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System and method for determining field non-uniformities of a wafer processing chamber using a wafer processing parameter
Grant 10,763,142 - Musselman , et al. Sep | 2020-09-01 |
Spacer profile control using atomic layer deposition in a multiple patterning process
Grant 10,446,394 - Abatchev , et al. Oc | 2019-10-15 |
Spacer Profile Control Using Atomic Layer Deposition In A Multiple Patterning Process
App 20190237330 - Abatchev; Mirzafer ; et al. | 2019-08-01 |
High aspect ratio etch of oxide metal oxide metal stack
Grant 10,242,883 - Guha , et al. | 2019-03-26 |
High Aspect Ratio Etch Of Oxide Metal Oxide Metal Stack
App 20180374712 - GUHA; Joydeep ; et al. | 2018-12-27 |
System, method and apparatus for ion milling in a plasma etch chamber
Grant 9,899,227 - Guha , et al. February 20, 2 | 2018-02-20 |
High aspect ratio etch with combination mask
Grant 9,659,783 - Guha , et al. May 23, 2 | 2017-05-23 |
Systems and Methods for Separately Applying Charged Plasma Constituents and Ultraviolet Light in a Mixed Mode Processing Operation
App 20170040170 - Guha; Joydeep ; et al. | 2017-02-09 |
System And Method For Determining Field Non-uniformities Of A Wafer Processing Chamber Using A Wafer Processing Parameter
App 20160370796 - Musselman; Marcus ; et al. | 2016-12-22 |
High Aspect Ratio Etch With Combination Mask
App 20150200106 - GUHA; Joydeep ; et al. | 2015-07-16 |
High aspect ratio etch with combination mask
Grant 9,018,103 - Guha , et al. April 28, 2 | 2015-04-28 |
High Aspect Ratio Etch With Combination Mask
App 20150087154 - GUHA; Joydeep ; et al. | 2015-03-26 |
System, Method And Apparatus For Ion Milling In A Plasma Etch Chamber
App 20140235056 - Guha; Joydeep ; et al. | 2014-08-21 |
Hardmask Open And Etch Profile Control With Hardmask Open
App 20100327413 - Lee; Jong Pil ; et al. | 2010-12-30 |
Photoresist conditioning with hydrogen ramping
Grant 7,682,480 - Kanarik , et al. March 23, 2 | 2010-03-23 |
Etch profile control
Grant 7,645,707 - Rusu , et al. January 12, 2 | 2010-01-12 |
Process for etching dielectric films with improved resist and/or etch profile characteristics
Grant 7,547,635 - Eppler , et al. June 16, 2 | 2009-06-16 |
Negative bias critical dimension trim
Grant 7,544,521 - Briggs , et al. June 9, 2 | 2009-06-09 |
Multiple frequency plasma processor method and apparatus
Grant 7,405,521 - Dhindsa , et al. July 29, 2 | 2008-07-29 |
Etch with ramping
Grant 7,135,410 - Jacobs , et al. November 14, 2 | 2006-11-14 |
Etch profile control
App 20060226120 - Rusu; Camelia ; et al. | 2006-10-12 |
Photoresist conditioning with hydrogen ramping
App 20060124242 - Kanarik; Keren Jacobs ; et al. | 2006-06-15 |
Photoresist conditioning with hydrogen ramping
Grant 7,053,003 - Kanarik , et al. May 30, 2 | 2006-05-30 |
Photoresist Conditioning With Hydrogen Ramping
App 20060089005 - Kanarik; Keren Jacobs ; et al. | 2006-04-27 |
Variable temperature processes for tunable electrostatic chuck
Grant 6,921,724 - Kamp , et al. July 26, 2 | 2005-07-26 |
Etch with ramping
App 20050070117 - Jacobs, Keren ; et al. | 2005-03-31 |
Multiple frequency plasma etch reactor
App 20050039682 - Dhindsa, Raj ; et al. | 2005-02-24 |
Stepped upper electrode for plasma processing uniformity
Grant 6,824,627 - Dhindsa , et al. November 30, 2 | 2004-11-30 |
Process for etching dielectric films with improved resist and/or etch profile characteristics
App 20030232504 - Eppler, Aaron ; et al. | 2003-12-18 |
Variable temperature processes for tunable electrostatic chuck
App 20030186545 - Kamp, Tom A. ; et al. | 2003-10-02 |
Stepped upper electrode for plasma processing uniformity
App 20020187647 - Dhindsa, Rajinder ; et al. | 2002-12-12 |
Stepped upper electrode for plasma processing uniformity
Grant 6,391,787 - Dhindsa , et al. May 21, 2 | 2002-05-21 |
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