| Patent | Date |
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Plasma mediated ashing processes that include formation of a protective layer before and/or during the plasma mediated ashing process
Grant 9,128,382 - Berry , et al. September 8, 2 | 2015-09-08 |
Liquid Or Vapor Injection Plasma Ashing Systems And Methods
App 20150136171 - Waldfried; Carlo ; et al. | 2015-05-21 |
Tuning System And Method For Plasma-based Substrate Processing Systems
App 20140263179 - Waldfried; Carlo ; et al. | 2014-09-18 |
Plasma Mediated Ashing Processes That Include Formation Of A Protective Layer Before And/or During The Plasma Mediated Ashing Process
App 20140103010 - Berry; Ivan ; et al. | 2014-04-17 |
Plasma Mediated Ashing Processes
App 20140076353 - Berry; Ivan L. ; et al. | 2014-03-20 |
Plasma Mediated Ashing Processes
App 20120024314 - LUO; SHIJIAN ; et al. | 2012-02-02 |
Plasma Mediated Ashing Processes
App 20110226280 - Berry; Ivan L. ; et al. | 2011-09-22 |
Front End Of Line Plasma Mediated Ashing Processes And Apparatus
App 20100130017 - Luo; Shijian ; et al. | 2010-05-27 |
Apparatus and process for treating dielectric materials
Grant 7,709,814 - Waldfried , et al. May 4, 2 | 2010-05-04 |
Ultraviolet assisted pore sealing of porous low k dielectric films
Grant 7,704,872 - Waldfried , et al. April 27, 2 | 2010-04-27 |
Ultraviolet assisted pore sealing of porous low k dielectric films
Grant 7,678,682 - Waldfried , et al. March 16, 2 | 2010-03-16 |
Ultraviolet assisted porogen removal and/or curing processes for forming porous low k dielectrics
Grant 7,629,272 - Waldfried , et al. December 8, 2 | 2009-12-08 |
Plasma Mediated Ashing Processes That Include Formation Of A Protective Layer Before And/or During The Plasma Mediated Ashing Process
App 20090277871 - Berry; Ivan ; et al. | 2009-11-12 |
Ultraviolet assisted pore sealing of porous low K dielectric films
App 20070134935 - Waldfried; Carlo ; et al. | 2007-06-14 |
Ultraviolet curing process for low k dielectric films
App 20060274405 - Waldfried; Carlo ; et al. | 2006-12-07 |
Plasma ashing process for removing photoresist and residues during ferroelectric device fabrication
Grant 7,078,161 - Waldfried , et al. July 18, 2 | 2006-07-18 |
Apparatus and process for treating dielectric materials
App 20060141806 - Waldfried; Carlo ; et al. | 2006-06-29 |
Ultraviolet assisted pore sealing of porous low k dielectric films
App 20060105566 - Waldfried; Carlo ; et al. | 2006-05-18 |
Fluorine-free plasma curing process for porous low-k materials
Grant 7,011,868 - Waldfried , et al. March 14, 2 | 2006-03-14 |
Ultraviolet assisted porogen removal and/or curing processes for forming porous low k dielectrics
App 20060024976 - Waldfried; Carlo ; et al. | 2006-02-02 |
Ultraviolet curing process for spin-on dielectric materials used in pre-metal and/or shallow trench isolation applications
App 20050272220 - Waldfried, Carlo ; et al. | 2005-12-08 |
Plasma ashing process
Grant 6,951,823 - Waldfried , et al. October 4, 2 | 2005-10-04 |
Plasma curing process for porous low-k materials
Grant 6,913,796 - Albano , et al. July 5, 2 | 2005-07-05 |
Plasma process for removing polymer and residues from substrates
Grant 6,834,656 - Qingyuan , et al. December 28, 2 | 2004-12-28 |
Plasma ashing process for removing photoresist and residues during ferroelectric device fabrication
App 20040157170 - Waldfried, Carlo ; et al. | 2004-08-12 |
Plasma curing of MSQ-based porous low-k film materials
Grant 6,759,098 - Han , et al. July 6, 2 | 2004-07-06 |
Ultraviolet curing processes for advanced low-k materials
Grant 6,756,085 - Waldfried , et al. June 29, 2 | 2004-06-29 |
Drying process for low-k dielectric films
App 20040099283 - Waldfried, Carlo ; et al. | 2004-05-27 |
Plasma ashing process
App 20040084412 - Waldfried, Carlo ; et al. | 2004-05-06 |
Low temperature UV pretreating of porous low-k materials
App 20040058090 - Waldfried, Carlo ; et al. | 2004-03-25 |
Fluorine-free plasma curing process for porous low-k materials
App 20040028916 - Waldfried, Carlo ; et al. | 2004-02-12 |
Ultraviolet curing processes for advanced low-k materials
App 20040018319 - Waldfried, Carlo ; et al. | 2004-01-29 |
Plasma ashing process
Grant 6,630,406 - Waldfried , et al. October 7, 2 | 2003-10-07 |
Fluorine-free plasma curing process for porous low-k materials
App 20030157267 - Waldfried, Carlo ; et al. | 2003-08-21 |
Ultraviolet curing process for porous low-K materials
App 20030054115 - Albano, Ralph ; et al. | 2003-03-20 |
Plasma ashing process
App 20030032300 - Waldfried, Carlo ; et al. | 2003-02-13 |
Plasma process for removing polymer and residues from substrates
App 20020185151 - Qingyuan, Han ; et al. | 2002-12-12 |
Plasma curing process for porous low-k materials
App 20020106500 - Albano, Ralph ; et al. | 2002-08-08 |
Plasma curing of MSQ-based porous low-k film materials
App 20020102413 - Han, Qingyuan ; et al. | 2002-08-01 |
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