Erwin; Brian M.
Patent Applications and Registrations
Patent applications and USPTO patent grants for Erwin; Brian M..The latest application filed is for "finned contact".
Company Profile
17.26.32
- Erwin; Brian M. - Millbrook NY
- Erwin; Brian M. - Lagrangeville NY
- Erwin; Brian M. - Hopewell Junction NY US
Patent Activity
| Patent | Date |
|---|---|
| Integrated circuit tester probe contact liner Grant 11,009,545 - Arvin , et al. May 18, 2 | 2021-05-18 |
| Carrier and integrated memory Grant 10,892,249 - Arvin , et al. January 12, 2 | 2021-01-12 |
| Carrier and integrated memory Grant 10,840,214 - Arvin , et al. November 17, 2 | 2020-11-17 |
| Finned Contact App 20200294946 - Arvin; Charles L. ; et al. | 2020-09-17 |
| Finned contact Grant 10,756,041 - Arvin , et al. A | 2020-08-25 |
| Integrated Circuit Tester Probe Contact Liner App 20200209308 - Arvin; Charles L. ; et al. | 2020-07-02 |
| Integrated circuit tester probe contact liner Grant 10,670,653 - Arvin , et al. | 2020-06-02 |
| Element place on laminates Grant 10,566,275 - Arvin , et al. Feb | 2020-02-18 |
| Carrier and integrated memory Grant 10,515,929 - Arvin , et al. Dec | 2019-12-24 |
| Carrier And Integrated Memory App 20190378816 - Arvin; Charles L. ; et al. | 2019-12-12 |
| Integrated Circuit Tester Probe Contact Liner App 20190353702 - Arvin; Charles L. ; et al. | 2019-11-21 |
| Carrier And Integrated Memory App 20190312009 - Arvin; Charles L. ; et al. | 2019-10-10 |
| Carrier And Integrated Memory App 20190312011 - Arvin; Charles L. ; et al. | 2019-10-10 |
| Carrier And Integrated Memory App 20190312010 - Arvin; Charles L. ; et al. | 2019-10-10 |
| Carrier and integrated memory Grant 10,431,563 - Arvin , et al. O | 2019-10-01 |
| Element Place On Laminates App 20190148283 - Arvin; Charles L. ; et al. | 2019-05-16 |
| Element place on laminates Grant 10,224,269 - Arvin , et al. | 2019-03-05 |
| Security mesh and method of making Grant 9,961,765 - Arvin , et al. May 1, 2 | 2018-05-01 |
| Maskless Selective Retention Of A Cap Upon A Conductor From A Nonconductive Capping Layer App 20180082965 - Erwin; Brian M. ; et al. | 2018-03-22 |
| Maskless Selective Retention Of A Cap Upon A Conductor From A Nonconductive Capping Layer App 20180076160 - Erwin; Brian M. ; et al. | 2018-03-15 |
| Substrate including selectively formed barrier layer Grant 9,754,823 - Brovman , et al. September 5, 2 | 2017-09-05 |
| Substrate including selectively formed barrier layer Grant 9,748,135 - Brovman , et al. August 29, 2 | 2017-08-29 |
| Non-transparent microelectronic grade glass as a substrate, temporary carrier or wafer Grant 9,728,440 - Arvin , et al. August 8, 2 | 2017-08-08 |
| Protection Of Elements On A Laminate Surface App 20170179042 - Arvin; Charles L. ; et al. | 2017-06-22 |
| Element Place On Laminates App 20170179015 - Arvin; Charles L. ; et al. | 2017-06-22 |
| Security Mesh And Method Of Making App 20170171964 - Arvin; Charles L. ; et al. | 2017-06-15 |
| Maskless Selective Retention Of A Cap Upon A Conductor From A Nonconductive Capping Layer App 20170117241 - Erwin; Brian M. ; et al. | 2017-04-27 |
| Under die surface mounted electrical elements Grant 9,601,423 - Arvin , et al. March 21, 2 | 2017-03-21 |
