Eshelman; Mark A.
Patent Applications and Registrations
Patent applications and USPTO patent grants for Eshelman; Mark A..The latest application filed is for "semiconductor copper bond pad surface protection".
- Eshelman; Mark A. - Lansdale PA
- Eshelman; Mark A. - Macungie PA
- ESHELMAN, MARK A. - LANDSDALE PA
| Patent | Date |
|---|---|
| Semiconductor copper bond pad surface protection Grant 7,199,475 - Ellis , et al. April 3, 2 | 2007-04-03 |
| Semiconductor copper bond pad surface protection App 20050181191 - Ellis, Timothy W. ; et al. | 2005-08-18 |
| Semiconductor copper bond pad surface protection Grant 6,885,104 - Ellis , et al. April 26, 2 | 2005-04-26 |
| Optical wavelength locker module having a high thermal conductive material Grant 6,724,784 - Cheng , et al. April 20, 2 | 2004-04-20 |
| Optical Wavelength Locker Module Having A High Thermal Conductive Material App 20030193983 - Cheng, Ling ; et al. | 2003-10-16 |
| Semiconductor copper bond pad surface protection App 20020135077 - Ellis, Timothy W. ; et al. | 2002-09-26 |
| Semiconductor copper bond pad surface protection Grant 6,413,576 - Ellis , et al. July 2, 2 | 2002-07-02 |
| Semiconductor Copper Bond Pad Surface Protection App 20020054955 - ELLIS, TIMOTHY W. ; et al. | 2002-05-09 |
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