Erlach; David M.
Patent Applications and Registrations
Patent applications and USPTO patent grants for Erlach; David M..The latest application filed is for "debris reducing disk clamp for disk drives".
- Erlach; David M. - Santa Barbara CA
| Patent | Date |
|---|---|
| Debris reducing disk clamp for disk drives Grant 9,536,571 - Sutton , et al. January 3, 2 | 2017-01-03 |
| Debris Reducing Disk Clamp For Disk Drives App 20160247546 - Sutton; Adam D. ; et al. | 2016-08-25 |
| Debris reducing disk clamp for disk drives Grant 9,361,929 - Erlach , et al. June 7, 2 | 2016-06-07 |
| Debris Reducing Disk Clamp For Disk Drives App 20140139950 - Erlach; David M. ; et al. | 2014-05-22 |
| Debris reducing disk clamp for disk drives Grant 8,675,306 - Sutton , et al. March 18, 2 | 2014-03-18 |
| Debris Reducing Disk Clamp For Disk Drives App 20130272107 - Erlach; David M. ; et al. | 2013-10-17 |
| Method and apparatus for applying thin liquid coatings Grant 8,338,283 - Erlach December 25, 2 | 2012-12-25 |
| Removable/disposable apparatus for MEMS particle sorting device App 20120164718 - Bishop; Jamie H. ; et al. | 2012-06-28 |
| System And Method For Providing Access To An Encapsulated Device App 20120015456 - Thompson; Douglas L. ; et al. | 2012-01-19 |
| System and method for providing access to an encapsulated device Grant 8,088,651 - Thompson , et al. January 3, 2 | 2012-01-03 |
| Wafer level hermetic bond using metal alloy with raised feature Grant 7,960,208 - Carlson , et al. June 14, 2 | 2011-06-14 |
| Wafer level hermetic bond using metal alloy with raised feature App 20100003772 - Carlson; Gregory A. ; et al. | 2010-01-07 |
| Wafer level hermetic bond using metal alloy with raised feature Grant 7,569,926 - Carlson , et al. August 4, 2 | 2009-08-04 |
| System and method for providing access to an encapsulated device Grant 7,550,778 - Thompson , et al. June 23, 2 | 2009-06-23 |
| Elastic interface for wafer bonding apparatus Grant 7,533,792 - Erlach May 19, 2 | 2009-05-19 |
| Wafer level hermetic bond using metal alloy App 20080318349 - Erlach; David M. ; et al. | 2008-12-25 |
| System and method for providing access to an encapsulated device App 20070269934 - Thompson; Douglas L. ; et al. | 2007-11-22 |
| Elastic interface for wafer bonding apparatus App 20070181633 - Erlach; David M. | 2007-08-09 |
| Wafer level hermetic bond using metal alloy with raised feature App 20070048898 - Carlson; Gregory A. ; et al. | 2007-03-01 |
| Wafer level hermetic bond using metal alloy App 20070048887 - Erlach; David M. ; et al. | 2007-03-01 |
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