Era; Naohiko

Patent Applications and Registrations

Patent applications and USPTO patent grants for Era; Naohiko.The latest application filed is for "surface-treated metal material, metal foil with carrier, connector, terminal, laminate, shielding tape, shielding material, printed wiring board, processed metal member, electronic device, and method for manufacturing printed wiring board".

Company Profile

0.5.8

Era; Naohiko - Tokyo JP
Era; Naohiko - Ibaraki N/A JP
Era; Naohiko - Hitachi JP
Era; Naohiko - Ibaraki-ken JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Surface-Treated Metal Material, Metal Foil With Carrier, Connector, Terminal, Laminate, Shielding Tape, Shielding Material, Printed Wiring Board, Processed Metal Member, Electronic Device, And Method For Manufacturing Printed Wiring Board App 20160212836 - Arai; Hideta ; et al.	2016-07-21
Cu--Ni--Si--Co copper alloy for electronic materials and method for manufacturing same Grant 8,444,779 - Era , et al. May 21, 2	2013-05-21
Copper alloy for electronic materials Grant 8,317,948 - Era , et al. November 27, 2	2012-11-27
Cu--Ni--Si--Co--Cr copper alloy for electronic materials and method for manufacturing same Grant 8,070,893 - Era , et al. December 6, 2	2011-12-06
Cu-Ni-Si-Co-Cr System Alloy for Electronic Materials App 20110027122 - Era; Naohiko ; et al.	2011-02-03
Cu-Ni-Si SYSTEM ALLOY FOR ELECTRONIC MATERIALS App 20100086435 - Era; Naohiko	2010-04-08
Cu-ni-si-co Copper Alloy For Electronic Materials And Method For Manufacturing Same App 20090301614 - Era; Naohiko ; et al.	2009-12-10
Copper Alloy for Electronic Materials App 20090035174 - Era; Naohiko ; et al.	2009-02-05
Cu-Ni-Si-Co-Cr Copper Alloy for Electronic Materials and Method for Manufacturing Same App 20090025840 - Era; Naohiko ; et al.	2009-01-29
Cu-Ni-Si system copper alloy for electronic materials App 20080175746 - Era; Naohiko ; et al.	2008-07-24
Copper-alloy foil to be used for suspension member of hard-disc drive Grant 6,602,362 - Tomioka , et al. August 5, 2	2003-08-05
Copper-alloy foil to be used for suspension member of hard-disc drive App 20020179198 - Tomioka, Yasuo ; et al.	2002-12-05

uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.

While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.

All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.