| Security mesh and method of making Grant 9,565,777 - Arvin , et al. February 7, 2 | 2017-02-07 |
| Passivation layer topography Grant 9,466,547 - Arvin , et al. October 11, 2 | 2016-10-11 |
| Coaxial solder bump support structure Grant 9,431,359 - Erwin , et al. August 30, 2 | 2016-08-30 |
| Dual layer stack for contact formation Grant 9,401,336 - Arvin , et al. July 26, 2 | 2016-07-26 |
| Substrate Including Selectively Formed Barrier Layer App 20160204028 - Brovman; Yuri M. ; et al. | 2016-07-14 |
| Laser Ablation System Including Variable Energy Beam To Minimize Etch-stop Material Damage App 20160184926 - Sheets; Courtney T. ; et al. | 2016-06-30 |
| Universal solder joints for 3D packaging Grant 9,343,420 - Erwin , et al. May 17, 2 | 2016-05-17 |
| Dual Layer Stack For Contact Formation App 20160126201 - Arvin; Charles L. ; et al. | 2016-05-05 |
| Non-transparent Microelectronic Grade Glass As A Substrate, Temporary Carrier Or Wafer App 20160118287 - Arvin; Charles L. ; et al. | 2016-04-28 |
| Use of electrolytic plating to control solder wetting Grant 9,324,669 - Arvin , et al. April 26, 2 | 2016-04-26 |
| Use Of Electrolytic Plating To Control Solder Wetting App 20160079193 - Arvin; Charles L. ; et al. | 2016-03-17 |
| Laser Etching System Including Mask Reticle For Multi-depth Etching App 20160074968 - Souter; Matthew E. ; et al. | 2016-03-17 |
| Semiconductor Device Including Passivation Layer Encapsulant App 20160035641 - Erwin; Brian M. ; et al. | 2016-02-04 |
| Semiconductor device including passivation layer encapsulant Grant 9,214,385 - Erwin , et al. December 15, 2 | 2015-12-15 |
| Substrate Including Selectively Formed Barrier Layer App 20150357235 - Brovman; Yuri M. ; et al. | 2015-12-10 |
| Selective Plating Without Photoresist App 20150348910 - Arvin; Charles L. ; et al. | 2015-12-03 |
| Substrate Including Selectively Formed Barrier Layer App 20150348831 - Brovman; Yuri M. ; et al. | 2015-12-03 |
| Organic Coating To Inhibit Solder Wetting On Pillar Sidewalls App 20150333025 - Arvin; Charles L. ; et al. | 2015-11-19 |
| Organic coating to inhibit solder wetting on pillar sidewalls Grant 9,190,376 - Arvin , et al. November 17, 2 | 2015-11-17 |
| Selective Plating Without Photoresist App 20150311161 - Arvin; Charles L. ; et al. | 2015-10-29 |
| Universal Solder Joints For 3d Packaging App 20150235979 - Erwin; Brian M. ; et al. | 2015-08-20 |
| Semiconductor Device Including Passivation Layer Encapsulant App 20140183757 - Erwin; Brian M. ; et al. | 2014-07-03 |
| Redistribution layer (RDL) with variable offset bumps Grant 8,710,656 - Daubenspeck , et al. April 29, 2 | 2014-04-29 |
| Thermal interface material, test structure and method of use Grant 8,686,749 - Erwin , et al. April 1, 2 | 2014-04-01 |
| Redistribution Layer (rdl) With Variable Offset Bumps App 20140021600 - Daubenspeck; Timothy H. ; et al. | 2014-01-23 |
| Coaxial Solder Bump Support Structure App 20130320528 - Erwin; Brian M. ; et al. | 2013-12-05 |
| Thermal Interface Material, Test Structure And Method Of Use App 20110267084 - ERWIN; Brian M. ; et al. | 2011-11-03 |
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