Escano; Maricel Fabia
Patent Applications and Registrations
Patent applications and USPTO patent grants for Escano; Maricel Fabia.The latest application filed is for "packaged semiconductor device with electroplated pillars".
- Escano; Maricel Fabia - Angeles PH
- Escano; Maricel Fabia - Angeles City PH
| Patent | Date |
|---|---|
| Solder-metal-solder stack for electronic interconnect Grant 11,239,190 - Guevara , et al. February 1, 2 | 2022-02-01 |
| Packaged Semiconductor Device With Electroplated Pillars App 20210375808 - Mallari; Arvin Cedric Quiambao ; et al. | 2021-12-02 |
| Packaged semiconductor device with electroplated pillars Grant 11,094,656 - Mallari , et al. August 17, 2 | 2021-08-17 |
| Solder-metal-solder Stack For Electronic Interconnect App 20210217718 - Guevara; Rafael Jose Lizares ; et al. | 2021-07-15 |
| Conductive Members For Die Attach In Flip Chip Packages App 20210134750 - MANACK; Christopher Daniel ; et al. | 2021-05-06 |
| Packaged Semiconductor Device With Electroplated Pillars App 20200211990 - Mallari; Arvin Cedric Quiambao ; et al. | 2020-07-02 |
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