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Patent applications and USPTO patent grants for Esquejo; Jovenic Romero.The latest application filed is for "flipchip package with an ic having a covered cavity comprising metal posts".
Patent | Date |
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Flipchip package with an IC having a covered cavity comprising metal posts Grant 11,362,020 - Manack , et al. June 14, 2 | 2022-06-14 |
Flipchip Package With An Ic Having A Covered Cavity Comprising Metal Posts App 20220157698 - Manack; Christopher Daniel ;   et al. | 2022-05-19 |
Solder-metal-solder stack for electronic interconnect Grant 11,239,190 - Guevara , et al. February 1, 2 | 2022-02-01 |
Packaged Semiconductor Device With Electroplated Pillars App 20210375808 - Mallari; Arvin Cedric Quiambao ;   et al. | 2021-12-02 |
Packaged semiconductor device with electroplated pillars Grant 11,094,656 - Mallari , et al. August 17, 2 | 2021-08-17 |
Solder-metal-solder Stack For Electronic Interconnect App 20210217718 - Guevara; Rafael Jose Lizares ;   et al. | 2021-07-15 |
Packaged Semiconductor Device With Electroplated Pillars App 20200211990 - Mallari; Arvin Cedric Quiambao ;   et al. | 2020-07-02 |
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