack For Electronic Interconnect
App 20210217718 - Guevara; Rafael Jose Lizares ;   et al.
2021-07-15
Packaged Semiconductor Device With Electroplated Pillars
App 20200211990 - Mallari; Arvin Cedric Quiambao ;   et al.
2020-07-02

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