Ertle; Werner
Patent Applications and Registrations
Patent applications and USPTO patent grants for Ertle; Werner.The latest application filed is for "semiconductor wafer with electrically connected contact and test areas".
- Ertle; Werner - Neubiberg DE
| Patent | Date |
|---|---|
| Semiconductor Wafer With Electrically Connected Contact And Test Areas App 20110294238 - Ertle; Werner ; et al. | 2011-12-01 |
| Semiconductor wafer with electrically connected contact and test areas Grant 8,044,394 - Ertle , et al. October 25, 2 | 2011-10-25 |
| Semiconductor structure integrated under a pad Grant 7,190,077 - Bauer , et al. March 13, 2 | 2007-03-13 |
| Semiconductor wafer with electrically connected contact and test areas App 20060097386 - Ertle; Werner ; et al. | 2006-05-11 |
| Method for producing a semiconductor circuit, and corresponding semiconductor circuit App 20050285199 - Stadler, Wolfgang ; et al. | 2005-12-29 |
| Semiconductor structure integrated under a pad App 20050242374 - Bauer, Robert ; et al. | 2005-11-03 |
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